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(Original flux should be replaced daily.)
10.2. FLAT PACKAGE IC REMOVE PROCEDURE
1. When all of the IC lead can not been seen at the standard degree,
fill with large quantities of solder.
Note:
If you do not fill with solder and directly cut the IC lead with the cutter, stress may build up
directly in the P.C.board's pattern. If you do not fill with large quantities of solder as in step 1
the P.C.board pattern may be removed.
2. Using a cutter, cut the lead at the source. (Cut the contents with
the cutter lightly 5 or 6 times.)
3. Remove when the solder melts. (Remove the lead at the same
time.)
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