Production Guidance; Reflow Soldering Temperature; Reflow Soldering Curve - Ebyte E220-400T30S User Manual

Chengdu Ebyte Electronic Technology Co., Ltd.

11 Production guidance

11.1 Reflow soldering temperature

Solder Paste
Preheat Temperature min （Tsmin）
Preheat temperature max (Tsmax)
Preheat Time (Tsmin to Tsmax)(ts)
Average ramp-up rate(Tsmax to Tp)
Liquidous Temperature (TL)
Time（tL）Maintained Above（TL）
Peak temperature（Tp）
Aveage ramp-down rate（Tp to Tsmax）
Time 25℃ to peak temperature

11.2 Reflow soldering curve

Copyright ©2012–2018，Chengdu Ebyte Electronic Technology Co.,Ltd.
Profile Feature Sn-Pb Assembly
Sn63/Pb37
100℃
150℃
60-120 sec
3℃/second max
183℃
60-90 sec
220-235℃
6℃/second max
max 6 minutes
E22-400T30S User Manual
Pb-Free Assembly
Sn96.5/Ag3/Cu0.5
150℃
200℃
60-120 sec
3℃/second max
217℃
30-90 sec
230-250℃
6℃/second max
max 8 minutes
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