Production Guidance; Reflow Soldering Temperature - Ebyte E220-900M22S Manual

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7 Production guidance

7.1 Reflow soldering temperature

Profile Feature
Solder Paste
Preheat Temperature min （Tsmin）
Preheat temperature max (Tsmax)
Preheat Time (Tsmin to Tsmax)(ts)
Average ramp-up rate(Tsmax to Tp)
Liquidous Temperature (TL)
Time（tL）Maintained Above（TL）
Peak temperature（Tp）
Aveage ramp-down rate（Tp to Tsmax）
Time 25℃ to peak temperature
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Curve characteristics
Solder paste
Minimum preheating
temperature
Maximum preheating
temperature
Preheating time
Average rising rate
Liquid temperature
Time above liquidus
Peak temperature
Average descent rate
Time from 25 ℃ to peak
temperature
E220-900M22S User Manual
Sn-Pb Assembly
Sn63/Pb37
100 degrees
150 degrees.
60-120 sec
3℃/second max
183 degrees.
60-90 sec
220-235 degrees
6℃/second max
6 minutes max
Pb-Free Assembly
Sn96.5/Ag3/Cu0.5
150 degrees.
200 degrees
60-120 sec
3℃/second max
217 degrees.
30-90 sec
230 to 250 degrees.
6℃/second max
8 minutes max
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