Advertisement
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Screw driver
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1.
Unscrew the screws on cover 1, and then remove cover 1 according to Figure 1
2.
Remove all of the inner cables.
3.
Unscrew the screws on power supply PCB 3, and then remove power supply PCB 3.
4.
Unscrew the screws on PCB 2, and then remove PCB 2.
5.
Remove power cable 5 from the chassis.
6.
Remove all of the labels from the chassis.
7.
Remove film 4-2 from base 4-1.
8.
Remove insulation pad 4-3 from base 4-1.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
EL-MF877-00
Template Revision B
Figure 1 Treatments to the product
Figure 2 Treatments to base 4
PSG instructions for this template are available at
EL-MF877-01
Tool Size (if
applicable)
2#
Page 2
Advertisement
