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Summary of Contents for TUYA WB2L
- Page 1 WB2L Module Datasheet Version: 20220729 Online Version...
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Page 2: Table Of Contents
Contents Contents 1 Overview 1.1 Features ....... . . 1.2 Applications ....... 1.3 Change history . - Page 3 Contents 7 MOQ and packing information 8 Appendix: Statement...
- Page 4 Contents WB2L is a low-power embedded Wi-Fi and Bluetooth LE module that Tuya has devel- oped. It consists of a highly integrated RF chip (BK7231T) and several peripheral components, with an embedded Wi-Fi network protocol stack and robust library func- tions.
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Page 5: Overview
WB2L is embedded with a low-power 32-bit microcontroller unit (MCU), 2 MB flash memory, 256 KB static random-access memory (SRAM), and extensive peripher- als. WB2L is an RTOS platform that integrates all function libraries of the Wi-Fi MAC and TCP/IP protocols. You can develop embedded Wi-Fi products as required. 1.1 Features •... -
Page 6: Change History
1 Overview • Baby monitor • Network camera • Intelligent bus 1.3 Change history Date Description Version after change 2019-11-07 This is the first release. V1.0.0 2019-11-23 Updated antenna gain. V1.0.1 2019-12-04 Updated power V1.0.2 consumption of distribution network. 2019-12-10 Updated Bluetooth V1.0.3 related parameters. -
Page 7: Module Interfaces
2.1 Dimensions and footprint WB2L has one row of pins with a 2±0.1 mm pin spacing. The WB2L dimensions (Lx Wx H) are 17.3±0.35 mm x 15±0.35 mm x 2.8±0.15 mm. The following figure shows the WB2L front and rear views. -
Page 8: Interface Pin Definition
2 Module interfaces 2.2 Interface pin definition Pin No. Symbol I/O type Function PWM2 Hardware PWM pin, which is connected to the P8/BT_ACTIVE/PWM2 (Pin24) PWM1 Hardware PWM pin, which is connected to the P7/WIFI_ACTIVE/PWM1 (Pin23) 5 / 28... -
Page 9: Test Pin Definition
2 Module interfaces Pin No. Symbol I/O type Function PWM0 Hardware PWM pin, which is connected to the P6/CLK13M/PWM0 (Pin22) PWM5 Hardware PWM pin, which is connected to the P26/IRDA/PWM5 (Pin15) PWM4 Hardware PWM pin, which is connected to the P24/LPO_CLK/PWM4 (Pin16) Ground pin... - Page 10 2 Module interfaces Pin No. Symbol I/O type Function U2_TXD UART2_TX, LOG serial port U2_RXD UART2_RX, LOG serial port F_SCK Clock pin when data is downloaded from the flash memory, which is connected to the P20 pin on the internal IC F_CSN Command enabling pin when...
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Page 11: Electrical Parameters
3 Electrical parameters 3 Electrical parameters 3.1 Absolute electrical parameters Minimum Maximum Parameter Description value value Unit Storage ℃ temperature VBAT Power supply voltage Static TAMB-25℃ electricity voltage (human body model) Static TAMB-25℃ electricity voltage (machine model) 3.2 Working conditions Minimum Typical Maximum... -
Page 12: Current Consumption During Constant Transmission And Receiving
3 Electrical parameters Minimum Typical Maximum Parameter Description value value value Unit VCC*0.75 high-level input VCC*0.1 low-level output VCC*0.8 high-level output Imax I/O drive current 3.3 Current consumption during constant transmission and receiving Working Power/ Typical Maximum status Mode Rate Receiving value value... - Page 13 3 Electrical parameters Working status Maximum Working mode (Ta = 25°C) Average value value Unit The module is in EZ mode, and the Wi-Fi indicator blinks quickly. The module is in AP mode, and the Wi-Fi indicator blinks slowly. Connected The module is connected to the network,...
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Page 14: Rf Features
4 RF features 4 RF features 4.1 Basic RF features Parameter Description Frequency band 2.412~2.484GHz Wi-Fi standard IEEE 802.11b/g/n(channels1-14) Data transmission rate 11b:1,2,5.5, 11 (Mbps) 11g:6,9,12,18,24,36,48,54(Mbps) 11n: HT20 MCS0~7 Antenna type PCB antenna with a gain of 1dBi 4.2 TX performance Performance during constant transmission. -
Page 15: Rx Performance
4 RF features Minimum Maximum Parameter Value Typical Value Value Unit EVM@802.11b CCK 11Mbps Mode 17dBm EVM@802.11g OFDM 54Mbps Mode 13.5dBm EVM@802.11n OFDM MCS7 Mode 12dBm Frequency error 4.3 RX performance RX sensitivity Minimum Maximum Parameter value Typical value value Unit PER<8%, RX sensitivity,... -
Page 16: Antenna
5 Antenna 5 Antenna 5.1 Antenna type WB2L uses the PCB antenna. 5.2 Antenna interference reduction To ensure optimal Wi-Fi performance when the Wi-Fi module uses an onboard PCB antenna, it is recommended that the antenna be at least 15mm away from other metal parts. - Page 17 5 Antenna 14 / 28...
- Page 18 5 Antenna 15 / 28...
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Page 19: Packaging Information And Production Instructions
6 Packaging Information and Production Instructions 6 Packaging Information and Production Instructions 6.1 Mechanical Dimensions The PCB dimensions (L x Wx H) are 17.3±0.35mm (L)×15±0.35mm (W) ×0.8±0.1mm (H). 6.2 Side view 16 / 28... -
Page 20: Recommended Schematic Encapsulation
6 Packaging Information and Production Instructions 6.3 Recommended schematic encapsulation 6.4 Recommended PCB Encapsulation-Pin header WB2L can be mounted onto a PCB by using an SMT placement machine or through- hole mounted onto the PCB through a pin header. 17 / 28... -
Page 21: Recommended Pcb Encapsulation-Smt
6 Packaging Information and Production Instructions 6.5 Recommended PCB Encapsulation-SMT 18 / 28... -
Page 22: Production Instructions
6 Packaging Information and Production Instructions 6.6 Production instructions 1. For the modules that can be packaged with the SMT or in an in-line way, you can select either of them according to the PCB design solutions of customers. If a PCB is designed to be SMT-packaged, package the module with the SMT. -
Page 23: Recommended Oven Temperature Curve
6 Packaging Information and Production Instructions ![HIC -SMT and in -line module .png https :// airtake -public -data -12541 53901. cos.ap shanghai myqcloud .com/goat /20210410/2 c61fd34d2a6464d8cb ee05f63689786 .png) 3. The module needs to be baked in the following cases: • The packaging bag is damaged before unpacking. •... - Page 24 6 Packaging Information and Production Instructions and the actual temperatures. All the temperatures shown in this module datasheet are obtained through actual measurements. Manner 1: SMT process (Recommended oven temperature curve of reflow soldering) Set oven temperatures according to the following curve. •...
- Page 25 6 Packaging Information and Production Instructions oven temperature curve in the solder paste specifications. Manner 2: Wave soldering process (Oven temperature curve of wave sol- dering) Set oven temperatures according to the following temperature curve of wave sol- dering. The peak temperature is 260°C±5°C. Suggestions on oven temperature Suggestions on...
- Page 26 6 Packaging Information and Production Instructions Suggestions on oven temperature Suggestions on curve of wave manual soldering soldering temperature Ramp-down slope ≤6°C/s 23 / 28...
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Page 27: Storage Conditions
6 Packaging Information and Production Instructions 6.8 Storage conditions 24 / 28... - Page 28 7 MOQ and packing information 7 MOQ and packing information Number of Number of Packing modules in Reel Packs in Product model MOQ (pcs) method each reel Pack Each Box WB2L 4000 Carrier tape 1000 and reel packing 25 / 28...
- Page 29 8 Appendix: Statement 8 Appendix: Statement FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user ’ s authority to operate this device. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.
- Page 30 20 cm between the radiator and user body ” . This device has got an FCC ID: 2ANDL-WB2L. The end product must be labeled in a visible area with the following: “ Contains Transmitter Module FCC ID: 2ANDL-WB2L ”...
- Page 31 The device could be used with a separation distance of 20cm to the human body. Declaration of Conformity European notice Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this module product is in compliance with essential requirements and other relevant provisions of Directive 2014/53/EU,2011/65/EU.
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