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Components, parts and materials containing
refractory ceramic fibers
Components, parts and materials containing
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Description #1 Screw driver of "+" type
Description #2 Hexagonal nut screw driver for DVI and D-SUB connector
Description #3
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1.
Lay the monitor on a flat, soft and clean surface.
2.
Pull up the base cover
3.
Release the screws to remove base assembly
4.
Release the screws to remove USB type-c cable
5.
Disconnect the connector to remove the rear cover
6.
Release the screws to remove key boards
7.
Disconnect the pins and remove tapes
8.
Remove the mylar
9. Release the screws to remove the main board from mainframe
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
EL-MF877-00
Template Revision B
PSG instructions for this template are available at
EL-MF877-01
0
0
Tool Size (if
applicable)
200mm
200mm
Page 2
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