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Performance
Test Item
Performance requirements ⊿R
Resistance
T. C. R.
Overload
Resistance to
soldering heat
Rapid change
of temperature
High temperature
exposure
Damp heat,
Steady state
Load life in
humidity 1
(Applicable to rated ambient
temperature-regulated products)
Load life in
humidity 2
(Applicable to rated ambient
temperature-regulated products)
Durability at rated
ambient
temperature or rated
terminal part temperature
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Within specified tolerance
Within specified T. C. R.
±2 %
Only when it is ERJP03 (D),
P14 (D) : ±0.5 %
D：±0.5 %, F, J：±1 %
±1 %
±1 %
±1 %
±3 %
Only when it is ERJP03 (D),
P14 (D) : ±1 %
±3 %
±3 %
Only when it is ERJP03 (D),
P14 (D) : ±1 %
Anti-Surge Thick Film Chip Resistors
Test conditions
+25 ℃ / +155 ℃ (ERJPA2 : +125 ℃)
ERJPA2, ERJPA3, ERJP08, ERJPM8
ERJP03, ERJP14
270 ℃, 10 s
–55 ℃ (30min.) / +155 ℃ (ERJPA2 : +125 ℃) (30min.)，
100 cycles
+155 ℃, 1000 h
60 ℃, 90 % to 95 %RH, 1000 h
60 ℃, 90 % to 95 %RH, Rated voltage，
1.5 h ON / 0.5 h OFF cycle, 1000 h
85 ℃, 85 %RH, Rated power 10％,
Continuously power, 1000 h
Rated ambient temperature or rated terminal part temperature,
Rated voltage, 1.5 h ON / 0.5 h OFF cycle, 1000 h
20 ℃
ERJP06
: Rated voltag× 1.77, 5 s
: Rated voltag× 2.0, 5 s
: Rated voltag× 2.5, 5 s
29-Sep-23
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