Reflow Soldering Curve; E32 Series - Ebyte E32-915T30S User Manual

Chengdu Ebyte Electronic Technology Co,;Ltd
Solder Paste
Preheat Temperature min （Tsmin）
Preheat temperature max (Tsmax)
Preheat Time (Tsmin to Tsmax)(ts)
Average ramp-up rate(Tsmax to Tp)
Liquidous Temperature (TL)
Time（tL）Maintained Above（TL）
Peak temperature（Tp）
Aveage ramp-down rate（Tp to Tsmax）
Time 25℃ to peak temperature

10.2 Reflow soldering curve

11 E32 series

Model No. Core IC
E32-868T20S SX1276
E32-915T20S SX1276
Copyright ©2012–2019，Chengdu Ebyte Electronic Technology Co.,Ltd.
Solder paste
Min preheating temp.
Mx preheating temp.
Preheating time
Average ramp-up rate
Liquid phase temp.
Time below liquid phase line
Peak temp.
Aveage ramp-down rate
Time to peak temperature for
25℃
Tx
Frequency
power
Hz
dBm
868M 20
915M 20
Sn63/Pb37
100℃
150℃
60-120 sec
3℃/second max
183℃
60-90 sec
220-235℃
6℃/second max
max 6 minutes
Distance
Data Rate
km
3 0.3k~19.2k
3 0.3k~19.2k
E32-915T30S user manual
Sn96.5/Ag3/Cu0.5
150℃
200℃
60-120 sec
3℃/second max
217℃
30-90 sec
230-250℃
6℃/second max
max 8 minutes
Size
Package
mm
SMD 16 * 26
SMD 16 * 26
Interface
UART
UART
18