F06S/F06T 2U System Contribution Table of Contents 1 INTRODUCTION ............................4 2 PRODUCT ARCHITECTURE OVERVIEW ..................... 7 F06S 2U4N System Produt Features ........................ 7 2.1.1 Product Features ............................7 2.1.2 System Block Diagram ..........................8 F06T 2U2N System Produt Features ........................ 9 2.2.1 Product Features ............................
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F06S/F06T 2U System Contribution 3.13 TPM ................................27 3.14 Serial port ..............................27 3.15 FANs ................................27 3.16 Jumper Definition ............................27 3.17 Debug header Information .......................... 29 3.17.1 XDP Support ............................29 3.17.2 SMB Debug Header (JP7) ........................29 3.17.3 BMC Debug Header (J1 and J10) ......................
F06S/F06T 2U System Contribution 1 INTRODUCTION Both F06S and F06T (family code name Carmel) are 2RU height systems with OCP compliant 2P server board for standard 19” EIA rack. F06S is a 2U4N System with four hot-pluggable motherboard Sleds while F06T is a 2U2N System with two hot-pluggable motherboard Sleds.
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F06S/F06T 2U System Contribution http://www.opencompute.org/wiki/Motherboard/SpecsAndDesigns ), and it connects with SFP+ connectors of OCP mezzanine v1 card or RJ45 connector of Intel I210 LOM. The BMC (Baseboard Management Controller) is used to manage the sled itself which supports both in-band management and out-of-band management through the sideband control of Ethernet LAN.
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F06S/F06T 2U System Contribution The figure below illustrates the functional block diagram of Facebook Server Intel motherboard Figure 1-4 Facebook Server Intel motherboard functional Block Diagram (quoted from Facebook Server Intel Next Generation Xeon motherboard v3.1, http://www.opencompute.org/wiki/Motherboard/SpecsAndDesigns The major differences between F06 OCP motherboard and Facebook Server Intel motherboard is as table 1-1 shown.
F06S/F06T 2U System Contribution 2 PRODUCT ARCHITECTURE OVERVIEW 2.1 F06S 2U4N System Produt Features 2.1.1 Product Features F06S 2U4N System’s ingredients and features are shown as follows. Item Features Form Factor 2U Chassis 31.1"x17.48"x3.44"(789.94 x 444 x 87.5mm) [LxW xH] Baseboard size / Quantity 20”...
F06S/F06T 2U System Contribution 2.2 F06T 2U2N System Produt Features 2.2.1 Product Features F06T 2U2N System’s ingredients and features are shown as follows. Board Name F06T 2U2N System Form Factor 2U Chassis (Carmel Chassis) 31.1"x17.48"x3.44"(789.94 x 444 x 87.5mm) [LxW xH] Baseboard size / Quantity 20”...
F06S/F06T 2U System Contribution 3 PRODUCT FEATURES 3.1 Processor The processor of Grantley platform is Xeon E5-2600 v3 and v4 (socket LGA2011 R3), the processor has internal voltage regulator (IVR). The key features are as shown below: Up to 18 cores (E5-2600 v3), 22 cores (E5-2600 v4) Up to 145W TDP Up to 10 x 4 PCIe Gen3 Support 4 channels DDR4 RDIMM/LRDIMM (total 16 DIMMs)
F06S/F06T 2U System Contribution 3.2.1 DIMM Nomenclature DIMMs are organized into physical slots on DDR4 memory channels that belong to processor sockets. The memory channels from Socket 0 (CPU-0) are identified as Channel A0~A7. The memory channels from Socket 1 (CPU-1) are identified as Channel B0~B7.
F06S/F06T 2U System Contribution 3.4 BMC The Board Management Controller of F06 OCP motherboard is adopting ASPEED AST1250 that is a highly integrated single-chip solution, integrating several devices typically found on servers. 3.5 Clocks The Grantley platform has three different clock architectures, external clock architecture (exCLK), integrated system clock (isCLK) architecture and hybrid architecture.
F06S/F06T 2U System Contribution 3.7 USB The C610 (PCH) supports total 14 USB ports, 6 USB 2.0 ports and 8 USB 3.0 ports. The USB port distribution is as follows: ASPEED BMC AST1250 occupies 2 USB 2.0 ports (one 1.1 and one 2.0-this one is reserved for AST2400, AST1250 won’t use USB2.0 channel) one Rear USB3.0 port is necessary for this project one Front-panel USB2.0 port is optional for 2U chassis...
F06S/F06T 2U System Contribution 3.8 PCIe BUS PCI Express* Gen1, Gen2 and Gen 3 are dual-simplex point-to point serial differential low-voltage interconnects. The signaling bit rate is 2.5 Gbit/s one direction per lane for Gen1 (8b/10b encoding), 5.0 Gb/s one direction per lane for Gen2 (8b/10b encoding) and 8.0 Gb/s one direction per lane for Gen3 (128b/130b encoding).
F06S/F06T 2U System Contribution PCIe Interface There are two types of Riser boards and Mezzanine board for the system. The follow table lists the details. Description F06S 2U4N System PCIe x24 Riser (1U) (1) PCIe Gen3 x16 Add-on Card support (per node) OCP Mezzanine (1) PCIe Gen3 x8 Mezzanine v1 connector (NCSI interface support)
F06S/F06T 2U System Contribution 3.9.1 PCIe Connector PIN Definition 3.9.1.1 PCIex24 Riser Slot PIN Definition Side B Golden Finger Side A Golden Finger Name Name +12v PRSNT#1 +12v +12v +12v +12v SMCLK REFCLK3+ SMDAT REFCLK3- +3.3v LAN_SMB_DAT LAN_SMB_CLK +3.3v 3.3Vaux +3.3v WAKE# PERST#...
F06S/F06T 2U System Contribution 3.12 LPC BUS The PCH implements an LPC interface as described in the Low Pin Count Interface Specification, Revision 1.1. The PCH LPC bus is used to connect to the BMC and to an optional TPM device. 3.13 TPM The PCH supports TPM specification 1.2 level2 revisions 103.
F06S/F06T 2U System Contribution 3.17 Debug header Information 3.17.1 XDP Support Standard XDP header mounted on F06 OCP motherboard for Intel Xeon E5 v3 processors (XDP) will be depopulated after production. 3.17.2 SMB Debug Header (JP7) SMB Debug Header is a SMB debug header which is connected to PCH’s HOST channel and BMC SMB channel 4. Figure 3-6 F06 OCP motherboard SMB debug Header 3.17.3 BMC Debug Header (J1 and J10) F06 OCP motherboard provides an interface to monitor BMC and host console by debug board, you need to plug...
F06S/F06T 2U System Contribution 3.18 Product Sensors Sensor Description TMP75 Inlet temperature sensor under F06S / F06T System (U65,Q25) TMP75 Outlet temperature sensor under F06S / F06T System (U1,Q2) AST1250 Monitor CPU / System voltage and temperature (BMC) Table 3-5 F06S OCP motherboard sensor list Figure 3-9 Sensors location (air flow direction)
F06S/F06T 2U System Contribution 3.19 SMBus The products must comply with the Intel Xeon E5 v3 platform SMBus architecture. This is a requirement in order to minimize BIOS / Firmware code development efforts and improve product board stability and debugging. Figure 3-10 F06 OCP motherboard BMC SMBus Block Diagram...
F06S/F06T 2U System Contribution 3.20 Power Consumption These are max values (where available) for board VR design purposes and system. TDP power estimate for the main components are provided in below table. Table 3-6 F06S 2U4N System power consumption Table 3-7 F06T 2U2N System power consumption 3.20.1 Power Supply PINOUT F06 motherboard Power Connector (J38) Name...
F06S/F06T 2U System Contribution 3.21 LED Definition 3.21.1 HDD Active LED Location D3 LED COLOR Description Silk Screen Label Status No access Hard drive activity. This LED shall illuminate when there is activity on Blink Green the motherboards SATA hard drive interfaces, or on-board mSATA and NGFF connector interface.
F06S/F06T 2U System Contribution 3.21.4 Debug Port Switch and LED UART Debug port switch selection mode. 3.21.5 BMC Heart beat LED Location D10 LED COLOR Description Silk Screen Label Status Green BMC not ready HEARTBEAT LED Blink Green BMC Active...
F06S/F06T 2U System Contribution 4 PRODUCT SYSTEM REQUIREMENTS F06S is at 2U height with 4x hot-plug Sleds and F06T is with 2x hot-plug Sleds. The Chassis will be enabled to complement the board offering and accommodate the marketing requirements of sled with 4 F06S sleds, peripheral boards, HDDs, FANs &...
The system BIOS and BMC FW are third party proprietary and will come with binary format along with F06S / F06T system. System BMC firmware is optional to use open BMC from Facebook or AMI based code upon the feedback from OCP community.
F06S/F06T 2U System Contribution Table 4-1 LED behavior of PSU 4.6 Fan Four dual-rotor & Hot swap 80mmx 56mm variable-speed Fans to meet the requirement of air-flow 125cfm for F06S system configurations. Fan signals are made available via a consolidated header on Fan board and The Fan control and Fan speed monitor are by chassis management controller: H8 on PDB.
F06S/F06T 2U System Contribution 4.8 Regulatory Compliance Specifications Planned safety and Electromagnetic Compatibility (EMC) certification are listed below but may be changed upon the feedback from OCP community. UL 60950-1, 2nd Edition CSA C22.2 No. 60950-1-07, 2nd Edition CB Scheme CB Certificate and Report to IEC 60950-1:2005, Second Edition and/or EN 60950-1: 2006 Taiwan...
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