Table of Contents
Advertisement
2-13. REPAIR OF CHIP COMPONENT CIRCUIT BOARD
2-13-1. POINTS OF COMPONENT REMOVAL
Handing of blower type soldering iron
If hot blast is too strong or applied from a slanting
direction, small components and solder near the
component being removed can be blown off. Do not use
blower
type
without
temperature
2-13-2. NOTES ON SOLDERING FOR CHIP COMPONENTS
During soldering a chip component, if a soldering
iron is applied for a long time, the heat may
damage the component or cause pattern peeling.
Do not reuse a removed component. The
characteristics
of such a component
deteriorate.
Use wire solder containing silver (@ 0.3 or @ 0.6).
(The pin electrodes of the laminated chip
capacitor are silver +palladium,
which does not contain silver is used, the silver of
the pin electrode will be sucked into the solder.)
2-13-3. REMOVAL AND MOUNTING OF COMPONENTS
Chip resistor and chip capacitor
Using two soldering irons
l
1) Mounted state
2)Melt the solder.
3)Remove the component.
control.
so if wire solder
1)
Preparation
2) Location
Be careful not to misposition.
3) Tack soldering and flux application
4) Soldering
Wire solder
5) Soldering (Fix the fillet.)
6) Visual inspection
Check for the following defects :
No-soldered part
l
Bridge (to other components or lands)
l
Mispositioning
l
.
Other
defects
Apply the soldering iron to
the chip component and
heat them and
Advertisement
Table of Contents
