Advertisement
Item Description
Components, parts and materials containing
refractory ceramic fibers
Components, parts and materials containing
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
ScrewDriver
ScrewDriver
Hexagon socket
3.1
Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Remove the power supply and server blade from the Chassis by hand.
2. Remove screw by screw drive, and remove fan assembly from Chassis by hand.
3. Remove screw by screw drive, and remove the midplane assembly.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
Attachment 1 to 4 – Location of PCAs
Attachment 5 – Fan Location
Attachment 6 & 7 – Location of Electrolytic Capacitors
MF877-00
Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at
Notes
Tool Size (if
applicable)
T10,T15
Philips #0,
#1,#2
M7,M8
MF877-01
Quantity
of items
included
in product
0
0
Page 2
Advertisement
