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GAMMA instabus
Release: February 2012
KNX EIB TP-UART 2-IC
6
Soldering Profile
Symbol
T
Classification Temperature
C
T
Temperature min
smin
T
Temperature max
smax
t
Time
S
T
to T
Ramp-up rate (T
L
P
T
Liquidous Temperature
L
t
Time (t
L
T
Peak package body temperature
P
t
Time (t
P
specified classification temperature
(T
), see Figure 5-1
C
T
to T
Ramp-down rate (T
P
L
t
to t
Time 25 ° C to peak temperature
25
P
Figure 9 Soldering Profile
Moisture Sensitivity Level:
Maximum number of running a reflow profile:
Plating:
Technical Manual
page 38
Parameter
to T
)
L
P
) maintained above T
L
L
) within 5 ° C of the
P
to T
)
P
L
Table 26 Soldering Profile
Subject to change without further notice.
Value
Unit
260
150
200
60-120
° C/s
≤ 3
217
60-150
260
30
° C/s
≤ 6
min
≤ 8
3
3
pure tin (matte tin)
pages 42
© Siemens AG 2012
Note
° C
° C
Preheat/Soak
° C
Preheat/Soak
s
T
to T
smin
smax
° C
s
° C
s
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Siemens AG
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