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HP 22fw Disassembly Instructions Manual page 4

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containing radioactive substances
2.0
Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a
point where components and materials requiring selective treatment can be removed.
Tool Description
Screwdriver
Hex nut screwdriver
3.0
Product Disassembly Process
3.1
List the basic steps that should typically be followed to remove components and materials
requiring selective treatment:
1
release base stand by pushing a white button then strip screw to separate base and hinge
2
Strip the screws from rear cover so that the rear cover can be removed , then
remove deco
3
Remove all material under rear cover contain rear cover supporter ;
4
Separate main board and shielding
5
Release all materials and put some by ESD;
3.2OPTIONAL: Depending upon the complexity of the disassembly process, a graphic depicting
the locations of items contained within the product which require selective treatment (with
descriptions and arrows identifying locations) can be inserted below:
HP Restricted
24-07-201
Tool Size (if applicable)
PH2
M5
Page 2

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