Bungard COMPACTA 30 Instructions For Use Manual

COMPACTA 30
Through hole plating machine
Instructions for use

Preface

Professsional equipment for laboratory pro-
totyping of through-hole plated PCBs up to
210 x 300 mm size. Clean system including
built-in rinsing compartment. Maintenance
free and made for easy processing and
handling. This particular machine type is op-
timized in terms of space requirements and
costs. COMPACTA 30 is suitable for the
Dexter 3 D process (known on the market as
the ABC chemical system).
Features:
Processing sequence for the ABC panel
plating (tenting) technique:
Cleaner
Conditioner
Pre-dip
Catalyst
Salt remover
Copper plate
Equipment:
5 treatment tanks, 2 of them with heaters
1 galvanic copper bath
1 triple-cascade rinse with flow control
1 spray rinse tank with magnetic valve, foot
switch and flow control
1 free tank (i.e. for chemical tinning)
Rectifier:
1 Rectifier for copper plating 6 V / 40 A,
seperate current and voltage display and
setting. Residual ripple < 0.1 % DCU
Bath control:
2 PTFE/PFA coated heaters, controlled by
analogue instruments, full digital timers with
count-down, auto-reset and beeper. Air in-
jection into the copper plating bath. Board
movement by DC gear motor, adjustable
speed.
Options:
Digital timers
Additional required equipment:
Chemicals, anodes, anodes holder and
board holder
Technical Data
Dimensions
Treatment Tanks
400 mm
Lenght
100 mm
Width
300 mm
Depth
ca. 10 l
Content
(Width
Dimesions
Height): 88 cm x 100
cm x 135 cm
Working Height 95 cm
Weight 80 kg
Heating 2 x 400 W
Rectifyer 1 x 6 V, 40 A
Bath Movement DC Gear Motor
Electrical Con- 220 V, 50 Hz, 6.3 A
nection
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Galvanic
Tank
400 mm
300 mm
300 mm
ca. 30 l
x Depth x