Solder Mask; Placement - Panasonic INDUSTRY PAN9028 Integration Manual

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PAN9028 Wi-Fi/Bluetooth Module

3.4 Solder Mask

It is recommended to use the following layout for the soldering mask to reduce voids on the
thermal pads. Use the dimensions:
 The Resist Mask should be 50 µm bigger than the pad size (
 The Solder Mask should be 50 µm smaller than the pad size (
separated in two semi circles with 300 µm distance and a shifting about 150 µm.

3.5 Placement

Antenna "Keep out Area"
Do not place any ground plane under the marked restricted antenna area in
any layer! This would be affecting the performance of the chip antenna in a
critical manner.
Impact of Placement on the Antenna Radiation Pattern
The placement of the module, surrounding material, and customer
components has an impact on the radiation pattern of the antenna.
The recommendation for the ground plane is based on a FR4 4-Layer PCB.
The following requirements must be met:
 Keep this product away from heat. Heat is the major cause of decreasing the life of these
products.
 Keep this product away from other high frequency circuits.
Module Integration Guide Rev. 1.0
3.3
3.3
Layout
3 PAN9028 Module
Footprint).
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