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Product End-of-Life Disassembly Instructions
Product Category: Monitors and Displays
Marketing Name / Model
[List multiple models if applicable.]
HP 25f 25-in Display
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
Batteries
Mercury-containing components
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm
Cathode Ray Tubes (CRT)
Capacitors / condensers (Containing PCB/PCT)
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
External electrical cables and cords
Gas Discharge Lamps
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Components and waste containing asbestos
Components, parts and materials containing
EL-MF877-00
Template Revision B
Notes
With a surface greater than 10 sq cm
All types including standard alkaline and lithium coin
or button style batteries
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
Includes background illuminated displays with gas
discharge lamps
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
PSG instructions for this template are available at
EL-MF877-01
Quantity
of items
included
in product
2
0
0
1
0
0
3
0
0
0
0
0
Page 1

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Summary of Contents for HP 25f

  • Page 1 Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
  • Page 2 refractory ceramic fibers Components, parts and materials containing radioactive substances 2.0 Tools Required List the type and size of the tools that would typically be used to disassemble the product to a point where components and materials requiring selective treatment can be removed. Tool Description Tool Size (if applicable)
  • Page 3: Appendix 3 Product End-Of-Life Disassembly Instructions

    HP 25f 25-inch Display Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the disassembly of HP products to remove components and materials requiring selective treatment. Items Requiring Selective Treatment Items listed below are classified as requiring selective treatment.
  • Page 4 Release all materials and put some by ESD; 3.2OPTIONAL: Depending upon the complexity of the disassembly process, a graphic depicting the locations of items contained within the product which require selective treatment (with descriptions and arrows identifying locations) can be inserted below: HP Restricted Page 2...
  • Page 5 Step 1 Quick release Base stand (1).Pull out base and stand Press the white button a. Press white button with one hand b. Pull out stand & base with another hand (2).Disassy base and stand Twist out the screw HP Restricted Page 3...
  • Page 6 Step 2: Strip the screws from rear cover, then move rear cover follow the below way ,at last remove deco Dismantle the rear cover first from the two marked position Remove the screws with Screwdriver Remove the 8pin FFC from main board then remove rear cover HP Restricted Page 4...
  • Page 7 Step 3: To remove the shielding(contain the other material ); (3.1) Dismantle the rear cover supporter (3.2) Pull out the LVDS/ LED FFCs to separate the base assembly from the unit; (3.3) Remove the four screws to separate shielding from CB HP Restricted Page 5...
  • Page 8 24-07-201 Step 4: Strip the screws *8pcs HP Restricted Page 6...
  • Page 9 24-07-201 Step 5: Release all materials and put some by ESD; Can follow the picture as bellow; HP Restricted Page 7...