Circuit Boards Location - Sony TC-WE825S Service Manual

5-2. CIRCUIT BOARDS LOCATION

SW (C) board
(Except US, Canadian)
SW (A) board
(US, Canadian)
SW (B) board
(Except US,
Canadian)
LEAF SW (A) board
THIS NOTE IS COMMON FOR PRINTED WIRING BOARDS
AND SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is
printed in each block.)
• For printed wiring boards.
• X : parts extracted from the component side.
• : Through hole.
®
• b : Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
: Chip transistor of abbreviation (E, C, B)
•
For schematic diagrams.
• All capacitors are in µF unless otherwise noted. pF: µµF
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in Ω and
specified.
• % : indicates tolerance.
• : internal component.
¢
• 1 : fusible resistor.
• C : panel designation.
Note:
The components identi-
fied by mark ! or dotted
line with mark ! are criti-
cal for safety.
Replace only with part
number specified.
• U : B+ Line.
• V : B– Line.
• H : adjustment for repair.
• Voltage is dc with respect to ground under no-signal
(detuned) condition.
TRANS (A) board
(Except Singapore, Malaysia)
AUDIO (A) board
FL board
LEAF SW (B) board
BCE
1 / W or less unless otherwise
4
Note:
Les composants identifiés par
une marque ! sont critiques
pour la sécurité.
Ne les remplacer que par une
piéce portant le numéro
spécifié.
TRANS (B) board
AUDIO (B) board
no mark : PB (DECK A)
( ) : REC (DECK A)
< > : PB (DECK B)
[ ] : REC (DECK B)
<< >> : STOP
∗
: Impossible to measure
• Voltages are taken with a VOM (Input impedance 10 MΩ).
Voltage variations may be noted due to normal production
tolerances.
• Signal path.
E
: PB (DECK A)
a
: REC (DECK A)
d
: PB (DECK B)
G
: REC (DECK B)
• Abbreviation
CND : Canadian model.
AUS : Australian model.
SP : Singapore model.
MY : Malaysia model.
CH : Chinese model.
– 14 –
MAIN board
DOLBY-S board
(WE825S)
REC VOL board
HEADPHONE board