Siemens MOBILETT Plus Manual page 37

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Filament circuit
The block diagrams and the wiring diagram X037E, sheet 160 are the basis for the func-
tional description given below.
The filament circuit consists of boards D1, D4 and D8 and the single tank, H1.
The filament circuit is controlled by SAB 80C166 on the CPU board D1.
The filament heating of the X-ray tube takes place by means of pulse-width modulation of
the heating-energy transmission.
This is based on charging a heating transformer over a variable time "X" and then trans-
ferring the energy to the filament.
Heat
Heat
Pulse width X = approx. 6 Cs in "stand by mode"
Pulse width X = approx. 20-30 Cs in "preparation or release mode"
Fig. 1
Siemens-Elema AB
Solna, Sweden
Transfer
Store
Charging procedure
Transfer procedure
Register 6
SPR8-215.850.02
Rev. 01
Page 1 of 4
01.02
SPS-UD
13 - 1
13
MOBILETT Plus/ Plus E

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