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Tool Description
Screw driver
Continuous vacuum desoldering system
Desoldering tip
Damp sponge
Flux-cored solder
tweezers
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective
treatment:
1.
Unscrew the screws on pcb 1 and pcb 2,then remove pcb 1 and pcb 2 from front panel 3.
2.
Remove conductive foamfrom 4 from front panel 3.
3.
Remove film 5 from front panel 3.
4.
Remove shielding finger 6 from front panel 3.
5.
All the steps above see Figure 1. Remove the battery from pcb 1,and the detail steps as below:
a) Remove conformal coating (if any) and clean work area of any contamination, oxides, adhesives, residues or
fluxes.
b) Install thermal drive desoldering tip handpiece
c) Start with tip temperature of approximately 315°C and change as necessary
d) Thermal shock tip with damp sponge
e) Tin tip with solder. (See Figure 2.)
f)
Lower tip contacting solder connection.
g) Confirm complete solder melt of contacted lead. (See Figure 3.)
h) For a flat lead, move lead back and forth; for a round lead, use a circular motion and apply vacuum while
continuing lead movement. (See Figures 4&5.)
i)
Lift tip from lead, hold vacuum for an additional 3 seconds to clear all molten solder from heater chamber. (See
Figure 6.)
j)
Repeat for all solder connections.
k) Re-tin tip end with solder and return handpiece to its stand
l)
Lift the component body free of the printed board
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
EL-MF877-00
Template Revision B
Tool Size (if
applicable)
2＃
Page 2
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