Production Guidance; Reflow Soldering Temperature; Reflow Soldering Curve - Semtech E28-2G4T27SX User Manual

10. Production Guidance

10.1 Reflow soldering temperature

Profile Feature
Solder Paste
Preheat Temperature min （Tsmin）
Preheat temperature max (Tsmax)
Preheat Time (Tsmin to Tsmax)(ts)
Average ramp-up rate(Tsmax to Tp)
Liquidous Temperature (TL)
Time（tL）Maintained Above（TL）
Peak temperature（Tp）
Average ramp-down rate（Tp to Tsmax）

10.2 Reflow soldering curve

.
Curve characteristics
Solder Paste
Min preheating temp.
Max preheating temp.
Preheating time
Average ramp-up rate
Liquid phase temp.
Time above liquid phase line
Peak temperature
Average ramp-down rate
E28-2G4T27SX User Manual
Sn-Pb Assembly Pb-Free Assembly
Sn63/Pb37 Sn96.5/Ag3/Cu0.5
100℃
150℃
60-120 sec
3℃/second max 3℃/second max
183℃
60-90 sec
220-235℃
6℃/second max 6℃/second max
150℃
200℃
60-120 sec
217℃
30-90 sec
230-250℃
15