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Oxford Instruments ANDOR Sona User Manual

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Sona and Marana-11
1.6 rev 15 December 2022
User Guide
For model: 4.2B-11, 2.0B-11
Andor Technology 2022

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Summary of Contents for Oxford Instruments ANDOR Sona

  • Page 1 Sona and Marana-11 1.6 rev 15 December 2022 User Guide For model: 4.2B-11, 2.0B-11 Andor Technology 2022...
  • Page 2 Section 1 - Safety and Warning Information Caution PLEASE READ THIS INFORMATION FIRST BEFORE USING YOUR PRODUCT  1. If the equipment is used in a manner not specified by Andor, the protection provided by the equipment may be impaired.  2. Do not position this product so that it is difficult to operate the mains disconnecting device.
  • Page 3  10. No parts should be replaced by the customer, except for the mains cables or the fuse, which must be of the same type and rating as that supplied and as specified in or "Fuse Replacement" on page 85, and certified in accordance with your region’s safety regulations.
  • Page 4 electromagnetic or radioactive devices, plasma sources, arc welders, x-ray instruments, intense pulsed sources, or other similar sources of high energy fields whose emissions are not within the normal range expected under the EU EMC Directive.  20. Ionising Radiation: Please note that this product is not designed to provide protection from ionising radiation.
  • Page 5 1.1    Label Symbols EU CE Mark by which we indicate that this product meets the requirements all the relevant EU Product Directives that require this mark, including the Low Voltage Directive for safety (as this product is manufactured in North- ern Ireland, it does not require the UKCA Mark) EU WEEE (Waste Electrical and Electronic Equipment) Mark which indicates that this should not be disposed of in domestic waste but at a suitable...
  • Page 6 1.2    Unpacking Information Carefully unpack the unit and retain the packaging materials to transport or return equipment if required:   If the equipment appears damaged in any way, return it to sales outlet in its original packaging.   No responsibility for damage arising from the use of non-approved packaging will be accepted.
  • Page 7 1.3    Revision History Version Released Description 04 Sep 2018 Initial Release 11 Apr 2019 Updated USA and Asia-Pacific addresses Updated altitude information on page 46, updated backplate 19 Jun 2019 images and mechanical drawings for Marana. USB terminology amended throughout. Updated China office address, table on page 39 and power supply 29 July 2019 information...
  • Page 8 1.4    Updates to the Manual Changes are periodically made to the product, and these will be incorporated into new editions of the manual. Please check for new releases of the manual at: andor.oxinst.com/downloads. If you find an issue in this manual, please contact your customer support representative with a description of the issue.
  • Page 9 Section 2 - Introduction This manual provides an overview of the Sona and Marana camera series. The Sona and Marana feature the latest back-illuminated sCMOS sensor technology for an exceptional sensitivity, speed and field of view. This makes it particularly suitable for demanding applications - Sona for life science imaging: such as live- cell imaging, embryo imaging;...
  • Page 10 2.1    Technical Support If you have any questions regarding the use of this equipment, please contact the representative from whom your system was purchased, or:     Europe Andor Technology Andor Technology 7 Millennium Way 300 Baker Avenue Springvale Business Park Suite # 150 Belfast Concord...
  • Page 11 2.2    Copyright and Protective Notices The copyright in this document and the associated drawings are the property of Andor Technology Ltd. and all rights are reserved. This document and the associated drawings are issued on condition that they are not copied, reprinted or reproduced, nor their contents disclosed.
  • Page 12 2.3    Disclaimer THE INFORMATION CONTAINED HEREIN IS PROVIDED “AS IS” WITHOUT WARRANTY, CONDITION OR REPRESENTATION OF ANY KIND, EITHER EXPRESS, IMPLIED, STATUTORY OR OTHERWISE, INCLUDING BUT NOT LIMITED TO, ANY WARRANTY OF MERCHANTABILITY, NON-INFRINGEMENT OR FITNESS FOR A PARTICULAR PURPOSE. IN NO EVENT SHALL ANDOR BE LIABLE FOR ANY LOSS OR DAMAGE, WHETHER DIRECT, INDIRECT, SPECIAL, INCIDENTAL, CONSEQUENTIAL OR OTHERWISE HOWSOEVER CAUSED WHETHER ARISING IN CONTRACT TORT OR OTHERWISE,...
  • Page 13 2.4    Trademarks and Patent Information Andor, Sona and Marana-11 and the Andor logo are trademarks of Andor Technology Ltd. Andor Technology Ltd. is an Oxford Instruments company. All other marks are property of their owners. Manufacturers Information Andor Technology Ltd., Belfast, BT12 7AL, UK.
  • Page 14 2.5    Supplied Components The standard components supplied with the Sona and Marana-11 are shown below: Table 1:Supplied components. Description Quantity Sona or Marana back illuminated sCMOS Camera (model as ordered) Description Quantity Description Quantity Power Supply Software 1 x 15 V (if ordered) CoaXPress Card Power cable...
  • Page 15 Description Quantity Description Quantity Anti-static wrist Performance band Sheet Coolant pipes User Guide (elec- (hose inserts, pair) tronic copy) Version 1.6 15 December 2022...
  • Page 16 2.6    Camera Model Options There are a number of models of Sona and Marana-11 camera based off of a common architecture and shared design. The differences for each model can be identified from the product codes and descriptions outlined below: Table 2:Model options.
  • Page 17 2.7    Optional Components There are a range of optional and additional accessories available for Sona and Marana-11 including: Table 3:Optional components. Description Order Code MCU- MCU with 2x magnification for matching Sona to Leica microscopes SONA-LEI MCU- MCU with x2 magnification for matching Sona to Nikon Ti Series (TiE and Ti2) micro- SONA-NIK- scopes MCU-...
  • Page 18 Section 3 - Product Overview This section provides an overview of the main features of the Sona and Marana- 11. Please note that Sona configuration is shown below which will also cover the Marana model. Please refer to the additional information supplied for details of any model specific differences.
  • Page 19 Four M4x 0.7 -6H, 8.0 [0.31] deep mounting holes on the front face (see "Mounting the Camera using the Mounting Flange" on page 32). Version 1.6 15 December 2022...
  • Page 20 3.1    Rear Panel USB Connectivity USB 3 connection provides a robust high speed connection to the control PC. CoaXPress Connectivity CoaXPress connectivity, available on upgraded models only, provides a robust, high speed, 2-lane connection to the control PC. External I/O: TTL / Logic The TTL/Logic connection permits connection to other devices for synchronisation and control of fire, trigger and shutter operations.
  • Page 21 3.1.1    Multi I/O Timing Cable Pin Outs Table 4:Pinouts for the 15-way D type connector Available using standard 3-way cable Available using optional 7-way cable 3-way 7-way 3-way cable 7-way cable cable cable Reserved Reserved AUX_OUT_1 Reserved AUX_OUT_1 Reserved Reserved Reserved FIRE n Reserved...
  • Page 22   Optional 7-way multi I/O timing interface cable (Andor part number ACC- ACZ-05612) gives access to all of the above I/O functions shown in the table above right (excluding Ground and Reserved pins).   Reserved pins should not be used. * using optional 7-way multi I/O timing cable only Version 1.6 15 December 2022...
  • Page 23 3.1.2    Impedance Information Figure 3:Sona and Marana-11 connection impedance information Version 1.6 15 December 2022...
  • Page 24 3.2    Cooling Hose Connectors There are two connectors to allow connection of Liquid Cooled Sona and Marana-11 models to a water cooler or re-circulator. Hose inserts are provided to enable connection to coolant hoses. On Sona and Marana the cooling hose connectors are available on the "Rear Panel"...
  • Page 25 3.3    Camera based Super Resolution (SRRF-Stream+) Certain Andor cameras including Sona have been developed to enable super- resolution imaging to be achieved using a normal microscope. This technology is called SRRF-Stream+. It is a cell friendly and easy to use approach to achieving sub-diffraction limited resolutions.
  • Page 26 Section 4 - Installation Caution Prior to commencing installation, the user should refer to the safety and warning information and unpacking instructions at the beginning of this manual. Due care must be taken when lifting the camera. Ensure that the mounting and connected assembly is secure and able to support the weight of the camera.
  • Page 27 4.1    Transport and Storage   The camera is packed in normal transport packaging for shipping.   Allow the product to reach the ambient temperature after unpacking- especially if moving from a colder environment to a warm environment as this may lead to condensation. Storage  ...
  • Page 28 4.1.1    Using Lens Mount Adaptors An F-mount lens mounting system is present on the 4.2B-11 models, and a C-mount is present on the Sona/Marana 2.0B-11 model. Version 1.6 15 December 2022...
  • Page 29 4.1.2    C-Mount Replacement Note C-Mount - Uses the inner set of mounting points Figure 4:Inner mounting point locations Removing the C-mount Note The use of nitrile gloves is recommended, when removing the C-Mount due to the proximity of the window.  1.
  • Page 30 4.1.3    F-Mount and T-Mount Adaptors Note F-Mount and T-mounts- Use the inner set of mounting points see "Inner mounting point loc- ations" on the previous page Removing the F/T-mount  1. Place the camera on its side (to prevent debris and dust landing on the window).
  • Page 31 4.1.4    Using a Magnifying Coupler Unit A magnifying coupler (e.g. Andor MCU) or lens tube may be used to match the large area sensor to the objective magnification and the aperture that is available from the microscope. These attach to the camera using a T-mount style connection (described in "F-Mount and T-Mount Adaptors"...
  • Page 32 4.1.5    Mounting the Camera using the Mounting Flange The camera mounting face features 4 off M4x0.7 -6H tapped holes x8.0 [0.31] deep. These can be used to secure the camera to an appropriate mounting as an alternative to using the lens mounts. Caution The weight of the camera is approx.2.7 kg ensure that the mounting and the system it is con- nected to provides adequate support.
  • Page 33 4.2    Connecting a Cooling System The camera can use either air cooling to cool to 15 C or -25 C, or optional liquid cooling for deeper cooling to -45 The camera will default to a Fan Setting of “Low” and will set the sensor temperature to 15 C as default following its initialisation (Audible double beep).
  • Page 34   Coolant Hose Inserts: Two barbed coolant hose inserts (replacement part code 6MM-HOSE-BARBS) are supplied as standard, suitable for connection to 6 mm [0.25”] internal diameter soft PVC tubing / hose.   Recommended tubing: 10 mm [0.4”] outside diameter, i.e. a wall thickness of 2 mm [0.08”].
  • Page 35 4.3    Coolant Recommendations • Coolant temperature: Refer to the temperatures specified in Technical Specifications. Note that cooling performance may be affected by distance between camera head and cooler. • Recommended coolant: water or water/glycol mix depending on the ambient environmental temperature during operation. De-ionized water (without additives) may be used as the coolant.
  • Page 36 4.3.1    Connecting the Coolant Hoses  1. Press the hose connector into the connection on the camera head, ensure it clicks into place and repeat for the second hose.  2. Confirm the hoses are connected securely by applying pressure on the top front of the camera body and pulling backwards on the hoses.
  • Page 37 4.3.2    Disconnecting the Coolant Hoses  1. Press the latch on the camera hose connection away from the hose.  2. Hold the latch in and pull the hose backwards.  3. The hose should release from the camera connection with little resistance. Note If the hose does not release, ensure that the latch on the camera connection is pressed in fully.
  • Page 38 4.4    Connecting the Camera to the PC The camera connects to a PC via USB 3 or via CoaXPress that provides a standard, robust and high-speed connection with the control PC. It is recommended to use the supplied PCle card as this will ensure consistent performance. Other ports on the PC may share bandwidth with other devices and peripheral components.
  • Page 39 4.4.1    Installing the USB 3 Card or CXP Card in the PC (if required) Note Camera operation with PCIe cards not supplied by Andor cannot be guaranteed. Figure 7:Left USB PCle connection. Right CoaXPress PCle connection.  1. Unplug all cables from the rear of the computer  2.
  • Page 40 4.4.2    Connecting the Camera to the PCIe Card 4.4.2.1    Connecting via USB Connect the USB cable from the camera to the appropriate PCIe card on the control PC. 4.4.2.2    Connecting via CoaXPress Connect the 2 Lane CoaXPress cable from the camera to the CXP (PCIe) card on the control PC 4.4.2.3    Connecting the Camera to the Power Supply Connect the mains power cable between the camera power input (15 V DC) and...
  • Page 41 4.5    Installing Software and Drivers Version 1.6 15 December 2022...
  • Page 42 4.5.1    Minimum Computer Requirements   3.0 GHz single core or 2.4 GHz dual or quad core processor   4 GB RAM   Hard drive: 850 MB/sec write speed recommended for the data rate associated with the max. frame rates. 100 MB free hard disc to install software  ...
  • Page 43 4.5.2    Installing Software or Drivers The same instructions cover the installation procedure for Andor’s Solis software or Andor’s SDK, which is used in conjunction with third party software. If you are planning to run your camera through a third party interface you will require the Andor Drivers, called Software Development Kit (SDK).
  • Page 44 4.5.3    New Hardware Wizard When the Sona and Marana-11 camera is connected to a PC for the first time, the New Hardware Wizard screen will appear.  1. Select the ‘No, not this time only’ option then click Next>.  2. Select the ‘Install from a list or specified location (Advanced) option then click Next>.
  • Page 45 4.5.4    Checking & Setting BIOS options (for PCs not supplied by Andor) Enter the BIOS menu when starting PC. For Dell workstations, press F12 at start-up and select System Setup in the One Time Boot Menu. For Dell workstations 3 options in the Performance menu of the BIOS need to be checked/set:  ...
  • Page 46 Section 5 - Operation Caution IF THE EQUIPMENT IS USED IN A MANNER NOT SPECIFIED BY ANDOR OR ITS DISTRIBUTORS, THE PROTECTION PROVIDED BY THE EQUIPMENT MAY BE IMPAIRED. PLEASE READ THE USER GUIDES SUPPLIED WITH YOUR SYSTEM COMPONENTS AND CAMERA CONTROL SOFTWARE PRIOR TO USE.
  • Page 47 5.1    Emergency Mains Disconnection In case of emergency, the disconnecting point of the equipment is the mains power cord connected to the external power supply, or the mains socket switch. WARNING SWITCH OFF THE POWER AT THE MAINS SOCKET AND REMOVE THE MAINS LEAD FROM THE EXTERNAL POWER SUPPLY Version 1.6 15 December 2022...
  • Page 48 5.2    Power Up Sequence  1. Ensure that the camera is powered on at the mains power supply. (There is an ON/OFF switch on the backplate of the camera).  2. Ensure that the USB or CXP cable is connected between the camera and the  3.
  • Page 49 5.3    Power Down Sequence  1. Exit the camera control software.  2. Switch the camera off using the switch on the rear panel .  3. If not using the camera for some time, disconnect from the mains power socket. Version 1.6 15 December 2022...
  • Page 50 5.4    Using the Camera Once set-up the camera is controlled through the camera control software. Please refer to the information supplied with the camera control software (available separately) for further details e.g. Andor Solis or SDK3. Some important features and concepts are outlined in the following sections. Version 1.6 15 December 2022...
  • Page 51 5.5    sCMOS Structure and Operation sCMOS technology has been developed specifically to overcome many of the limitations that have marred other scientific detector technologies, resulting in an imaging detector that provides exceptional performance for many applications. As illustrated above, the CMOS sensor is an “Active Pixel Sensor” (APS) whereby each pixel has its own integral amplifier and the sequence of operation is as follows:  1.
  • Page 52 Notes The diagram, above is representative - the light sensitive area is contiguous as the photodiodes for each pixel are buried within the sensor. Each pixel also has a microlens to maximize sensitivity to light. For Rolling Shutter mode operation, pixels in each row are exposed and the charge converted to a voltage simultaneously before being digitized then read out sequentially.
  • Page 53 5.6    Dual Amplifier Dynamic Range The Dual Amplifier architecture of the sCMOS sensor in Sona and Marana-11 eliminates the need to choose between low noise or high capacity, in that signal can be sampled simultaneously by both high gain and low gain amplifiers. As such, the lowest noise of the sensor can be harnessed alongside the maximum well depth, affording the widest possible dynamic range.
  • Page 54 Figure 8:Amplifiers and ADC of the sCMOS Sensor The dual column level amplifier/ADC pairs have independent gain settings, and the final image ("High contrast image of fixed labeled cell. Intensity line profile through single row demonstrates pixel regions that were sampled by high gain (low noise) and low gain (high capacity) amplifiers."...
  • Page 55 stream. The gain corrects for pixel to pixel relative sensitivity, pixel node amplifier and the high and low amplifier relative gains  4. The pixels are then combined into a single 16-bit image for transfer to the PC The user maintains the choice of opting to stay with 12-bit single gain channel data if dynamic range is not critical, resulting in smaller file sizes.
  • Page 56 5.7    Imaging Modes Sona and Marana provide an exceptional dynamic range on account of the combination of low noise floor and high signal handling provided by the large well depth capacity. A dual amplifier architecture is utilised to enable both low noise, and maximum well depth to be used simultaneously.
  • Page 57 5.7.1    Sona and Marana-11 Maximum Frame rates Max Frame Rate (fps) Marana and Sona 4.2B-11 Sona 2.0B-11 model ROI Size (W x H) 16-bit 12-bit 16-bit 12-bit 2048 x 2048 1608 x 1608 1400 x 1400 1200 x 1200 1024 x 1024 512 x 512 256 x 256 128 x 128...
  • Page 58 5.7.2    Using ROIs (AOIs) Region of Interest (ROI) also called Area of Interest (AOI) can be selected so that only a defined region of the sensor is used. When a sub image has been defined, only data from the selected rows will be digitized. This smaller “cropped”...
  • Page 59 5.8    Understanding Read Noise in sCMOS sCMOS technology boasts an ultra-low read noise floor that significantly exceeds that of even the best CCDs, and at several orders of magnitude faster pixel readout speeds. For those more accustomed to dealing with CCDs, it is useful to gain an understanding of the nature of read noise distribution in CMOS imaging sensors.
  • Page 60 5.8.1    Binning Binning is a process used for both CCD and sCMOS sensors in which the signal for a number of pixels is combined into a single array with a single signal output. For CCD sensors combining the charge from arrays of pixels e.g. 4 pixels (2x2 binning) into single larger “super-pixels”...
  • Page 61 5.8.2    Spurious Noise Filter The Spurious Noise filter corrects for pixels that would otherwise appear as spurious ‘salt and pepper’ noise spikes in the image. The appearance of such noisy pixels is analogous to the situation of Clock Induced Charge (CIC) noise spikes in EMCCD cameras, in that the overall noise of the sensor has been reduced to such a low level, that the remaining small percentage of spurious, high noise pixels can become an aesthetic issue.
  • Page 62 5.8.3    Blemish Correction Filter This Blemish Correction filter identifies and compensates for three types of blemishes during the FPGA processing step:  1. Hot pixels  2. Noisy pixels  3. Unresponsive pixels sCMOS sensors are particularly susceptible to hot pixel blemishes. These are spurious noise pixels that have significantly higher darkcurrent than the average.
  • Page 63 5.9    Rolling Shutter The Sona and Marana function in what is termed Rolling Shutter operation. This describes the sequence in which the lines of the pixels are read from the sensor array in a “rolling wave” effect. In Rolling Shutter, adjacent rows of the array are exposed at slightly different times as the readout waves sweep through the sensor.
  • Page 64 Note: Rolling Shutter enables readout speeds to be maximised and the noise minimised - however a potential complication of this readout type is spatial distortion. This was more commonly associated with older CMOS Exposure Start Exposure Readout camcorders were the image readout rate was not fast enough to keep up with a panned image.
  • Page 65 5.9.1    Rolling Shutter Mechanisms In Rolling Shutter mode, charge transfer happens on a per row basis whilst in global shutter charge transfer happens for the whole sensor or globally. To read out a pixel in Rolling Shutter mode, the following occurs within the analog circuitry:  1.
  • Page 66 5.10    Trigger Modes The Sona and Marana-11 camera has the following triggering modes:   Internal Trigger - the camera determines the exact time when an exposure happens based on the acquisition settings entered by the user. This is the most basic trigger mode and requires no external intervention.  ...
  • Page 67 Note ‘Row 1’ is the first row read out in the image frame. ‘Row n’ is the last row read out in the image frame. The trigger diagrams in the following sections are for outlining the events and timing of outputs in the various trigger modes and not to scale.
  • Page 68 5.10.1    Software Acquisition Events Software Acquisition Events are only accessible via SDK- these are not available in Solis, Fusion, iQ or other software but may be used internally. Refer to the SDK3 manual for further information on configuration of Software Acquisition Events. If Acquisition Events are not used, the user must wait until the image frame has been completely transferred to the PC before they receive any notification that the exposure has completed.
  • Page 69 5.10.2    Signal Information The Rolling Shutter signals in the diagrams are as follows:   FIRE: (Exposure for Row 1): In Rolling Shutter mode, the FIRE output from the camera indicates to the user the exposure time for the first row  ...
  • Page 70 5.10.3    Timing Parameters and Ext Triggering The timing tables accompanying each of the triggering diagrams that follow indicate the exposure and cycle times achievable in each triggering mode for the Sona and Marana-11. These are based on Frame and Row Periods as shown below.
  • Page 71 5.10.4    Rolling Shutter Internal Triggering (Non-Overlap Mode) Internal Trigger Mode allows the user to configure an exposure time and cycle time. For Internal Triggering Non-overlap mode, the exact acquisition sequence depends on the exposure time and cycle time set . The following diagrams show the behaviour of TTL outputs ‘Fire’, Fire n’, ‘Fire ALL’...
  • Page 72 Figure 13:Internal triggering “long” (non-overlap) Parameter Minimum Maximum Exposure 1 Row 30 s Cycle Time (1/Frame Rate) Exposure + 1 Frame + 1 Row 44,000 s   Note Actual minimum Exposure time is 15 μs in 12-bit mode and 9.48 μs in 16-bit mode. The exposure time is incremented in 1 Row time steps Version 1.6 15 December 2022...
  • Page 73 5.10.5    Rolling Shutter Internal Triggering (Overlap Mode) Internal Triggering in Overlap Mode allows the user to perform an exposure and acquire images from the sensor simultaneously. This is achieved by starting a new exposure for a new frame while the current frame’s exposure is being read out from the sensor.
  • Page 74 Figure 15:Internal Triggering “long” (overlap) Parameter Minimum Maximum Exposure 1 Row 30 s Greater of: Cycle Time (1/Frame Rate) 1 Frame + 1 Row or Exposure time + 1 Row FIRE Any low period ~5 μs in 12-bit and ~10 μs in 16-bit (1 Row) Version 1.6 15 December 2022...
  • Page 75 5.10.6    Rolling Shutter External Triggering (Non Overlap Mode) In this section, both External and Software Trigger are described in the same diagram as the acquisition sequence is the same. The trigger event can either be from the EXT Trigger input or sent via software. The ARM signal is asserted to indicate it is ready to detect an incoming trigger input.
  • Page 76 Figure 17:External Triggering “long” (non-overlap) Parameter Minimum Maximum Exposure 3 Rows 30 s Cycle Time (1/Frame Rate) Exposure + 1 Frame + 1 Row External Start Delay 1 Row EXT Trig Pulse Width 6.6 ns   Version 1.6 15 December 2022...
  • Page 77 5.10.7    Rolling Shutter External Exposure Triggering (Non-Overlap Mode) On detection of the trigger event a reset read out is initiated, this effectively begins a new exposure. When the external trigger input goes LOW, a signal frame read out phase begins. When the frame has been read out completely, the Arm goes high and the camera waits for the next trigger event to be detected.
  • Page 78 Parameter Minimum Maximum EXT Trig Pulse Width 2 Rows 30 s Version 1.6 15 December 2022...
  • Page 79 5.10.8    Rolling Shutter External Exposure Triggering (Overlap Mode) In overlap mode, every positive edge of an external trigger will trigger a frame read out and start a new exposure for the next frame. The period of external trigger pulse defines exposure and cycle time for each frame read out. On detection of the positive edge a frame read out is initiated at the start of the next Row read period.
  • Page 80 5.10.9    Rolling Shutter External Start Triggering In this mode the camera will wait for a single external trigger event. Once this external trigger event is detected, the camera will progress as if the camera was in internal trigger mode (see "Rolling Shutter Internal Triggering (Overlap Mode)"...
  • Page 81 5.10.10     Rolling Shutter Triggering Constraints The table below shows a summary of constraints when operating in Rolling Shutter mode: Table 8:Rolling Shutter Mode Triggering Constraints Min Trig- Fast Exposure Exposure Rolling Shutter Triggering Modes Trigger ger Pulse Switching Sup- Range Jitter Width...
  • Page 82 Section 6 - Maintenance Caution There are no user-servicable parts inside the camera. Damage caused by unauthorised maintenance or procedures will invalidate the warranty. Version 1.6 15 December 2022...
  • Page 83 6.1    Regular Checks   The state of the product should be checked regularly, especially the integrity of the External Power Supply and the mains cable.   Ensure that the AC mains plug in connection to building power outlet remains readily accessible to facilitate disconnection from the power supply.  ...
  • Page 84 6.2    General Cleaning & Decontamination Inform- ation   The product body can be cleaned with a soft cloth and dampened by water or glass cleaner.   Never spray liquids directly on the product; apply cleaning solution to the cloth, then wipe the product body with the dampened cloth.  ...
  • Page 85 6.3    Fuse Replacement In the U.K., Ireland and some other countries, the supplied mains cable has a BS 1363/A (also known as ITA Type G) plug that includes an integrated fuse. Only replace with fuse of the same type and rating for continued protection. The characteristics of a replacement fuse are as follows:  ...
  • Page 86 6.4    Annual Electrical Safety Checks   It is advisable to check the integrity of the insulation and protective earth of the product on an annual basis, e.g. U.K. PAT testing. However over time the repetition of dielectric strength tests can damage safety insulation.  ...
  • Page 87 6.5    Cleaning the Camera Window At some point, it may become necessary to clean debris that may have settled on the sCMOS imaging sensor window. Cleaning the camera window can provide effective results providing you carefully follow these step-by-step directions. Caution Only open the shutter (if present) using camera control software.
  • Page 88 • A clean source of compressed air such as an air can is recommended- do not use a compressor that may spray fine droplets of oil, or an unfiltered air supply that may spray dust particles onto the camera window.  3.
  • Page 89 6.6    Cooling Hoses and Connections The user should routinely check all coolant hoses and connections for signs of leakage, damage or wear. All seals must be intact before powering on camera system and any worn / damaged items must be replaced immediately. Version 1.6 15 December 2022...
  • Page 90 Section 7 - Troubleshooting Preventing Condensation   Take special care during installation as the temperature of the camera may be low from shipping or storage. When moved to a warmer environment such as a lab, there is a higher risk of condensation forming. Therefore, ensure that sufficient time is allowed for the product to reach the ambient temperature of the operating environment before use (this may take several hours).
  • Page 91 Fault Cause Solution Camera buzzer does Ensure that power is connected to the cam- Communication error. not sound on era and the On/Off switch is set to On start-up. Camera not switched on. Ensure the camera is switched on. Check that USB cable is connected Camera is not USB cable not connected.
  • Page 92 Fault Cause Solution Liquid cooling system not func- Check cooling system. tioning correctly Ensure that the camera has reached target Camera The sensor must cool down to the temperature before acquiring images. image quality target temperature before sci- not as expec- entific grade images are taken.
  • Page 93 Appendix The following sections contain information on product specifications, including technical, environmental, mechanical and electrical specifications. In addition, detailed mechanical drawings are presented. Version 1.6 15 December 2022...
  • Page 94 Appendix A: Technical Specifications •1 Model Specific Specifications Sona/Marana-11 Sona/Marana -11 Model (32 mm) (22 mm) Sensor Type Back-Illuminated Scientific CMOS 1400 (W) x 1400 (H) 2.0 Array Size 2048 (W) x 2048 (H) 4.2 Megapixel Megapixel Pixel Size 11 x 11 μm 22.5 mm x 22.5 mm (31.9 mm diag- 15.5 mm x 15.5 mm (21.8 Image Area...
  • Page 95 •1 General Specifications Model Sona and Marana-11 O: Fire Row 1, Fire Row n, Fire All, Fire Any, Arm, I: External Trigger Modes Internal, External, External Start, External Exposure, Software Software Exposure Start exposure - End exposure (row 1), Start exposure - End exposure •5 Events (row n)
  • Page 96 Environmental Specifications     Location to be used Indoor use only Altitude Limit for Air-cooling Up to 2000 m Altitude Limit for Water-cooling Up to 6000 m Operating temperature 0°C to +30°C ambient (non-condensing) Storage temperature -10ºC to 50ºC Operating relative humidity <70% (non-condensing) Pollution degree 2.
  • Page 97 Power Supply Information   Sona and Marana-11 Mains Input for Supplied 100 – 240 VAC, 50 – 60 Hz External Power Supply Camera + External Power Supply: Air cooling of sensor to -25°C: 40 W typical/ 114 W max Power Con- sumption (inc.
  • Page 98 External Power Supply Specifications   Sona and Marana-11 Low Voltage Supply 15 V +/- 5% Input Low Voltage Supply Current Right-angle Plug: Fischer WSO 104 A037-130+ Low Voltage Supply Straight Plug: Fischer S 104 A037-130+ Cable Connector Required Cable Clamp Set: Fischer E3 104.3/6.7+B Pins 1 &...
  • Page 99 Appendix B: Mechanical Drawings Sona Mechanical Drawings Version 1.6 15 December 2022...
  • Page 100 Marana Mechanical Drawings Version 1.6 15 December 2022...
  • Page 101 Appendix C: Dew Point Graph To avoid issues with condensation, the coolant temperature must be set above the dewpoint- the temperature at which condensation (dew) will form. In the relatively dry conditions of an air conditioned lab, or a cool dry climate, use of a coolant temperature of 10°C should not cause any problems.
  • Page 102 Appendix D: UltraVac Technology UltraVac is Andors proprietary vacuum technology that provides a permanent, hermetically sealed enclosure (without O-rings) for the sensor. This ensures maximum cooling performance, with a reliability proven through years of use in Andor cameras such as the iXon EMCCD, iKon and Newton series- the Mean Time Between Failure (MTBF) value is >...
  • Page 103 Appendix E: Other Information Terms and Conditions of Sale and Warranty Information The terms and conditions of sale, including warranty conditions, will have been made available during the ordering process. The current version for the US is available here, for all other regions (except Japan) please click here.
  • Page 104 Appendix F: China RoHS Hazardous Substances Declaration Hazardous Substance: 有 害 物 质 Lead Chromium VI Diphenyl Component Name 部 Mercury Cadmium Polybrominated (Pb) Compounds Ethers 件 名 称 (Hg)汞 (Cd)镉 Biphenyls (PBB) 铅 (Cr6+) (PBDE) Printed Circuit Board Assemblies (Surface- mount Resistors and Capacitors, and Brass Connectors)
  • Page 105 Component Name 部 件 名 称   Hex Stand-offs 六 角 隔撑 Screw Locks 螺 丝 锁定 Version 1.6 15 December 2022...

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