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Telink Module TLSR825XML32D User
Manual
Keyword:
Features; Pin connection; User manual
Brief:
This is a user manual for Telink 825X Module
TLSR825XDB48.
2019/4/9

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Summary of Contents for TELink 825X

  • Page 1 Telink Module TLSR825XML32D User Manual 2019/4/9 Keyword: Features; Pin connection; User manual Brief: This is a user manual for Telink 825X Module TLSR825XDB48.
  • Page 2 © Telink Semiconductor All Right Reserved Legal Disclaimer This document is provided as-is. Telink Semiconductor reserves the right to make improvements without further notice to this document or any products herein. This document may contain technical inaccuracies or typographical errors. Telink Semiconductor disclaims any and all liability for any errors, inaccuracies or incompleteness contained herein.
  • Page 3: Table Of Contents

    Telink Module TLSR825XML32D User Manual Table of contents Product Introduction ....................3 General description ..................3 Key features ..................... 3 GPIO Pin layout ....................5 Pin Connection Guide ..................... 8 Supply power ....................8 Download firmware ..................9 Test RF signal ....................10...
  • Page 4: Product Introduction

    The TLSR825XML32D supports standards and industrial alliance specifications including Bluetooth Low Energy (up to Bluetooth 5). Telink TLSR825XML32D board can be used for SDK development. Firmware can be directly downloaded to the TLSR825XML32D board to be up and running. 1.2 Key features ...
  • Page 5 Telink Module TLSR825XML32D User Manual Stereo Audio output  6-channel PWM (Pulse Width Modulation) output  6-channel (only GPIO input), 14-bit SAR ADC with 10.5-bit ENOB  4-channel PGA, differential input  Tx output power: Typ. +9.47dBm  RSSI monitoring with +/-1dB resolution...
  • Page 6: Gpio Pin Layout

    Telink TLSR825XML32D User Manual 1.3 GPIO Pin layout Figure 1 Pin layout Pin definition is shown as the Table 1: Table 1 Pin definition Module Pin Name Chip Pin Name Description SPI chip select (Active low) / I2S SPI_CN/I2S_LR/PWM3/PD<2> left right channel select / PWM3...
  • Page 7 Telink TLSR825XML32D User Manual Module Pin Name Chip Pin Name Description Single wire slave/ UART_RTS / SWS/UART_RTS/PA<7> TL_SWS GPIO PA[7] PWM4 output / UART_TX / PWM4/UART_TX/ATSEL2/lc_comp Antenna select pin 2 / Low TL_UTX _ain<1>/sar_aio<1>/PB<1> power comparator input / SAR ADC input / GPIO PB[1]...
  • Page 8 Telink TLSR825XML32D User Manual Module Pin Name Chip Pin Name Description SDM negative output 0 / PWM5 SDM_N0/PWM5/lc_comp_ain<5>/ output / Low power comparator TL_B5 sar_aio<5>/PB<5> input / SAR ADC input / GPIO PB[5] SDM positive output 0 / PWM4 SDM_P0/PWM4/lc_comp_ain<4>/...
  • Page 9: Pin Connection Guide

    Telink Module TLSR825XML32D User Manual 2 Pin Connection Guide 2.1 Supply power The TLSR825XML32D supports supply power via battery. Connect PIN6 (GND) and PIN7 (TL_VDD) of J2 with GND and 3.3V of power, respectively. Figure 2 Connection chart to supply power...
  • Page 10: Download Firmware

    Telink Module TLSR825XML32D User Manual 2.2 Download firmware download firmware into TLSR825XML32D, first make sure TLSR825XML32D is supplied with power normally. That is, connect PIN6 and PIN7 of J2 with GND and 3.3V of power, respectively. Then connect J1 PIN7 (SWS) of the TLSR825XML32D with SWM of a burning EVK.
  • Page 11: Test Rf Signal

    Telink Module TLSR825XML32D User Manual 2.3 Test RF signal To test RF signal of TLSR825XML32D, first make sure the TLSR825XML32D is supplied with power normally. That is, connect PIN6 and PIN7 of J2 with GND and 3.3V of power, respectively.
  • Page 12 3. Integrators Installation Manual 3.1. List of applicable FCC rules This device complies with part 15.247 of the FCC Rules. 3.2. Summarize the specific operational use  conditions Thismodulecanbeusedinelectroniccontrols,industrialapplicationand otherenvironment.ThepowersupplyisDC 3.3V.Theoperating temperaturerangeis-40℃to+85℃.This module using only one kind of antennas with maximum gain is 0 dBi .Other antenna arrangement is not covered by this certification.The antenna is not field replaceable.
  • Page 13 3.7. Label and compliance information The outside of final products that contains this module device must display a label referring to the enclosed module. This exterior label can use wording such as: “Contains Transmitter Module FCC ID: OEOTLSR825XML32D ”,or “Contains FCC ID: OEOTLSR825XML32D ”, Any similar wording that expresses the same meaning may be used.
  • Page 14 c)Iftheinvestigationindicatesacomplianceconcernthehostproduct manufacturerisobligatedtomitigatetheissue. 3.9. Additional testing, Part 15 Subpart B disclaimer   The final host / module combination need to be evaluated against the FCC Part 15B criteria for unintentional radiators in order to be properly authorized for operation as a Part 15 digital device. The host integrator installing this module into their product must ensure that the final composite product complies with the FCC requirements by a technical assessment or evaluation to the FCC rules, including the transmitter operation and should refer to guidance in KDB 996369.
  • Page 15 to enable activity on the communication BUS (i.e., PCIe, SDIO, USB) to ensure the unintentional radiator circuitry is enabled. Testing laboratories may need to add attenuation or filters depending on the signal strength of any active beacons (if applicable) from the enabled radio(s). See ANSI C63.4, ANSI C63.10 and ANSI C63.26 for further general testing details.

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