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HP 25f Product End-Of-Life Disassembly Instructions page 2

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refractory ceramic fibers
Components, parts and materials containing
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Description #1 SCREW DRIVER(Plum flower head)
Description #2 Screwdriver
Description #3 Hex nut screwdriver
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Release base stand by pushing a white button then strip screw to separate base and hinge
2. Strip the screws from rear cover so that the rear cover can be removed , then remove deco
3. Remove all material under rear cover contain rear cover supporter
4. Separate main board and shielding
5. Release all materials and put some by ESD
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
EL-MF877-00
Template Revision B
PSG instructions for this template are available at
EL-MF877-01
0
Tool Size (if
applicable)
PH2
M5
Page 2

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