Working Instruction, Electrical Working Instruction, Electrical Applicable for F500 and K500 family Contents Replacement of parts ......................2 Battery connector....................2 Board to board connector ..................3 FPC connector ....................4 Form shield can fence..................5 Replacing shield can fence if damage at repair centers ........7 BGA Equipment reflow profiles ..................8...
Step-by-Step Instructions Replace the component. Use BGA repair equipment. No special treatment due to through pins. • Reassemble the phone as described in Working Instruction 3/00021-1/FEA 209 544/86 3/00021-2/FEA 209 544/86 C 2(9) Company Internal Sony Ericsson Mobile Communications AB...
Replace the component. Use BGA repair equipment. After soldering check for solder bridges between solder joints. • Reassemble the phone as described in Working Instruction 3/00021-1/FEA 209 544/86 3/00021-2/FEA 209 544/86 C 3(9) Company Internal Sony Ericsson Mobile Communications AB...
Replace the component. Use BGA repair equipment. After soldering check for solder bridges between solder joints. • Reassemble the phone as described in Working Instruction 3/00021-1/FEA 209 544/86 3/00021-2/FEA 209 544/86 C 4(9) Company Internal Sony Ericsson Mobile Communications AB...
Shield fence pliers NTZ 112 537 Equipment • ESD-gloves (cotton gloves) • ESD-wristband Instruction • Disassemble the phone as described in Working Instruction 3/00021-1/FEA 209 544/86 Step-by-Step Instructions 3/00021-2/FEA 209 544/86 C 5(9) Company Internal Sony Ericsson Mobile Communications AB...
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Put back a new shield can lid. Press on all sides of the lid until you hear a “click” sound. • Reassemble the phone as described in Working Instruction 3/00021-1/FEA 209 544/86 3/00021-2/FEA 209 544/86 C 6(9) Company Internal Sony Ericsson Mobile Communications AB...
Assemble a new shield can fence with BGA repair equipment. • Reassemble the phone as described in Working Instruction 3/00021-1/FEA 209 544/86 3/00021-2/FEA 209 544/86 C 7(9) Company Internal Sony Ericsson Mobile Communications AB...
Minimum temperature 215°C Maximum temperature 225°C or 235°C for 10-20 sec Total time Appr. 4-7 min The higher temperature in case the board has extremely high ∆T. 3/00021-2/FEA 209 544/86 C 8(9) Company Internal Sony Ericsson Mobile Communications AB...
Working Instruction, Electrical 3 Revision History Rev. Date Changes / Comments 2004-06-30 Initial release 2004-07-13 Revision update due to publishing problems 2004-08-19 K500 Added 3/00021-2/FEA 209 544/86 C 9(9) Company Internal Sony Ericsson Mobile Communications AB...
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