Advertisement

Quick Links

GigaDevice Semiconductor Inc.
ESD Static Protection Manual
Application Note
AN055

Advertisement

Table of Contents
loading
Need help?

Need help?

Do you have a question about the AN055 and is the answer not in the manual?

Questions and answers

Summary of Contents for GigaDevice Semiconductor AN055

  • Page 1 GigaDevice Semiconductor Inc. ESD Static Protection Manual Application Note AN055...
  • Page 2: Table Of Contents

    AN055 ESD Static Protection Manual Table of Contents Table of Contents ......................2 List of Figures ........................ 3 List of Tables ........................4 Prevention of ESD/EOS ..................5 1.1. Electrostatic Discharge ESD ..................5 1.2. Electrical Overstress EOS ................... 7 1.3.
  • Page 3: List Of Figures

    AN055 ESD Static Protection Manual List of Figures Figure 1-1. ESD Sensitive Symbols and ESD Protective Symbols ..........8 Figure 2-1. Series connection and parallel connection of anti-static wristbands ......11...
  • Page 4: List Of Tables

    AN055 ESD Static Protection Manual List of Tables Table 1-1. Common Static Sources ....................6 Table 1-2. Common Behavior Electrostatic Strength ............... 7 Table 2-1. Maximum Ground Resistance and Discharge Time Allowed for Electrostatic Safe Operation ............................10 Table 4-1. Check List.......................... 15...
  • Page 5: Prevention Of Esd/Eos

    AN055 ESD Static Protection Manual Prevention of ESD/EOS Electrostatic discharge ESD is a phenomenon in which electrostatic charge is rapidly transferred between objects with different potentials generated by two electrostatic sources. Electrostatic charges can cause damage to electrostatically sensitive devices when they come into contact with or near them.
  • Page 6: Table 1-1. Common Static Sources

    AN055 ESD Static Protection Manual materials such as plastic bags or Styrofoam containers can generate severe static electricity and are not suitable for use in operating areas, especially ESD protected area (EPA). The act of peeling tape from a roll of tape can generate 20,000 volts. Even compressed air blowing on insulating surfaces can generate static charges.
  • Page 7: Electrical Overstress Eos

    AN055 ESD Static Protection Manual Table 1-2. Common Behavior Electrostatic Strength Electrostatic Voltage (V) Source 10-20% Relative Humidity 65-90% Relative Humidity Walking on the carpet 35000 1500 Walk on polyethylene floor 12000 Staff on seat 6000 Polyethylene envelope 7000 (work instruction booklet)
  • Page 8: Protective Materials

    AN055 ESD Static Protection Manual Figure 1-1. ESD Sensitive Symbols and ESD Protective Symbols Symbol (1) ESD sensitive symbol. Inside the triangle is a hand drawn with a slash to touch. This symbol is used to indicate that the electronic or electrical device or assembly is susceptible to damage by an ESD event.
  • Page 9 AN055 ESD Static Protection Manual absorption material for ESD sensitive devices, generally used as an intermediate layer material for packaging. Antistatic materials do not generate electrical charges when in motion or when rubbed. But if electrostatic discharge occurs, ESD can penetrate the package, causing ESD/EOS for ESD sensitive devices.
  • Page 10: Esd Safe Work Area Epa

    AN055 ESD Static Protection Manual ESD Protected Area EPA ESD/EOS safety benches prevent damage to sensitive components from electrostatic discharges and spikes generated during operation. The safety workbench should have the protection function against EOS damage and avoid the spikes pulse generated by test equipment such as maintenance, production, and testing.
  • Page 11 AN055 ESD Static Protection Manual Figure 2-1. Series connection and parallel connection of anti-static wristbands ① anti-static wristband ② ESD protection plate, static dissipative container, ion fan ③ ESD protection desktop ④ ESD protective floor/floor mat/epoxy floor ⑤ Building concrete floor ⑥...
  • Page 12: Operating Precautions

    AN055 ESD Static Protection Manual Operating Precautions Guidelines 3.1. Avoid contaminating the pad surface before soldering. Anything that comes into contact with these surfaces must be cleaned. Be very careful when removing the PCB from its protective packaging. Only touch the edge of the board away from the edge connector. Gloves that meet EOS/ESD requirements may be required when mechanical assembly requires a firm grip on the board.
  • Page 13: Physical Damage

    AN055 ESD Static Protection Manual or damage to other internal components. Moisture sensitive components (classified in accordance with IPC/JEDEC J-STD-020, ECA/IPC/JEDEC J-STD-075 or their equivalents) shall operate in accordance with IPC/JEDEC J-STD-033 or their equivalents Provisions for documented procedures. IPC-1601 provides guidelines for moisture control, operating, and packaging of PCBs.
  • Page 14: After Soldering

    AN055 ESD Static Protection Manual After Soldering 3.5. Even after soldering and cleaning operations, handling of electronic components requires great care. Fingerprints are extremely difficult to remove, and the conformal coated boards show fingerprints after humidity or environmental testing. Gloves or other protective equipment can be used to prevent such contamination.
  • Page 15: Esd Protection Check List

    AN055 ESD Static Protection Manual ESD Protection Check List Table 4-1. Check List Project Questions Responds How is the environment of the work area controlled? Control Is the work area suitable for the chip product being used? Temperature What is the allowable temperature range?
  • Page 16 AN055 ESD Static Protection Manual contamination What measures are taken to protect against ESD damage? ESD effects Are there any local sources of electromagnetic or electrostatic fields that could damage the product? What measures are taken to protect against radiation damage?
  • Page 17: Revision History

    AN055 ESD Static Protection Manual Revision history Table 5-1. Revision history Revision No. Description Date Initial release Apr.20, 2022...
  • Page 18 Important Notice This document is the property of GigaDevice Semiconductor Inc. and its subsidiaries (the "Company"). This document, including any product of the Company described in this document (the “Product”), is owned by the Company under the intellectual property laws and treaties of the People’s Republic of China and other jurisdictions worldwide.

Table of Contents