Table of Contents
Advertisement
TABLE OF CONTENTS
1.
2.
..................................................................
3.
3-1. Disassembly Flow ........................................................... 12
3-2. Mini Fuse (Blade Type) (10A/32V) (FU1), Cover ......... 12
3-3. Sub Panel Block .............................................................. 13
3-4. CD Mechanism Deck (MG-101CA-188) ....................... 13
3-5. MAIN Board ................................................................... 14
3-6. SERVO Board ................................................................. 14
3-7. Chassis (T) Sub Assy ...................................................... 15
3-8. Roller Arm Assy .............................................................. 15
3-9. Chassis (OP) Assy ........................................................... 16
3-10. Chucking Arm Sub Assy ................................................. 16
3-11. Sled Motor Assy .............................................................. 17
3-12. Optical Pick-up Section .................................................. 18
3-13. Optical Pick-up ............................................................... 18
4.
4-1. Block Diagram - SERVO Section - ................................ 19
4-2. Block Diagram - MAIN Section - ................................... 20
- PANEL, POWER SUPPLY Section - ........................... 21
4-4. Schematic Diagram - MAIN Section (1/5) - ................... 23
4-5. Schematic Diagram - MAIN Section (2/5) - ................... 24
4-6. Schematic Diagram - MAIN Section (3/5) - ................... 25
4-7. Schematic Diagram - MAIN Section (4/5) - ................... 26
4-8. Schematic Diagram - MAIN Section (5/5) - ................... 27
4-9. Printed Wiring Board - MAIN Section (1/2) - ................ 28
4-10. Printed Wiring Boards - MAIN Section (2/2) - .............. 29
4-11. Printed Wiring Board - KEY Board -.............................. 30
4-12. Schematic Diagram - KEY Board - ................................ 31
5.
5-1. Main Section ................................................................... 40
5-2. Front Panel Section ......................................................... 41
5-3. CD Mechanism Deck Section (MG-101CA-188) .......... 42
6.
Accessories are given in the last of the electrical parts list.
.............................................
.............................. 43
CDX-GT575UE/GT575UI/GT575UP
SERVICING NOTES
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
3
The laser diode in the optical pick-up block may suffer electro-
static break-down because of the potential difference generated by
6
the charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The fl exible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
Never look into the laser diode emission from right above when
checking it for adjustment. It is feared that you will lose your sight.
If the optical pick-up block is defective, please replace the whole
optical pick-up block.
Never turn the semi-fi xed resistor located at the side of optical
pick-up block.
semi-fixed resistor
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
•
Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
•
Strong viscosity
Unleaded solder is more viscous (sticky, less prone to fl ow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
•
Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
SECTION 1
optical pick-up
3
Advertisement
Table of Contents
