Titan LE940B6 Hw User Manual
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Titan LE940B6 Hw User Manual

Titan LE940B6 Hw User Manual

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LE940B6
HW User Guide
Rev.2.2 – 2020-01-10

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Summary of Contents for Titan LE940B6

  • Page 1 LE940B6 HW User Guide Rev.2.2 – 2020-01-10...
  • Page 2 Titan does not assume any liability arising out of the application or use of any product, software, or circuit described herein; neither does it convey license under its patent rights or the rights of others.
  • Page 3 USAGE AND DISCLOSURE RESTRICTIONS I. License Agreements The software described in this document is the property of Titan and its licensors. It is furnished by express license agreement only and may be used only in accordance with the terms of such an agreement.
  • Page 4 LE940B6 HW User Guide TITAN HEREBY DISCLAIMS ANY AND ALL WARRANTIES EXPRESS OR IMPLIED FROM ANY THIRD PARTIES REGARDING ANY SEPARATE FILES, ANY THIRD PARTY MATERIALS INCLUDED IN THE SOFTWARE, ANY THIRD PARTY MATERIALS FROM WHICH THE SOFTWARE IS DERIVED (COLLECTIVELY “OTHER CODE”), AND...
  • Page 5 LE940B6-NA AUTO North America regional variant (AT&T and T-Mobile) LE940B6-NV AUTO North America region variant (Verizon, AT&T and T- Mobile) LE940B6-RW AUTO Rest of World variant (Europe, APAC, Latin America and more) LE940B6-CN AUTO China variant Rev. 2.02 Page 5 of 111...

  • Page 6: Table Of Contents

    2.7.2. Weight ......................22 LE940B6 MODULE CONNECTIONS ............23 Pin-out ......................23 LE940B6 Signals That Must Be Connected ........... 40 LGA Pads Layout.................... 42 ELECTRICAL SPECIFICATIONS ..............43 Absolute Maximum Ratings – Not Operational ..........43 Recommended Operating Conditions ............. 43 Logic Level Specifications ................
  • Page 7 LE940B6 HW User Guide HARDWARE COMMANDS ................47 Turning on the LE940B6 Module ..............47 Initialization and Activation State ..............47 Turning off the LE940B6 Module ..............51 5.3.1. Shutdown by Software Command ..............52 5.3.2. Hardware Shutdown ..................53 5.3.3.
  • Page 8 Recommendations for PCB Pad Dimensions (mm) ........91 Solder Paste ....................92 10.7.1. Solder Reflow ....................92 APPLICATION GUIDE ................... 94 Debug of the LE940B6 Module in Production ..........94 Bypass Capacitor on Power Supplies ............. 95 SIM Interface ....................96 11.3.1. SIM Schematic Example................. 96 EMC Recommendations .................
  • Page 9 LE940B6 HW User Guide FCC/IC Regulatory Notices ................102 RED Regulatory Notices ................104 SAFETY RECOMMENDATIONS ..............106 ACRONYMS ....................107 DOCUMENT HISTORY ................109 Rev. 2.02 Page 9 of 111 2020-01-10...

  • Page 10: Introduction

    All the features and solutions detailed in this document are applicable to all LE940B6 variants, where “LE940B6” refers to the variants listed in the applicability table. If a specific feature is applicable to a specific product only, it will be clearly marked.

  • Page 11: Contact Information, Support

    For more information about Titan visit: http://www.tustitan.com To register for product news and announcements or for product questions contact Titan Technical Support. Our aim is to make this guide as helpful as possible. Keep us informed of your comments and suggestions for improvements.

  • Page 12: Related Documents

    LE940B6 HW User Guide Related Documents Table 2: Related Documents Document Title Document Number Ref 1: LE940B6 AT Command Reference Guide 80514ST10767A Ref 2: LE940B6 SW User Guide 1VV0301296 Ref 3: Titan EVK2 User Guide 1vv0300704 Ref 4: SIM Integration Design Guide...
  • Page 13 LE940B6 HW User Guide Chapter# Chapter Title Description Application Guide Packing System Conformity Assessment Issues Safety Recommendations Acronyms16 Document History Rev. 2.02 Page 13 of 111 2020-01-10...

  • Page 14: Product Description

    Designed for automotive markets quality needs In its most basic use case, LE940B6 can be applied as a wireless communication front- end for telematics products, offering GNSS and mobile communication features to an external host CPU through its rich interfaces.

  • Page 15: General Functionality And Main Features

    LE940B6 HW User Guide General Functionality and Main Features The LE940B6 family of automotive cellular modules features an LTE and multi-RAT modem together with a powerful on-chip application processor and a rich set of interfaces. The major functions and features are listed below: •...

  • Page 16: Environmental Requirements

    2.4.2. RoHS Compliance As a part of the Titan corporate policy of environmental protection, the LE940B6 complies with the RoHS (Restriction of Hazardous Substances) directive of the European Union (EU directive 2011/65/EU). Rev. 2.02 Page 16 of 111...

  • Page 17: Operating Frequency Bands

    2.5.1. RF Bands per Regional Variant Table 4 summarizes all region variants within the LE940B6 family, showing the supported band sets in each variant and the supported band pairs for 2x carrier aggregation. Table 4: RF Bands per Regional Variant...

  • Page 18: Reference Table Of Rf Bands Characteristics

    LE940B6 HW User Guide 2.5.2. Reference Table of RF Bands Characteristics Table 5: RF Bands Characteristics Mode Freq. Tx Freq. Rx Channels Tx-Rx (MHz) (MHz) Offset PCS 1900 1850.2 ~ 1930.2 ~ 512 ~ 810 80 MHz 1909.8 1989.8 DCS 1800 1710.2 ~...
  • Page 19 LE940B6 HW User Guide Mode Freq. Tx Freq. Rx Channels Tx-Rx (MHz) (MHz) Offset TDSCDMA 2000 2010 ~ 2025 2010 ~ 2025 Tx: 10050 ~ 0 MHz – B34 10125 Rx: 10050 ~ 10125 TDSCDMA 1900 1880 ~ 1920 1880 ~ 1920...
  • Page 20 LE940B6 HW User Guide Mode Freq. Tx Freq. Rx Channels Tx-Rx (MHz) (MHz) Offset LTE 700a – B12 699 ~ 716 729 ~ 746 Tx : 23010 ~ 30 MHz 23179 Rx : 5010 ~ 5179 LTE 700c – B13...

  • Page 21: Sensitivity

    2496 ~ 2690 Tx: 39650 ~ 0 MHz 41589 Rx: 39650 ~ 41589 Sensitivity LE940B6 maximum sensitivity levels are as follows (exact performance figures will be specified at a later stage): • < 3GPP @ 2G • < 3GPP @ 3G •...

  • Page 22: Le940B6 Mechanical Specifications

    40 mm, +/- 0.20 mm tolerance • Width: 40 mm, +/- 0.20 mm tolerance • Thickness: 3.0 mm, +/- 0.15 mm tolerance (with label) 2.7.2. Weight The nominal weight of the LE940B6 module is 11 gram. Rev. 2.02 Page 22 of 111 2020-01-10...

  • Page 23: Le940B6 Module Connections

    LE940B6 HW User Guide LE940B6 Module Connections Pin-out Table 6: LE940B6 Pin-out Signal Function Type Comment USB HS 2.0 Communication Port Power sense for the internal USB_VBUS USB transceiver USB_D+ USB differential data (+) USB_D- USB differential data (-) Asynchronous UART...
  • Page 24 LE940B6 HW User Guide Signal Function Type Comment Auxiliary UART (Rx Data AD19 RXD_AUX 1.8V from DTE) Asynchronous UART3 Serial data input (TXD) from UART3_TXD 1.8V Serial data output (RXD) to AM11 UART3_RXD 1.8V Input for Request To Send AM13 UART3_RTS 1.8V...
  • Page 25 LE940B6 HW User Guide Signal Function Type Comment JTAG_PTI_DATA MiPi Data 2 1.8V JTAG_PTI_DATA MiPi Data 3 1.8V SIM Card Interface External SIM signal – Power 1.8/2.9 SIMVCC1 supply for the SIM 1.8/2.9 External SIM signal – Clock SIMCLK1 External SIM signal –...
  • Page 26 LE940B6 HW User Guide Signal Function Type Comment Earphone signal output, EAR1_MT- phase - MIC1_MT+ Microphone input, phase + MIC1_MT- Microphone input, phase - MIC_BIAS Microphone Bias Power Digital Voice Interface (DVI) DVI_RX Digital Voice interface (Rx) 1.8V Digital Voice interface (CLK DVI_CLK 1.8V...
  • Page 27 LE940B6 HW User Guide Signal Function Type Comment GPIO_04 GPIO_04 1.8V GPIO_05 GPIO_05 1.8V GPIO_06 GPIO_06 1.8V GPIO_07 GPIO_07 1.8V GPIO_08 GPIO_08 1.8V GPIO_09 GPIO_09 1.8V GPIO_10 GPIO_10 1.8V GPIO_11 GPIO_11 1.8V GPIO_12 GPIO_12 1.8V GPIO_20 GPIO_20 1.8V GPIO_21 GPIO_21 1.8V...
  • Page 28 LE940B6 HW User Guide Signal Function Type Comment 2.5/3.3 MAC_TXD[1] RGMII or RMII TXD[1] 2.5/3.3 MAC_TXD[2] RGMII TXD[2] 2.5/3.3 MAC_TXD[3] RGMII TXD[3] 2.5/3.3 MAC_GTX_CLK RGMII Transmit Clock RGMII Transmit Enable / 2.5/3.3 MAC_TXEN_ER Error or RMII Transmit Enable 2.5/3.3 AL16...
  • Page 29 LE940B6 HW User Guide Signal Function Type Comment ANT_GPS GPS Antenna Miscellaneous Functions VRTC VRTC Backup capacitor VIO_1.8V for reference VIO_1.8V 1.8V voltage RESET_N Reset Input Active low Indicates that the boot AN10 SW_RDY sequence completed 1.8V successfully Unconditional Shutdown...
  • Page 30 LE940B6 HW User Guide Signal Function Type Comment Main Power Supply (RF AT18 VBATT_PA Power Transmit Power Section) Main Power Supply (RF AU17 VBATT_PA Power Transmit Power Section) Main Power Supply (RF AU19 VBATT_PA Power Transmit Power Section) Main Power Supply (RF...
  • Page 31 LE940B6 HW User Guide Signal Function Type Comment Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground...
  • Page 32 LE940B6 HW User Guide Signal Function Type Comment AN18 Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground AP11 Ground Ground AP13 Ground Ground AP15 Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground AR10 Ground Ground AR12...
  • Page 33 LE940B6 HW User Guide Signal Function Type Comment Ground Ground AT10 Ground Ground AT12 Ground Ground AT14 Ground Ground AT16 Ground Ground Ground Ground Ground Ground Ground Ground AU11 Ground Ground AU15 Ground Ground Ground Ground Ground Ground Ground Ground...
  • Page 34 LE940B6 HW User Guide Signal Function Type Comment Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground AV10 Ground Ground AV12 Ground Ground AV14 Ground Ground AV16 Ground Ground...
  • Page 35 LE940B6 HW User Guide Signal Function Type Comment Ground Ground AA10 Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground AA12 Ground Ground ZZ101 Ground Ground B101 Ground Ground D101 Ground Ground U101 Ground Ground...
  • Page 36 LE940B6 HW User Guide Signal Function Type Comment Y102 Ground Ground AR10 Ground Ground AT102 Ground Ground AV102 GND Ground Ground Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved AN14 Reserved Reserved Reserved Reserved Reserved Reserved Reserved...
  • Page 37 LE940B6 HW User Guide Signal Function Type Comment Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved AH17 Reserved Reserved Reserved Reserved AF17...
  • Page 38 LE940B6 HW User Guide Signal Function Type Comment AC20 Reserved Reserved AE20 Reserved Reserved AG20 Reserved Reserved AJ20 Reserved Reserved AA16 Reserved Reserved Reserved Reserved ZZ11 Reserved Reserved ZZ13 Reserved Reserved ZZ15 Reserved Reserved ZZ17 Reserved Reserved Reserved Reserved Reserved...
  • Page 39 When the UART signals are used as the communication port between the host and the modem: • The DTR pin must be connected to enter LE940B6 power saving mode. • The RI pin must be connected to wake up the host when a call is coming while the host is in Sleep mode.

  • Page 40: Le940B6 Signals That Must Be Connected

    The only exceptions are listed in the following section: LE940B6 Signals That Must Be Connected. LE940B6 Signals That Must Be Connected Table 7 lists the LE940B6 signals that must be connected even if not used by the end application: Table 7: Mandatory Signals...
  • Page 41 LE940B6 HW User Guide Signal Notes AH19 C103/TXD If not used, connect to a test point AF19 C104/RXD If not used, connect to a test point AA18 C105/RTS If flow control is not used, connect to GND AK19 C106/CTS If not used, connect to a test...

  • Page 42: Lga Pads Layout

    LE940B6 HW User Guide LGA Pads Layout Figure 2: LGA Pads Layout LE940B6 334 Pads Top View GPIO_2 GPIO_2 ANT_GP ON_OFF ANT_1 MIC1_M JTAG_R JTAG_T JTAG_T RST_N JTAG_R MIC1_M JTAG_T JTAG_T JTAG_T STAT_L ESOUT_ RIGIN JTAG_P JTAG_P JTAG_P JTAG_P EAR1_M...

  • Page 43: Electrical Specifications

    LE940B6 HW User Guide Electrical Specifications Absolute Maximum Ratings – Not Operational WARNING: A deviation from the value ranges listed below may harm the LE940B6 module. Table 8: Absolute Maximum Ratings – Not Operational Symbol Parameter Unit VBATT Battery supply voltage on pin VBATT -0.3...

  • Page 44: Logic Level Specifications

    LE940B6 HW User Guide Logic Level Specifications Unless otherwise specified, all the interface circuits of the LE940B6 are 1.8V CMOS logic. Only few specific interfaces (such as MAC, USIM and SD Card) are capable of dual voltage I/O. The following tables show the logic level specifications used in the LE940B6 interface circuits.

  • Page 45: V/2.9V Sim Pads

    LE940B6 HW User Guide Parameter Output low level 0.36V 4.3.3. 1.8V/2.9V SIM Pads Table 13: Operating Range – 1.8V SIM Pads Parameter Input high level 1.26V 2.1V Input low level -0.3V 0.36V Output high level 1.26V 2.1V Output low level -0.3V...

  • Page 46: 2.5V/3.3V Emac Interface For Rmii And Rgmii

    LE940B6 HW User Guide 4.3.5. 2.5V/3.3V EMAC Interface for RMII and RGMII Table 16: Absolute Maximum Ratings – 3.3V EMAC Interface Parameter Input level on 3.3V EMAC when on -0.3V 3.6V Table 17: Operating Range – 2.5V EMAC Interface Parameter Input high level 1.7V...

  • Page 47: Hardware Commands

    Hardware Commands Turning on the LE940B6 Module To turn on the LE940B6 module, the ON_OFF_N pad must be asserted low in the range of 80 - 120 milliseconds and then released. Figure 3 illustrates a simple circuit to power on the module using an inverted buffer output.
  • Page 48 OFF State Initialization State Activation State NOTE: To check whether the LE940B6 has completely powered on, monitor the SW_RDY hardware line. When SW_RDY goes high, the module has completely powered on and is ready to accept AT commands. NOTE: Do not use any pull-up resistor on the ON_OFF_N line as it is internally pulled up.
  • Page 49 LE940B6 HW User Guide Figure 5 shows a flow chart for the proper power-up procedure: Figure 5: Power-up Flow Chart Modem ON Procedure START VBATT > 3.4V ? VAUX/PWRMON = ON? ON_OFF_N = LOW Go to 80 ms < Hold Time < 120 ms...
  • Page 50 LE940B6 HW User Guide Figure 6 shows a flow chart illustrating the AT commands managing procedure. Figure 6: AT Command Managing Flow Chart Start AT CMD START Delay 300 ms Enter AT <CR> Go to AT Answer in HW SHUTDOWN...

  • Page 51: Turning Off The Le940B6 Module

    LE940B6 HW User Guide Turning off the LE940B6 Module Turning off the device can be done in four different ways: • Shutdown by software command using AT#SHDN command • Hardware shutdown using ON_OFF_N pad • Hardware Unconditional Reset using the RESET_N pad •...

  • Page 52: Shutdown By Software Command

    Shutdown by Software Command The LE940B6 module can be shut down by a software command. When a shutdown command is sent, LE940B6 goes into the Finalization state and at the end of the finalization process shuts down VAUX/PWRMON. The duration of the Finalization state can differ according to the current situation of the module, so a value cannot be defined.

  • Page 53: Hardware Shutdown

    LE940B6 HW User Guide 5.3.2. Hardware Shutdown To turn off the LE940B6 module, the ON_OFF_N pad must be asserted low in the range of 1150 - 1250 milliseconds and then released. Use the same circuitry and timing for power-on. When the ON_OFF_N is asserted low for a period in the range 1150 - 1250 milliseconds and then released, LE940B6 goes into the Finalization state and in the end shuts down VAUX/PWRMON.

  • Page 54: Unconditional Hardware Reset (Reset_N)

    LE940B6 HW User Guide 5.3.3. Unconditional Hardware Reset (RESET_N) To unconditionally restart the LE940B6 module, the RESET_N pad must be tied low in the range 1300 - 1800 milliseconds and then released. Figure 9 shows a simple circuit for this action.

  • Page 55: Unconditional Hardware Shutdown

    LE940B6 HW User Guide 5.3.4. Unconditional Hardware Shutdown To unconditionally shut down the LE940B6 module, the SHDN_N pad must be tied low for at least 200 milliseconds and then released. Figure 10 shows a simple circuit for applying an unconditional shutdown.
  • Page 56 LE940B6 HW User Guide Figure 11 shows a flow chart of the proper turn off procedure. Figure 11: Turn Off Procedure Rev. 2.02 Page 56 of 111 2020-01-10...

  • Page 57: Power Supply

    Nominal supply voltage 3.8V 3.4V – 4.2V Supply voltage range Max ripple on module input supply 30 mV Table 20 provides typical current consumption values of LE940B6 for the various available modes. Table 20: LE940B6 Current Consumption Mode Average Mode Description (Typ.)
  • Page 58 LE940B6 HW User Guide Mode Average Mode Description (Typ.) Operative Mode (LTE) 350 mA LTE data call (Non-CA BW 5 MHz, RB=1) 600 mA LTE data call (CA BW 20 + 20 MHz, Full RB, FDD 300 Mbps DL / 50 Mbps UL) without Ethernet cable connection and Loopback mode.
  • Page 59 LE940B6 HW User Guide Mode Average Mode Description (Typ.) Operative Mode (GSM) GSM Tx and Rx mode GSM 850/900 360 mA GSM voice call GSM 1800/1900 300 mA GPRS 4 Tx + 1 Rx GSM 850/900 750 mA GPRS Sending Data mode (CS-4)

  • Page 60: General Design Rules

    • A bypass low ESR capacitor of adequate capacity must be provided to cut the current absorption peaks close to the LE940B6 module. A 100 μF tantalum capacitor is usually suitable on both VBATT and VBATT_PA power lines. •...

  • Page 61: Input Source Power Supply - Design Guidelines

    • A protection diode must be inserted close to the power input to protect the LE940B6 module from power polarity inversion. This can be the same diode as for spike protection. Rev. 2.02...
  • Page 62 LE940B6 HW User Guide Figure 13 and Figure 14 show an example of switching regulator with 12V input. Figure 13: Example of Switching Regulator with 12V Input – Part 1 Figure 14: Example of Switching Regulator with 12V Input – Part 2 Rev.

  • Page 63: Battery Source Power Supply - Design Guidelines

    LE940B6 module. NOTE: Do not use any Ni-Cd, Ni-MH, and Pb battery types directly connected to the LE940B6 module. Their use can lead to overvoltage on the LE940B6 and damage it. Use only Li-Ion battery types. •...

  • Page 64: Power Supply Pcb Layout Guidelines

    The current consumption is up to about 1250 mA continuously at the maximum Tx output power (23 dBm). Therefore, make sure on the PCB used to mount LE940B6, that the area under the LE940B6 module is as large as possible. Make sure that the LE940B6 is mounted on the large ground area of application board and provide many ground vias to dissipate the heat.
  • Page 65 LE940B6 HW User Guide • The power supply input cables must be kept separate from noise sensitive lines, such as microphone/earphone cables. Rev. 2.02 Page 65 of 111 2020-01-10...

  • Page 66: Antenna(S)

    LE940B6 antenna pad (AD1) by a transmission line implemented on the PCB. If the antenna is not directly connected to the antenna pad of the LE940B6, a PCB line is required to connect to it or to its connector.

  • Page 67: Gsm/Wcdma/Td-Scdma/Lte Antenna - Installation Guidelines

    RF exposure compliance. OEM integrators must ensure that the end user has no manual instructions to remove or install the LE940B6 module. Antennas used for this OEM module must not exceed 3dBi gain for mobile and fixed operating configurations.

  • Page 68: Secondary Antenna Requirements

    LE940B6 antenna pad by means of a transmission line implemented on the PCB. If the antenna is not directly connected at the antenna pad of the LE940B6 (AU9), a PCB line is required to connect to it or to its connector.

  • Page 69: Transmission Line Measurements

    LE940B6 HW User Guide A characteristic impedance of nearly 50 Ω is achieved using trace width = 1.1 mm, clearance from coplanar ground plane = 0.3 mm on each side. The line uses a reference ground plane on Layer 3, while copper is removed from Layer 2 underneath the line.
  • Page 70 LE940B6 HW User Guide Figure 16 illustrates the return loss plot of line under test. Figure 16: Return Loss Plot of Line Under Test Figure 17 shows the line input impedance (in Smith Chart format, once the line has been terminated to a load of 50 Ω) .

  • Page 71: Hardware Interfaces

    LE940B6 HW User Guide Hardware Interfaces Table 23 summarizes all the hardware interfaces of the LE940B6 module. Table 23: LE940B6 Hardware Interfaces LE940B6 (XMM7272 CAT6) Ethernet RMII/RGMII USB2.0 Master only, up to 26 MHz (104 MHz @ Kernel CLK/4) For sensors, audio control UART x1 UART for AT (up to 4.8 Mbps)

  • Page 72: Usb Port

    With the LE940B6 module, firmware updates by the host are only possible via USB and not possible via UART. The reason is that Titan considers it impractical to transfer firmware binaries exceeding 100Mb via UART. The USB port is typically the main interface between the LE940B6 module and OEM hardware. NOTE: The USB_D+ and USB_D- signals have a clock rate of 480 MHz.
  • Page 73 At least test points of the USB signals are required since the USB physical communication is needed in the case of SW update. WARNING: Consider placing low-capacitance ESD protection device to protect LE940B6 against ESD strikes. If an ESD protection should be added, the suggested connectivity is as follows: Figure 18: ESD Protection for USB2.0...

  • Page 74: Serial Ports

    LE940B6 HW User Guide Serial Ports The serial port is typically a secondary interface between the LE940B6 module and OEM hardware. The following serial ports are available on the module: • Modem Serial Port 1 (Main) • Modem Serial Port 2 (Auxiliary) •...

  • Page 75: Modem Serial Port 2

    TXD/ RX_UART) of the LE940B6 serial port and vice versa for Rx. 8.2.2. Modem Serial Port 2 On the LE940B6, Serial Port 2 is a +1.8V UART with Rx and Tx signals only. Table 26 lists the signals of the LE940B6 Serial Port 2. Table 26: Modem Serial Port 2 Signals...

  • Page 76: Modem Serial Port 3

    Modem Serial Port 3 Serial port 3 is a +1.8V UART with all 4 RS232 signals. It differs from the PC-RS232 in the signal polarity (RS232 is reversed) and levels. Table 27 lists the signals of the LE940B6 Serial Port 3.

  • Page 77: Rs232 Level Translation

    LE940B6 HW User Guide 8.2.4. RS232 Level Translation To interface the LE940B6 with a PC COM port or an RS232 (EIA/TIA-232) application, a level translator is required. This level translator must perform the following actions: • Invert the electrical signal in both directions •...
  • Page 78 LE940B6 HW User Guide As an example, RS232 level adaption circuitry could use a MAXIM transceiver (MAX218). In this case, the chipset is capable of translating directly from 1.8V to the RS232 levels (example on 4 signals only). Figure 19: RS232 Level Adaption Circuitry Example...

  • Page 79: Peripheral Ports

    LE940B6 HW User Guide Peripheral Ports In addition to the LE940B6 serial ports, the LE940B6 supports the following peripheral ports: • SPI – Serial Peripheral Interface • I2C - Inter-integrated circuit • Ethernet – Ethernet PHY Interface SPI – Serial Peripheral Interface 8.3.1.

  • Page 80: I2C - Inter-Integrated Circuit

    8.3.2. I2C - Inter-integrated Circuit The LE940B6 I2C is an alternate function of GPIO 1-15 pins. Available only from Modem side as SW emulation of I2C on GPIO lines. Any GPIO can be configured as SCL or SDA. LE940B6 supports I2C Master Mode only.
  • Page 81 LE940B6 HW User Guide Signal Function Type Comment MAC_GTX_CLK RGMII Transmit Clock 2.5/3.3V MAC_TXEN_ER RGMII Transmit Enable /Error 2.5/3.3V or RMII Transmit Enable AL16 MAC_RXD[0] RGMII or RMII RXD[0] 2.5/3.3V AJ16 MAC_RXD[1] RGMII or RMII RXD[1] 2.5/3.3V AG16 MAC_RXD[2] RGMII RXD[2] 2.5/3.3V...

  • Page 82: Audio Interface

    The LE940B6 module supports analog and digital audio interfaces. 8.5.1. Analog Audio The LE940B6 module provides an analog audio interface, a single differential input for the audio to be transmitted (Uplink), and a balanced output for the received audio (Downlink). The analog interface is on the following pins:...

  • Page 83: General Purpose I/O

    Input pads can only be read, reporting digital values (high / low) present at the reading time. Output pads can only be written or queried and set values on the pad output. Alternative function can be internally controlled by LE940B6 firmware and act according to the implementation.

  • Page 84: Using A Gpio Pad As Input

    HIGH logic level signal applied to the digital pins of the module when it is powered OFF or during an ON/OFF transition. NOTE: LE940B6 GPIOs can also be used as alternate I2C function. Refer to Section 8.3.2, I2C - Inter-integrated Circuit.

  • Page 85: Miscellaneous Functions

    In the LE940B6 module, the STAT_LED usually needs an external transistor to drive an external LED. The status indicated in Table 33 is configurable. Refer to Ref 1: LE940B6 AT Command Reference Guide for the full description of this function.

  • Page 86: Vaux Power Output

    An AT command is available to use the ADC function. The command is AT#ADC=1,2. The read value is expressed in mV. Refer to Ref 1: LE940B6 AT Command Reference Guide for the full description of this function. Using the Temperature Monitor Function The Temperature Monitor supports temperature monitoring by giving periodic temperature indications, to execute some function at extreme state.

  • Page 87: Fuel Gauge (Tbd)

    GPIO (Wake up) Alert Out eFuse The LE940B6 module needs 1.8 +/- 0.05V applied on Pad VPP(H17) for eFuses to be programmed. The fuse voltage must be applied to VPP(H17) prior to the fuse script being started, and must be removed after the fuse operation has been completed.

  • Page 88: Mounting The Module On Your Board

    Mounting the Module on your Board General The LE940B6 module is designed to be compliant with a standard lead-free soldering process as defined in JESD22b102d, table 3b. The number of reflows must not exceed two. This limits Tmax to 245 °C.

  • Page 89: Recommended Footprint For The Application

    Figure 25 shows the top view of the module, which has 334 pads (dimensions are in mm). To facilitate replacing the LE940B6 module if necessary, it is suggested to design the application board with a 1.5 mm placement inhibit area around the module. These regions are highlighted in Figure 25.

  • Page 90: Stencil

    LE940B6 HW User Guide Stencil Stencil’s apertures layout can be the same as the recommended footprint (1:1). The suggested thickness of stencil foil is greater than 120 µm. PCB Pad Design The solder pads on the PCB are recommended to be of the Non Solder Mask Defined (NSMD) type.

  • Page 91: Recommendations For Pcb Pad Dimensions (Mm)

    LE940B6 HW User Guide Recommendations for PCB Pad Dimensions (mm) Figure 27: PCB Pad Dimensions It is not recommended to place around the pads a via or micro-via that is not covered by solder resist in an area of 0.3 mm unless it carries the same signal as the pad itself (see Figure 28).

  • Page 92: Solder Paste

    LE940B6 HW User Guide The PCB must be able to resist the higher temperatures, which occur during the lead-free process. This issue should be discussed with the PCB-supplier. Generally, the wettability of tin-lead solder paste on the described surface plating is better compared to lead-free solder paste.
  • Page 93 Time 25°C to peak temperature 8 minutes max NOTE: All temperatures refer to the top side of the package, measured on the package body surface. WARNING: The LE940B6 module withstands one reflow process only. Rev. 2.02 Page 93 of 111 2020-01-10...

  • Page 94: Application Guide

    LE940B6 HW User Guide Application Guide Debug of the LE940B6 Module in Production To test and debug the mounting of the LE940B6 module, we strongly recommend to add several test pads on the application board design for the following purposes: •...

  • Page 95: Bypass Capacitor On Power Supplies

    LE940B6 HW User Guide Bypass Capacitor on Power Supplies When a sudden voltage step to or a cut from the power supplies is asserted, the steep transition causes some reactions such as overshoot and undershoot. This abrupt voltage transition can affect the device causing it to not operate or to malfunction.

  • Page 96: Sim Interface

    An external pull-up resistor on SIMIO is not required. The LE940B6 module contains an internal pull-up resistor on SIMIO. Table 38 lists the values of C1 to be adopted with the LE940B6 product: Table 38: SIM Interface – C1 Range...

  • Page 97: Emc Recommendations

    Download and Debug Port This section provides recommendations for the design of the host system used to download or upgrade the Titan software and to debug the LE940B6 module when it is already mounted on a host system. •...

  • Page 98: Antenna Detection

    LE940B6 HW User Guide Antenna Detection The LE940B6 module provides an antenna detection application. Many automotive applications require to detect if the antenna is shorted to ground or the battery of the vehicle for fault tracing. Basically, antenna detection is performed by means of its DC characteristics, splitting the DC and RF paths.

  • Page 99: Packing System

    LE940B6 HW User Guide Packing System The LE940B6 module is packed on trays. The tray is JEDEC compliant, injection molded antistatic Modified Polyphenylene ether (MPPO). It has good thermal characteristics and can withstand the standard baking temperature of up to 125°C, thereby avoiding the need of handling the modules if baking is required.
  • Page 100 LE940B6 HW User Guide Each tray contains 24 modules as shown in Figure 31. Figure 31: Tray Packing Rev. 2.02 Page 100 of 111 2020-01-10...

  • Page 101: Tray Drawing

    WARNING: These trays can withstand a maximum temperature of 125°C. Moisture Sensitivity The LE940B6 module is a Moisture Sensitive Device Level 3, in accordance with standard IPC/JEDEC J-STD-020. Observe all of the requirements for using this kind of components. Calculated shelf life in sealed bag: 4 months at <40°C and <90% relative humidity (RH).

  • Page 102: Conformity Assessment Issues

    LE940B6 HW User Guide Conformity Assessment Issues FCC/IC Regulatory Notices Manual Information to the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product which integrates this module.
  • Page 103 LE940B6 HW User Guide - Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. - Consult the dealer or an experienced radio/TV technician for help. Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment.

  • Page 104: Red Regulatory Notices

    LE940B6 HW User Guide RED Regulatory Notices 2014/53/EU Directive Hereby, Titan Automotive Solutions NV declares that the radio equipment type LE940B6-RW is in compliance with Directive 2014/53/EU. The full text of the EU declaration of conformity is available at the following internet address: www.tustitan.com/RED...
  • Page 105 LE940B6 HW User Guide Table 42: RED Antenna Specifications Mode Band Antenna Gain (dBi) FDD 2100 – B1 FDD 1800+ – B3 FDD 2600 – B7 FDD 900 – B8 FDD 800 – B20 FDD 700 APT – B28 2100 – B1 WCDMA 900 –...

  • Page 106: Safety Recommendations

    LE940B6 HW User Guide Safety Recommendations READ CAREFULLY Be sure that the use of this product is allowed in your country and in the environment required. The use of this product may be dangerous and must be avoided in the following areas: •...

  • Page 107: Acronyms

    LE940B6 HW User Guide Acronyms Analog-to-digital converter Application-enabled CABC Content Adaptive Backlight Control Digital-to-analog converter Frequency division duplex GLONASS Global orbiting navigation satellite system GNSS Global navigation satellite system GNSS Global navigation satellite system GPIO General-purpose input/output GPRS General packet radio services...
  • Page 108 LE940B6 HW User Guide System-on-Chip Serial peripheral interface UART Universal asynchronous receiver transmitter UMTS Universal mobile telecommunications system Universal serial bus WCDMA Wideband code division multiple access Wireless Coexistence Interface Rev. 2.02 Page 108 of 111 2020-01-10...

  • Page 109: Document History

    Table 43: Document History Revision Date Changes Rev 2.2 2020-01-10 Replaced Telit logo and name were by Titan ones. FCC and IC ID updated from Telit to Titan. Rev. 2.1 2018-03-15 Added NCC warning at the last page Rev. 2.0 2018-01-04 Sec.
  • Page 110 LE940B6 HW User Guide Revision Date Changes v. 1.6 2016-11-15 Official Release Sec. 2.7: Updated the Mechanical Specifications Sec. 3.1: Added VPP pin for eFuse Sections 3.1, 3.3, 4.3.6, 8: SD / MMC interfaces were deleted - they are not supported by the chipset vendor.
  • Page 111 LE940B6 HW User Guide Revision Date Changes Rev. 1.5 2016-09-20 (Interim version) Page 2, Table 1: Updated the Applicability table Sec. 2: Updated the General Product Description Sec. 2.5.1, 2.5.2: Updated the RF bands tables Sec. 3.1: Updated the pin description in the Pin-out table Sec.

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