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Technical Manual
RTP 3000 TAS
Chassis Manual

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Summary of Contents for RTP 3000 TAS

  • Page 1 Technical Manual RTP 3000 TAS Chassis Manual...
  • Page 2 This intellectual property is made available solely for the direct use of potential or licensed RTP Corp. customers in their application of RTP Corp. products, and any other use or distribution is expressly prohibited. If you have received this publication in error, immediately delete, discard or return all copies to RTP Corp.
  • Page 3: Table Of Contents

    TABLE OF CONTENTS INTRODUCTION ..................4 Chassis ......................4 TAS Nodes ....................4 3200T Nodes ................... 5 Power Supply Modules .................. 6 SPECIFICATIONS ..................7 Power Supply ....................7 Chassis ......................7 INSTALLATION AND MAINTENANCE ........... 10 General ......................10 Power Connections ..................
  • Page 4: Introduction

    Introduction Chassis The RTP3000 TAS series provides 4 separate chassis configurations. Single power supply configurations include the 19-slot, 11-slot, and 6-slot chassis. Dual power supply configurations include the 15-slot configuration. The number of available I/O slots is dependent upon the number of processors in the chassis.
  • Page 5: 3200T Nodes

    Note: The 3000M and 3100M system do not support redundant I/O modules nor Sequence-Of-Events. They also do not support 3000/02-004 MODBUS TCP/IP Cards, 3000/01 Series Counter Cards or Servo Cards. Factory system model numbers are prefixed as following:  3000S/R2-XYZ Single Node Processor System ...
  • Page 6: Power Supply Modules

    Power Supply Modules The Chassis Power Supply Modules provide DC/DC or AC/DC power conversion for all RTP3000 TAS series chassis. The power supplies provide 5 VDC and 24 VDC power via the backplane to the processors and I/O modules. They also provide power to the cooling fans, which are located at the bottom of each chassis, via a separate terminal block.
  • Page 7: Specifications

    Specifications Power Supply Input Range: 100 - 250 VAC, 47 – 63 Hz (Supplied to main pins 1 & 3) 115 / 230 VAC: 24 VDC: 21.6 - 26.4 VDC (Supplied by SELV or PELV source only to main pins 1 and 3) 24.5 - 26.4 VDC (Supplied by SELV or PELV source only to main pins 5 and 6) Input Current:...
  • Page 8 0.7 inches 0.3 inches 0.8 cm 1.8 cm 8.0 inches 20.3 cm 7.5 inches 19.1 cm 18.5 inches 47.0 cm Figure 1: 15-Slot and 19-Slot Chassis Mounting Dimensions 1.3 inches 0.3 inches 0.8 cm 3.2 cm 5.1 inches 12.9 cm Figure 2: 6-Slot Chassis Mounting Dimensions...
  • Page 9 1.3 inches 0.3 inches 0.8 cm 3.2 cm 8.9 inches 22.6 cm Figure 3: 11-Slot Chassis Mounting Dimensions...
  • Page 10: Installation And Maintenance

    There are two pairs of input power input pins. The first pair (Pins 1 & 3) is used to supply the power module that generates power for the RTP cards. The second pair (Pins 5 & 6) may be used to apply power to the RTP Backplane External Voltage bus.
  • Page 11 Note: For model 3000DCPWR and TASDCPWR, the DC Return and the BPEXTV Return are tied together internally. Therefore, the 24 VDC power supplies connected to these terminals must have a common Return. Power ON LED Description AC Line / DC + No Connection AC Neutral / DC Return...
  • Page 12 Planning of the I/O configuration requires careful calculation of the power required for each chassis. Certain I/O cards require 24 VDC on the chassis backplane. The RTP Power Supply can provide this power internally, or it can be supplied by the BPEXTV connections. To determine, if the internal supply is...
  • Page 13: Fuse Replacement

    Fuse Replacement Warning! Do not remove the power supply module with external power connected. Do not attempt to replace a fuse with external power applied to the power supply module. 1. Electrically disconnect the external power input and BPEXTV power sources and then unplug the main power input connector.
  • Page 14 Refer to Figure 7 and Figure 8 for the DC Power Supply fuse locations. 3000DCPWR Fuse Location TASDCPWR Fuse Location and Fuse Type and Fuse Type Main DC Fuse 5 x 20 mm, rated 10 A / 250 V 5 x 20 mm, rated 10 A / 250 V Littelfuse®...
  • Page 15: Fans

    Fans The RTP 3000TAS fan assembly is powered by the chassis power supply/supplies. Install the RTP supplied cable/cables as shown to supply power to the fan assembly. Figure 9: Chassis Fan Power Cable I/O Cards When you insert an I/O card, make sure that you properly align the card in the supporting card guides, and then gently slide the card forward into the mating connector until the card seats firmly.
  • Page 16: Ethernet Switches

    CRCs. While the Host Ethernet switches can be managed, I/O Ethernet switches connected to the RTP3000 TAS shall be unmanaged. RTP recommends STP Category 5 (EIA 568B, Cat 5), shielded Ethernet cables with four twisted-pair wires and RJ-45 tips. These cables are limited to a maximum length of 328 feet (100 meters).
  • Page 17: Software Configuration

    Software Configuration For software configuration the following tables are valid: Table 3: 3000 Safety System Configuration Specifications Number of Chassis Number of Number of Node Chassis Power Available Slots for 3000 Series Number of Processors in Processors in Supply I/O Cards in Each SIL (*) CPU Nodes Chassis...
  • Page 18 Number of Chassis Number of 3000 Micro Number of Micro Chassis Power Available Slots for Series CPU Number of Processors in Processors in Supply I/O Cards in Each SIL (*) Nodes Chassis Each Chassis Each Chassis Type Chassis 3000M/00-15 Single 3000M/00-16 Dual SIL-2...
  • Page 19 Table 5: 3100 DCS/PLC System Configuration Specifications Number of Number of Chassis Number of Number Node Chassis Power Available Slots 3100 Series Processors in Processors in Supply for I/O Cards in CPU Nodes Chassis Each Chassis Each Chassis Type Each Chassis 3100S/00-1 Single 3100S/00-1D...
  • Page 20: 3200/R3 Systems

    3200/R3 Systems Ethernet Cabling Table 6: Ethernet Cabling Matrix Ethernet Host I/O Switch Description Processor ID Port Switch A 3200T Processor Domain Node Rack 0 Domain Node Rack 0R Domain Node Rack 1 Domain Node Rack 1R Domain Node Rack 2 Domain Node Rack 2R Domain Node Rack 3 Domain Node Rack 3R...
  • Page 21 Table 7: Ethernet Cabling Matrix 3201 Ethernet Host InterLink I/O Switch I/O Switch Description Processor ID Port Switch A Switch B 3201 Processor Domain Node Rack 0 Domain Node Rack 0R Domain Node Rack 1 Domain Node Rack 1R Domain Node Rack 2 Domain Node Rack 2R Domain Node Rack 3 Domain Node Rack 3R...
  • Page 22: Software Configuration

    Software Configuration For software configuration the following tables are valid: Table 8: Domain System Configuration Specifications Number of Chassis Number of Number 3200T/3201 Power Available Slots Node 3200 Series Processors in Supply for I/O Cards in Redundancy CPU Nodes Chassis Each Chassis Type Each Chassis...
  • Page 23 Table 9: 3200 Centralized System Configuration Specifications Number of Number of Number 3200T/3201 Chassis Available Slots Node 3200 Series CPU Processors in Power for I/O Cards in Redundancy Nodes Chassis Each Chassis Supply Type Each Chassis 3200T/00-C1 S 18 Single Simplex 3200T/00-C2 S 14 Dual...
  • Page 24 Diagnostic Information The Chassis Info object reports diagnostic information for the Chassis Processor configured in its Property Manager display. Properties...
  • Page 25 Chassis Number is configured for the Chassis Processor number which will match the Chassis to pull the information. Valid chassis numbers are between 0 and 15. Chassis Online Bool Variable can be used to determine if any of the Chassis Processors of the selected Chassis is operational or not.
  • Page 26 this variable is true, then it indicates normal communications on Port A of the I/O communications link. Connector J1 on the front of a 3000 chassis processor functions as the “A” I/O Port to the node processors. I/O Path B Status Bool Variable can be used to determine any failure on the communications link between the selected right (Primary) Chassis Processor and Node Processors on Port B.
  • Page 27: Compliance With Ce Mark

    Compliance with CE Mark This section describes how to install and operate RTP equipment for use in the European Union (EU) to comply with the requirements of the CE Mark and its referenced standards. The procedures in this section apply also to other environments where provisions of the EU’s EMC and Low Voltage Directives are either required or desirable.
  • Page 28 2002/96/EC of the European Parliament and of the Council on waste electrical and electronic equipment). Some RTP Corporation products contain materials that may be detrimental to the environment. These materials may include, but are not limited to lead (in solder) and lithium (in batteries).
  • Page 29: Environmental Conditions

    Modules can be ordered with optional HumiSeal© conformal coating. In this case, the modules can be installed in G3 harsh environmental conditions as defined in standard ISA–S71.04–1985. This equipment is intended for use in altitudes up to 2000 meters. Contact RTP regarding use in altitudes higher than 2000 meters.
  • Page 30: Referenced Companies

    Referenced Companies Corcom Inc.; Libertyville, Illinois, USA; 708-680-7400 Hoffman; Anoka, Minnesota, USA; 763-422-2178 Definitions OPERATOR is any personnel other than SERVICE PERSONNEL. Requirements assume that the OPERATOR is oblivious to electrical hazards, but does not act intentionally in creating a hazard. SERVICE PERSONNEL are assumed reasonably careful in dealing with obvious hazards.

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