Advertisement

Quick Links

uPad Proto Base Assembly Guide
v2.0
Last Updated September 1, 2015
ootbrobotics.com
Electronics and Robotics LLC

Advertisement

Table of Contents
loading
Need help?

Need help?

Do you have a question about the uPad and is the answer not in the manual?

Questions and answers

Summary of Contents for Out of the Box uPad

  • Page 1 Proto Base Assembly Guide v2.0 Last Updated September 1, 2015 ootbrobotics.com Electronics and Robotics LLC...
  • Page 2: Table Of Contents

    Table of Contents Preface ......................... 3 Introduction ......................3 Required Tools ......................3 Flux Pen ........................ 3 Soldering Iron ......................3 Solder ........................3 Diagonal Cutters ....................3 #1 Phillips Head Screwdriver ................3 Solder Wick ......................4 Needle Nose Plyers ....................4 Soldering ........................
  • Page 3: Preface

    Preface Introduction This is the official Out of the Box uPAD Proto Base assembly guide. It includes all the required information of tools, technique and process to fully assemble the uPad Proto Base. It is highly suggested that this guide is read in full to assure quick and proper assembly.
  • Page 4: Solder Wick

    LCD and uPAD. Soldering Prior soldering experience is preferable but not required to complete the uPAD Proto Base. The recommended soldering temperature range is from 615˚ to 650˚. Routinely clean and tin the tip of the iron when in use. Use of a metal mesh to clean the tip is recommended over a wet sponge.
  • Page 5: Desoldering

    Reference the figure below for all of the basics of proper soldering. Please read all of the captions before continuing. Figure 2: DOs and DON'Ts of soldering (Source SparkFun.com) When soldering, use the area just before the tip of the iron. This will increase the surface area and therefore heat transfer.
  • Page 6: Module 1

    Figure 3: Bare Proto Base without uPad (TOP of board) Above is the bare top of the Proto Base with the uPAD removed. The components that are to be soldered in this module are highlighted in red and blue. Red components are soldered to the pads on the top of the board, and blue components are soldered to the bottom of the board.
  • Page 7: Step 1: Portb/Analog Headers

    1. Break one of your 40 pin headers into 10x 4 pin headers 2. Break two of your 40 pin headers into 5x 8 pin headers each 3. Break one of your 40 pin headers into 3x 6 pin headers and 2x 11 pin headers.
  • Page 8: Step 2: I/O Headers

    Figure 6: Header pin from side Figure 7: Header Alignment Verification With only a single pin tacked, determine whether the header is soldered sufficiently, i.e. it is perpendicular to the board. Doing so is particularly critical for this set of headers since they will be used with jumpers.
  • Page 9: Step 3: Power Headers

    Step 3: Power Headers Figure 9: Power Header Locations Solder the headers highlighted in Figure 9 Step 4: JTAG Header Figure 10: JTAG Header Location Solder the headers highlighted in Figure 10. Notice the highlight color is blue meaning that the headers will be soldered to the bottom of the board, and the long side will point out of the top of the board.
  • Page 10: Step 5: Mcu/Cpld Header

    Step 5: MCU/CPLD Header Figure 11: MCU/CPLD Header Location Solder the headers highlighted in Figure 11. Step 6: CPLD Socket Figure 12: CPLD Socket Solder the CPLD socket highlighted above. As the color indicates the socket will be soldered to the bottom of the board, and the plastic portion of the socket will sit on top of the board.

Table of Contents