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LASER BEAM SAFETY PRECAUTION
• Pickup that emits a laser beam is used on this CD section.
CAUTION :
USE OF CONTROLS OR ADJUSTMENTS OR
PERFORMANCE OF PROCEDURES OTHER
THAN THOSE SPECIFIED HEREIN MAY RESULT
IN HAZARDOUS RADIATION EXPOSURE.
LASER OUTPUT ................ 0.6 mW Max. (CW)
WAVE LENGTH ................. 790 nm
CAUTION – INVISIBLE LASER RADIATION WHEN OPEN AND
INTERLOCKS DEFEATED. AVOID EXPOSURE TO BEAM.
ADVARSEL – USYNLIG LASER STRÅLING VED ÅBNING, NÅR
SIKKERHEDSAFBRYDERE ER UDE AF FUNKTION, UNDGÅ UDS ÆTTELSE
FOR STRÅLING.
VARNING – OSYNLIG LASER STRÅLNING NÄR DENNA DEL ÄR ÖPPNAD
OCH SPÄRR ÄR URKOPPLAD. STRÅLEN ÄR FARLIG.
VORSICHT – UNSICHTBARE LASERSTRAHLUNG TRITT AUS, WENN
DECKEL GEÖFFNET UND WENN SICHERHEITSVERRIEGELUNG
ÜBERBRÜCKT IST. NICHT, DEM STRAHL AUSSETZEN.
VARO – AVATTAESSA JA SUOJALUKITUS OHITETTAESSA OLET ALTTIINA
NÄKYMÄTTÖMÄLLE LASERSÄTEILYLLE. ÄLÄ KATSO SÄTEESEEN.
WARNING
Do not use solder containing lead.
This product has been manufactured using lead-free solder in
order to help preserve the environment.
Because of this, be sure to use lead-free solder when carrying
out repair work, and never use solder containing lead.
Lead-free solder has a melting point that is 30 - 40°C (86 -
104°F) higher than solder containing lead, and moreover it
does not contain lead which attaches easily to other metals.
As a result, it does not melt as easily as solder containing
lead, and soldering will be more difficult even if the tempera-
ture of the soldering iron is increased.
The extra difficulty in soldering means that soldering time will
increase and damage to the components or the circuit board
may easily occur.
Because of this, you should use a soldering iron and solder
that satisfy the following conditions when carrying out repair
work.
Metal content
Tin(Sn)
Composition
96.5%
ratio by weight
All manuals and user guides at all-guides.com
Silver(Ag)
Copper(Cu)
3.0%
0.5%
- 1 -
Soldering iron
Use a soldering iron which is 70 W or equivalent, and which
lets you adjust the tip temperature up to 450°C (842°F). It
should also have as good temperature recovery characteris-
tics as possible.
Set the temperature to 350°C (662°F) or less for chip compo-
nents, to 380°C (716°F) for lead wires and similar, and to
420°C (788°F) when installing and removing shield plates.
The tip of the soldering iron should have a C-cut shape or a
driver shape so that it can contact the circuit board as flat or
in a line as much as possible.
Solder
Use solder with the metal content and composition ratio by
weight given in the table below. Do not use solders which do
not meet these conditions.
Note:
If replacing existing solder containing lead with lead-free solder
in the soldered parts of products that have been manufactured
up until now, remove all of the existing solder at those parts
before applying the lead-free solder.
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