Table Of Contents - Panasonic BT-H1700BMC Service Manual

1.1 DISASSEMBLY PROCEDURE ....................................................................................................... DIS-1
1.1.1 REMOVING THE SLOT PANEL, TOP COVER AND REAR PANEL ................................... DIS-1
1.1.2 REMOVING THE BOTTOM COVER .................................................................................... DIS-1
1.1.3 REMOVING THE SIGNAL PW BOARD, MOTHER PW BOARD
AND REMOTE PW BOARD.................................................................................................. DIS-1
1.1.4 REMOVING THE CHASSIS BASE, SPEAKER AND S. CORRECTION PW BOARD......... DIS-1
1.1.5 REMOVING THE CRT AND LED PW BOARD..................................................................... DIS-1
1.1.6 REMOVING THE FRONT CONTROL PW BOARD AND FRONT VR PW BOARD............. DIS-1
1.1.7 DIAGNOSING THE MAIN PW BOARD ................................................................................ DIS-1
1.1.8 NOTE CONCERNING WIRE CLAMPING ............................................................................ DIS-1
1.2 DEMAGNETIZATION PROCEDURE.............................................................................................. DIS-3
1.2.1 CAUTION .............................................................................................................................. DIS-3
1.2.2 DEMAGNETIZING THE CRT SCREEN................................................................................ DIS-4
1.2.3 DEMAGNETIZING THE OUTER CABINET OF THE UNIT .................................................. DIS-4
1.3 MEMORY IC REPLACEMENT........................................................................................................ DIS-5
1.3.1 MEMORY IC.......................................................................................................................... DIS-5
1.3.2 MEMORY IC REPLACEMENT PRECDURE ........................................................................ DIS-5
1.3.3 FACTORY SETTING VALUE................................................................................................ DIS-6
1.4 REPLACEMENT OF CHIP COMPONENT ..................................................................................... DIS-8
1.4.1 CAUTIONS............................................................................................................................ DIS-8
1.4.2 SOLDERING IRON ............................................................................................................... DIS-8
1.4.3 REPLACEMENT STEPS ...................................................................................................... DIS-8
DISASSEMBLY
CONTENTS