Technical Explanation
SKYPER
®
1. Introduction ............................................................................................................................... 2
2.1 Block diagram ....................................................................................................................... 3
2.2 Application example .............................................................................................................. 4
2.2.1
Primary side ................................................................................................................... 4
2.2.2
Secondary side ............................................................................................................... 5
3.1 Dimensions .......................................................................................................................... 8
3.2 Plug-in connection ................................................................................................................. 8
3.3 Support post......................................................................................................................... 9
3.4 Solder connection .................................................................................................................. 9
3.5 Handling instructions ........................................................................................................... 10
4. Interface Description................................................................................................................. 11
4.1 Footprint ............................................................................................................................ 11
4.2 Pin assignment ................................................................................................................... 11
4.2.1
4.2.2
4.2.3
5. Protection features ................................................................................................................... 21
5.1 Failure management ............................................................................................................ 21
5.5.1
5.5.2
DSCP | Calculation hints ................................................................................................ 27
5.6 Active clamping................................................................................................................... 27
5.7 Soft Off .............................................................................................................................. 28
6. Electrical characteristic .............................................................................................................. 29
7. Product Qualification ................................................................................................................. 30
8. Environmental conditions .......................................................................................................... 31
9. Marking ................................................................................................................................... 32
10. Change history ......................................................................................................................... 33
© by SEMIKRON / 2019-07-23 / Technical Explanation / SKYPER
PROMGT.1026/ Rev.7/ Template Technical Explanation
Revision:
Issue date:
Prepared by:
Reviewed by:
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Keyword: IGBT driver core
®
42 LJ R
12
2019-07-23
Niklas Hofstötter
Daniel Obernöder
Marco Honsberg
Page 1/35
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