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TRF3701/TRF3702
Quadrature Modulator
Evaluation Module
User's Guide
2004
Wireless Infrastructure Products
SLWU007

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Summary of Contents for Texas Instruments TRF3701

  • Page 1 TRF3701/TRF3702 Quadrature Modulator Evaluation Module User’s Guide 2004 Wireless Infrastructure Products SLWU007...
  • Page 2 TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions:...
  • Page 3 EVM IMPORTANT NOTICE Texas Instruments (TI) provides the enclosed product(s) under the following conditions: This evaluation kit being sold by TI is intended for use for ENGINEERING DEVELOPMENT OR EVALUATION PURPOSES ONLY and is not considered by TI to be fit for commercial use. As such, the goods being provided may not be complete in terms of required design-, marketing-, and/or manufacturing-related protective considerations, including product safety measures typically found in the end product incorporating the goods.
  • Page 4 EVM schematic located in the EVM User’s Guide. When placing measurement probes near these devices during operation, please be aware that these devices may be very warm to the touch. Mailing Address: Texas Instruments Post Office Box 655303 Dallas, Texas 75265 Copyright  2004, Texas Instruments Incorporated...
  • Page 5 Preface Read This First About This Manual This user’s guide describes the configuration of the of the TRF3701/2 evaluation module (EVM), modes of operation, function, and the physical characteristics. How to Use This Manual This document contains the following chapters:...
  • Page 6 The information in a caution or a warning is provided for your protection. Please read each caution and warning carefully. FCC Warning This equipment is intended for use in a laboratory test environment only. It gen- erates, uses, and can radiate radio frequency energy and has not been tested for compliance with the limits of computing devices pursuant to subpart J of part 15 of FCC rules, which are designed to provide reasonable protection against radio frequency interference.
  • Page 7: Table Of Contents

    ............TRF3701/02 EVM Operating Procedure .
  • Page 8 Figures 2 - 1 Top Layer ..............2 - 2 Layer 2—Ground Plane .
  • Page 9: Overview

    Chapter 1 Overview This document relates to the TRF3701/TRF3702 direct launch quadrature modulator for applications in the transmit path of base stations and communications equipment. The TRF3701 operates between 400 MHz and 1.5 GHz and the TRF3702 between 1.5 GHz and 2.5 GHz. A quadrature modulator is used for up conversion of signals from the transmit chain DAC to the RF power amplifier device.
  • Page 10: Purpose

    Purpose 1.1 Purpose The TRF3701/TRF3702 evaluation module (EVM) is intended for the evaluation of the TRF3701 and TRF3702 direct launch quadrature modulator. Unless otherwise stated, the functionality described in this manual applies to both the TRF3701 and TRF3702 devices. 1.2 EVM Circuit Overview The EVM comes configured for differential I/Q input signals via four SMA connectors as shown in the schematic and Table 1 - 1.
  • Page 11: Trf3701/02 Evm Operating Procedure

    TRF3701/02 EVM Operating Procedure 1.4 TRF3701/02 EVM Operating Procedure Set up the EVM as follows: 1) Verify all settings against Table 1 - 1. Table 1 - 1. EVM Configuration Configuration Table Op-Amp No Op-Amp Single-Ended Inputs Available – TRF370x Driven DC-Coupled Differential Inputs Available –...
  • Page 12 0 V, and an output impedance 50-Ω. 5) Connect a spectrum analyzer to the SMA connector marked RFOUT (J3) and monitor the TRF3701/TRF3702 output. 6) To optimize the carrier suppression, this modulator performs the following (if using on-board dc offset through J3): a) Connect a spectrum analyzer to output port J3, rotate R33 to decrease the LO feed through as required.
  • Page 13: Physical Description

    Chapter 2 Physical Description This chapter discusses the four layer PCB layout, component placement, and list of components used on the evaluation module. Topic Page PCB Layout ..........Parts Llists .
  • Page 14: Pcb Layout

    PCB Layout 2.1 PCB Layout The EVM is constructed on a four layer, 76 mm x 76 mm x 1,575 mm thick PCB using FR-4 material. Figure 2 - 1 through Figure 2 - 4 show the individual layers. Figure 2 - 1. Top Layer...
  • Page 15: Layer 2-Ground Plane

    PCB Layout Figure 2 - 2. Layer 2—Ground Plane Physical Description...
  • Page 16: Layer 3-Power Plane

    PCB Layout Figure 2 - 3. Layer 3—Power Plane...
  • Page 17: Bottom Layer

    PCB Layout Figure 2 - 4. Bottom Layer Physical Description...
  • Page 18: Parts List

    3-pin power mate 95F5347 Newark P6, P13 4-pin power connector 93F7125 Newark 4-pin power mate 95F5348 Newark THS4503 8-SOP (D) THS4502ID Texas U2, U3 Instruments TRF3701 or TRF3702 16-RHC (QFN) TRF3701 or Texas TRF3702 Instruments Screws 4 - 40 screw...
  • Page 19: Circuit Description

    Chapter 3 Circuit Description This chapter discusses the various functions of the EVM. Topic Page Circuit Function ..........Circuit Description...
  • Page 20: Circuit Function

    I/Q signals via the op amp or directly to the input pins of TRF3701/TRF3702. Connectors J4, J8, J5, and J11 are for connecting the I/Q signals via the op amp, while connectors J7, J9, J10, and J12 are used to directly connect the signal source I/Q signals to the TRF3701/TRF3702.
  • Page 21: Power Supply J1

    Circuit Function Table 3 - 1. Power Supply J1 J1 Pin Description 5 V (V ), U1 analog supply 7 V, op amp supply AGND - 7 V, op amp supply Connectors J6 and J13 are used to supply the dc bias voltage to U1 I/Q input channels.
  • Page 23: Circuit Board Test Points

    Chapter 4 Circuit Board Test Points This chapter shows the circuit board test points. Topic Page Circuit Board Test Point Locations ......Circuit Board Test Points...
  • Page 24: Circuit Board Test Point Locations

    Circuit Board Test Point Locations 4.1 Circuit Board Test Point Locations When a quick indication of the dc-bias level and ac-signal level on the I/Q inputs is required, simply probe the appropriate test points in Figure 4 - 1 and Figure 4 - 2.
  • Page 25: Bottom Layer-Test Points Location

    Circuit Board Test Point Locations Figure 4 - 2. Bottom Layer—Test Points Location IREF ADJ QREF ADJ BOTTOM VIEW Circuit Board Test Points...
  • Page 27: Schematics

    Chapter 5 Schematics This chapter shows the EVM schematic. Schematics...
  • Page 28 IVIN (Sh 2) QREF2 + C3 (Note 1) .1uF QVIN 10uF 0.01uF 47 uF QVIN QVIN (Sh 2) TRF3701/02 IREF2 LO IN .1uF .1uF + C5 10uF IREF1 0.01uF 47 uF RF OUT 4.0V - 4.1V (Note 3) (Note 3)
  • Page 29 NOTES: 1. PART NOT INSTALLED 12500 TI Boulevard. Dallas, Texas 75243 2. REMOVE R6 AND R7 WHEN R17 AND R18 ARE INSTALLED Title: TRF3701/02 3. DEFAULT CONFIGURATION REPLACES CAPACITOR WITH A 0 OHM RESISTOR Engineer: P. MILLER DOCUMENTCONTROL # REV: Drawn By: Y.DEWONCK...

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Trf3702

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