4.24 Cap SD Assy R ................................................................................... 32
4.25 Cap SIM Assy R .................................................................................. 33
4.26 Cap USB Assy R ................................................................................. 34
4.29 Cover Panel Top ................................................................................. 37
4.37 Front Assembly .................................................................................. 47
4.40 Mesh Receiver .................................................................................... 50
4.41 Plate Side Key .................................................................................... 51
4.42 Sheet BtB LCD .................................................................................... 52
4.44 Water Indicator ................................................................................... 54
4.45 Vibrator ............................................................................................... 55
5
Re-Assembly ................................................................................. 58
5.5 Main PBA ............................................................................................ 61
5.11 Back Panel Assy ................................................................................ 65
5.12 SIM Tray .............................................................................................. 67
6
Revision History ........................................................................... 68
1273-1774 Rev 2
Sony Mobile Communications AB - Company Internal
Working Instruction (mech)
3(68)