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Summary of Contents for Softing commModule MBP
- Page 1 Hardware Manual commModule MBP Version: EN-052022-1.21-3 © Softing Industrial Automation GmbH...
- Page 2 The information contained in these instructions corresponds to the technical status at the time of printing of it and is passed on with the best of our knowledge. Softing does not warrant that this document is error free. The information in these instructions is in no event a basis for warranty claims or contractual agreements concerning the described products, and may especially not be deemed as warranty concerning the quality and durability pursuant to Sec.
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Page 3: Table Of Contents
Host PCB layout ....................... 17 Mounting process ....................... 19 ESD handling precautions ....................... 19 Packaging and labeling ....................... 19 Special conditions for safe use ..................20 Chapter 7 Safety block diagram ....................... 20 Installation ....................... 21 commModule MBP HWM EN-052022-1.21-3... - Page 4 Isolation and creepage distances ....................... 21 Label ....................... 22 Maintenance and spare parts ....................... 22 CE Compliance ..................23 Chapter 8 ATEX EC type examination certificate ....................... 24 IECEx Certificate of Conformity ....................... 29 Declaration of Conformity ....................... 35 commModule MBP HWM EN-052022-1.21-3...
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Page 5: Introduction
MBP. Related documentation For further details about the commModule MBP and the configuration workflow of the firmware see the CommScripter user guide and commModule MBP Evaluation Kit hardware guide available by download. -
Page 6: Commmodule Mbp
This product has been designed to be integrated as a system component by qualified hardware engineers. Ordering information The commModule MBP is available as a potted version (#STD), not suitable for reflow soldering and a non- potted version (#STD_NOP), suitable for reflow soldering. -
Page 7: Interface
This section describes the signals available on the module via the PCB solder pads on the edge of the PCB. Orientation Top view of the potted module The position of Pin 1 is marked on the label. Top view of the non-potted module commModule MBP HWM EN-052022-1.21-3... -
Page 8: Pin Number And Signal Description
MBP - Hardware Manual Pin number and signal description Signal Name Pin No. I/O* Description TXD9_PB7 TX Interface signal for HART #RTS9_PB5 Low active RTS signal for HART RXD9_PB6 RX Interface signal for HART GPIO_PA4 GPIO For future use... - Page 9 * AI = Analog Input, AO = Analog Output, DI = CMOS Digital Input, DO = CMOS Digital Output, GPIO = General Purpose CMOS Digital Input/Output, PO = Power Output, DBG = Programmer Interface, FB = Fieldbus, PD Pulldown, PU Pullup commModule MBP HWM EN-052022-1.21-3...
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Page 10: Pullups And Pulldowns
Weak pullups are provided on all GPIO pins. Pullups for TDO and TDI are not included on the commModule MBP and must be included on the application base board (pullup to Pin 7 of commModule MBP). RXD7_P92: internal pulldown 33k... -
Page 11: Electrical Specifications
Vcc – 0.5 = -1mA Analog Input The commModule MBP incorporates a 12bit-A/D converter with a reference voltage of 3.0V Power Output: The power budget to supply a connected system from fieldbus is limited. It is dependent on the rated current from fieldbus, which is adjustable in software from Ir = 10mA to 26mA. - Page 12 MBP - Hardware Manual Note If the available power budget is exceeded the commModule MBP may reset. Parameter Unit 3V_OUT 6V2_OUT open circuit with source impedance 10 Ohms Fieldbus: · Physical Layer according to IEC 61158-2 type 3 voltage mode, 31.25kBit/s.
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Page 13: Environmental Specifications
Additional requirements apply for the design of the host PCB. For further information see the ATEX EC type examination certificate MTBF calculation MTBF calculated according to SN29500: @40°C: 3.655.879 hours @70°C: 1.142.849 hours Conditions: Standard SN29500, continuous operation commModule MBP HWM EN-052022-1.21-3... -
Page 14: Certifications
MBP - Hardware Manual Certifications ROHS The commModule MBP is ROHS compliant. ATEX / IECEx: IECEx IBE 17.0038U Ex ia IIC Ga Ex ia IIIC Da IBExU17ATEX1135 U II 1G Ex ia IIC Ga II 1D Ex ia IIIC Da... -
Page 15: Mechanical Specification
Chapter 6 - Mechanical specification Mechanical specification Potted module The dimensions of the potted module are shown below in millimeters. The weight of a potted variant (commModule MBP#STD) is about 15 gram. Bottom view commModule MBP HWM EN-052022-1.21-3... -
Page 16: Non-Potted Module
MBP - Hardware Manual Non-potted module The dimensions of the non-potted module are shown below in millimeters. The weight of the non-potted variant (commModule MBP#STD_NOP) is about 6.2 gram. Bottom view commModule MBP HWM EN-052022-1.21-3... -
Page 17: Host Pcb Layout
The PCB footprint dimensions may be modified based on user experience and/or process capability. Routing under the CommModule MBP Note The host PCB footprint must not contain any exposed copper under the module except the pads interfacing the commModule MBP to avoid any contact with traces on the module. commModule MBP HWM EN-052022-1.21-3... - Page 18 Note It is recommended to include 4 vias on the host PCB near the corners (not in keep out area) to avoid tilting of the commModule MBP during soldering. Intrinsic safety: Ensure there is no copper within 0.5mm of the marked Keep Out Area on the host PCB.
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Page 19: Mounting Process
Chapter 6 - Mechanical specification Mounting process The PCB is made of FR4 and has a NiAu surface finish. We strongly recommend that commModule MBP modules are not soldered more than once after shipping by Softing. The soldering of the communication module is compliant with RoHS directive 2011/65. -
Page 20: Special Conditions For Safe Use
(IP), thermal endurance tests, impact test, fall test are not applicable for the commModule MBP as a bare module. CAUTION The circuits of the commModule MBP have no galvanic isolation. All signals have a galvanic connection. Safety block diagram The following block diagram shows the commModule MBP: commModule MBP HWM EN-052022-1.21-3... -
Page 21: Installation
Chapter 7 - Special conditions for safe use Installation The commModule MBP must be installed by qualified personnel only. Ensure that the equipment installed complies with the types of protection relevant to the applicable zones and categories and with local requirements for electrical equipment used in explosive areas associated with explosive atmosphere. -
Page 22: Label
MBP - Hardware Manual Label The commModule MBP #STD is marked with a label similar to the example below. The Ex marking for commModule MBP #STD_NOP is printed on the packaging, as the module is too small to show entire full marking. -
Page 23: Chapter 8 Ce Compliance
Chapter 8 - CE Compliance CE Compliance This device complies with the following EC directives: § EC directive 2014/30/EU "EMC directive” § EC directive 2014/34/EU "ATEX" § EC directive 2011/165/EU "RoHS", amended by Commission Delegated Directive (EU) 2015/863 commModule MBP HWM EN-052022-1.21-3... -
Page 24: Atex Ec Type Examination Certificate
MBP - Hardware Manual ATEX EC type examination certificate commModule MBP HWM EN-052022-1.21-3... - Page 25 Chapter 8 - CE Compliance commModule MBP HWM EN-052022-1.21-3...
- Page 26 MBP - Hardware Manual commModule MBP HWM EN-052022-1.21-3...
- Page 27 Chapter 8 - CE Compliance commModule MBP HWM EN-052022-1.21-3...
- Page 28 MBP - Hardware Manual commModule MBP HWM EN-052022-1.21-3...
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Page 29: Iecex Certificate Of Conformity
Chapter 8 - CE Compliance IECEx Certificate of Conformity commModule MBP HWM EN-052022-1.21-3... - Page 30 MBP - Hardware Manual commModule MBP HWM EN-052022-1.21-3...
- Page 31 Chapter 8 - CE Compliance commModule MBP HWM EN-052022-1.21-3...
- Page 32 MBP - Hardware Manual commModule MBP HWM EN-052022-1.21-3...
- Page 33 Chapter 8 - CE Compliance commModule MBP HWM EN-052022-1.21-3...
- Page 34 MBP - Hardware Manual commModule MBP HWM EN-052022-1.21-3...
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Page 35: Declaration Of Conformity
Chapter 8 - CE Compliance Declaration of Conformity commModule MBP HWM EN-052022-1.21-3... - Page 36 Softing Industrial Automation GmbH Richard-Reitzner-Allee 6 + 49 89 45 656-340 85540 Haar / Germany + 49 89 45 656-488 https://industrial.softing.com info.idn@softing.com...
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