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CONFIGURATION AND INSTALLATION
5.1 UNPACKING PROCEDURES
SOME OF THE COMPONENTS ASSEMBLED ON VMIC'S PRODUCTS MAY BE SENSITIVE TO
ELECTROSTATIC DISCHARGE AND DAMAGE MAY OCCUR ON BOARDS THAT ARE
SUBJECTED TO A HIGH ENERGY ELECTROSTATIC FIELD. UNUSED BOARDS SHOULD BE
STORED IN THE SAME PROTECTIVE BOXES AS SHIPPED. WHEN THE BOARD IS TO BE
LAID ON A BENCH FOR CONFIGURING, ECT., IT IS SUGGESTED THAT CONDUCTIVE
MATERIAL BE INSERTED UNDER THE BOARD TO PROVIDE A CONDUCTIVE SHUNT.
Upon receipt, any precautions found in the shipping container should be
observed. All items should be carefully unpacked and thoroughly inspected for
damage that might have occurred during shipment. The board(s) should be checked
for broken components, damaged printed circuit board(s), heat damage, and other
visible contamination. All claims arising from shipping damage should be filed with
the carrier and a complete report sent to VMIC, together with a request for advice
concerning disposition of the damaged item(s).
5.2 PHYSICAL INSTALLATION
DO NOT INSTALL OR REMOVE BOARDS WHILE POWER IS APPLIED.
De-energize the equipment and insert the board into an appropriate slot of
the chassis. While ensuring that the board is properly aligned and oriented in the
supporting card guides, slide the board smoothly forward against the mating
connector until firmly seated.
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