Basic Operation; Hardware Design; Software Programming - Ebyte E01C-ML01SP4 User Manual

Si24r1 + 2.4 ghz 100mw spi smd wireless module
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4 Basic operation

4.1 Hardware design

It is recommended to use a DC stabilized power supply. The power supply ripple factor is as small as possible,
and the module needs to be reliably grounded;
Please pay attention to the correct connection of the positive and negative poles of the power supply. Reverse
connection may cause permanent damage to the module;
Please check the power supply to ensure it is within the recommended voltage otherwise when it exceeds the
maximum value the module will be permanently damaged;
Please check the stability of the power supply, the voltage cannot be fluctuated frequently;
When designing the power supply circuit for the module, it is often recommended to reserve more than 30% of
the margin, so the whole machine is beneficial for long-term stable operation;
The module should be as far away as possible from the power supply, transformers, high-frequency wiring and
other parts with large electromagnetic interference;
Bottom Layer;High-frequency digital routing, high-frequency analog routing, and power routing must be
avoided under the module. If it is necessary to pass through the module, assume that the module is soldered to
the Top Layer, and the copper is spread on the Top Layer of the module contact part(well grounded), it must be
close to the digital part of the module and routed in the Bottom Layer;
Assuming the module is soldered or placed over the Top Layer, it is wrong to randomly route over the Bottom Layer or
other layers, which will affect the module's spurs and receiving sensitivity to varying degrees;
It is assumed that there are devices with large electromagnetic interference around the module that will greatly
affect the performance. It is recommended to keep them away from the module according to the strength of the
interference. If necessary, appropriate isolation and shielding can be done;Assume that there are traces with
large electromagnetic interference (high-frequency digital, high-frequency analog, power traces) around the
module that will greatly affect the performance of the module. It is recommended to stay away from the
module according to the strength of the interference. If necessary, appropriate isolation and shielding can be
done;
Try to stay away from some physical layers such as TTL protocol at 2.4GHz , for example: USB3.0;
The antenna installation structure has a great impact on the performance of the module. Be sure to ensure that the
antenna is exposed, preferably vertically.When the module is installed inside the case, a high-quality antenna
extension cable can be used to extend the antenna to the outside of the case;
Do not install the antenna inside the metal case,it will greatly reduce the transmission distance.

4.2 Software programming

This module is SI24R1+PA+LNA, and its driving mode is exactly the same as SI24R1. Users can operate in
full accordance with the SI24R1 chip manual (see the SI24R1 manual for details);
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E01C-ML01SP4 User Manual
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