1. Introduction 8812CU3 is a highly integrated 2*2 dual-band wireless LAN module. It combines a WLAN MAC, a 2T2R capable WLAN base band,a dual-band WLAN radio. It supports IEEE 802.11a/b/g/n/ac standard and provides the highest PHY rate up to 867Mbps, It can offer feature-rich wireless connectivity and reliable throughput from an extended distance.
Page 13
6.3 Reflow Soldering Standard Conditions Please use the reflow within 2 times. Set up the highest temperature within 250℃. 7. Key Components Of Module Parts Specification Manufacturer Note Chipset RTL8812CU-CG Realtek Shen Zhen Tie Fa Technology limited BL-M8812CU3 MILLION SOURCE PRINTED CIRCUIT BOARD CO., LTD Quzhou Sunlord Electronics Co., Ltd HUBEI TKD ELECTRONICS TECHNOLOGY CO., LTD.
8. Package and Storage Information 8.1 Package Dimensions Package specification: 1. 700 modules per roll and 2,800 modules per box. 2. Outer box size: 37.5*36*29cm. 3. The diameter of the blue environment-friendly rubber plate is 13 inches, with a total thickness of 48mm (with a width of 44mm carrying belt). 4.
8.2 Storage Conditions Absolute Maximum Ratings: Storage temperature: -45℃ to +85℃ Storage humidity: 10% to 95% RH(Non-Condensing) Recommended Storage Conditions: Storage temperature: 5℃ to +40℃ Storage humidity: 20% to 90% RH Please use this Module within 12month after vacuum-packaged. The Module shall be stored without opening the packing. After the packing opened, the Module shall be used within 72hours.
Page 16
This modular complies with FCC RF radiation exposure limits set for an uncontrolled environment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. This modular must be installed and operated with a minimum distance of 20 cm between the radiator and the user's body.
Need help?
Do you have a question about the 8812CU3 and is the answer not in the manual?
Questions and answers