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6.3.1 Bare Die Pin Assignment
Pin
3
2
1
Die Thickness:
Pad size:
The analog and digital power and ground of the chip are wired to same substrate or Flex-Pad: V
to V
, and V
DD
7. TSic Block Diagram
ATTSic_E2.1.4 | App Note | Temperature Sensor IC
Name
Description
V
(V
)
Supply Voltage (3 V to 5.5 V)
+
DD
Signal
Temperature Output Signal
Gnd (V
)
Ground
SS
390 µm
68 µm x 68 µm
and V
are wired to Ground. The Signal pin needs only one wire.
SSA
SS
and V
are wired
DDA
DD
14/15
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