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Components, parts and materials containing
refractory ceramic fibers
Components, parts and materials containing
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Description #1crisscross screw driver
Description #2 hexagon screw driver
Description #3 electric iron
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1.
Release the screw on the access panel.
2. Remove access panel from the unit.
3. Remove front bezel from the unit.
4. Remove the heat sink cover from unit.
5. Remove HDD / ODD cable from the unit.
6. Remove ODD from the unit.
7. Remove HDD cage from the unit.
8. Remove HDD from HDD cage.
9. Remove PCA power cable and system fan cable from PCA.
10. Take out PCA from unit.
11. Remove cooler from PCA.
12. Remove memory from PCA
13. Take off PSU and system fan from the unit.
14. Open the PSU and take off the PSU fan.
15. Take off PCA from the PSU.
16. Take off CAP using electric iron..
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
EL-MF877-00
Template Revision B
PSG instructions for this template are available at
1. Release the screw on
the access panel.
EL-MF877-01
0
0
Tool Size (if
applicable)
2#
T15
QUICK 310
Page 2
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