Related Manuals for RoentDek DLD40
Summary of Contents for RoentDek DLD40
- Page 1 RoentDek Handels GmbH Supersonic Gas Jets Detection Techniques Data Acquisition Systems Multifragment Imaging Systems MCP Delay Line Detector Manual (Version 6.2.90.5)
- Page 2 Mail Addresses: Headquarter RoentDek Handels GmbH Im Vogelshaag 8 D-65779 Kelkheim-Ruppertshain Germany Frankfurt branch RoentDek Handels GmbH c/o Institut für Kernphysik Max-von-Laue-Str. 1 D-60438 Frankfurt am Main Germany Web-Site: www.roentdek.com Page 2 of 80 MCP Delay Line (Version 6.2.90.5)
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Page 3: Table Of Contents
Now the detector can be finally assembled ....................12 2.4.3.1 Connecting the Wires to the Delay-line Anode......................12 2.4.3.2 Assembly of the MCP-stack for the DLD40, DLD80 and HEX80 ................13 2.4.3.3 Assembly of the MCP-stack for the DLD120 and HEX120 ..................16 2.4.4 Mounting the Detector an experimental setup .................... - Page 4 4.2.2.2 Technical data............................. 54 4.2.2.3 EHQ Description ............................55 4.2.2.4 Front panel ..............................56 4.2.2.5 Handling ..............................57 4.2.2.6 Analogue I/O............................... 58 4.2.2.7 Block diagram EHQ............................ 59 4.2.2.8 EHQ side cover ............................60 Changing the Polarity..............................60 BAT2 BOX ................................61 BAT3 BOX ................................
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Page 5: Detector System - Components
Detector System - Components This manual describes all components of the delay-line detector system as it can be delivered for the DLD40, RoentDek DLD80, HEX80 and DLD120 and HEX120 detector. Even if you have not purchased the complete system you will find valuable information in the chapters describing the different components about the link between the components and the operation. - Page 6 Page 6 of 80 MCP Delay Line (Version 6.2.90.5)
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Page 7: The Microchannel Plate Detector
It is possible to further increase the gain by using triple stacks of these MCP. Please contact for advice. RoentDek If you have chosen a detector set with central hole the hole size in the MCP is usually 6.4mm and the minimum active diameter 9mm. -
Page 8: General Description
MCP detector with delay-line anode is a high resolution 2D-imaging and timing device for charged particle RoentDek or photon detection at high rates with multi-hit capability. The linear active diameter is at least 40mm for the DLD40, 80mm for the DLD80 and about 120mm for the DLD120. The... -
Page 9: Figure 2.1: Operation Principle Of The Delay
Ox and Oy are offsets. For detectors with central hole, the gaps in the wiring have to be taken into account. Please contact for the RoentDek program codes appropriate for your detector. MCP Delay Line (Version 6.2.90.5) Page 9 of 80... -
Page 10: Assembly Of The Mcp-Detector
Assorted small parts for cable connections You will usually receive the detectors pre-assembled. For DLD40, DLD80 and HEX80 the MCP holder with rear ceramic ring is placed on the delay-line anode, it is fixed by the retractable “shields” in a position that should be resumed after assembly of the MCP stack. -
Page 11: Preparation
Check the resistance of each of the 4 wires. From one end to the other it should be around 5Ω for the DLD40, 12Ω for the DLD80, 17Ω for the HEX80, 25Ω for DLD120 and about 40Ω for the HEX120. -
Page 12: Now The Detector Can Be Finally Assembled
For DLD40, DLD80 and HEX80: The cables for the MCP connection can be soldered or spot-welded directly onto the metallization of the ceramic rings or clamped to the ring with special M2 nuts and screws. If soldering preferably use the metallization strips which are not located at a hole of the ceramics. -
Page 13: Assembly Of The Mcp-Stack For The Dld40, Dld80 And Hex80
Assembly of the MCP-stack for the DLD40, DLD80 and HEX80 A cartoon about the assembly of the MCP stack for the DLD40, DLD80 and HEX80 can be found on our Web-Site in the MOVIES section. There you can also find cartoons showing the mounting of the MCP stack to the anode for DLD40, DLD80 and HEX80. -
Page 14: Figure 2.9: Assembly Of Mcp
MCPs (the triangles indicate the tilt angle direction of the MCP pores). Note that the marks are only on one side of the MCP. Figure 2.9: Assembly of MCP-stack - Stage 2a (DLD40, DLD80 & HEX80) For Photonis MCP: the thin shim ring must be placed between the MCPs. There is no need for a special tilt angle orientation. -
Page 15: Figure 2.13: Assembly Of Mcp
Figure 2.15: MCP stack with spring ring for MCP back cable (DLD40, DLD80 & HEX80) Now the MCP-stack can be mounted to the anode by inserting it into the butterfly shaped indent of the holder plate and fixed with the movable shields. -
Page 16: Assembly Of The Mcp-Stack For The Dld120 And Hex120
Attention: Excessive force when mounting may result in breaking the ceramic rings Take care that neither the contact cables of the ceramic rings nor the 4 spring clamps have contact with the holder plate. Check with an Ω meter that there is no electric contact between “MCP back”, “MCP front” and “holder” plate. There should be a resistance in the 10 Ω... -
Page 17: Figure 2.20: Assembly Of Mcp
Place the second MCP carefully onto the first on with the bias angle marker pointing upward and rotated to the first MCP’s marker by about 180°. Make sure that the MCPs are well-aligned with each other and are centered in the indention. -
Page 18: Mounting The Detector An Experimental Setup
The vacuum port where the detector is mounted must have at least 100mm open diameter for , 150mm for 200mm for and 250mm for DLD40 DLD80, HEX80 DLD120 HEX120 Cartoons about the mounting of the DLD and HEX detector to the mounting flange can be found on our Web-Site in the MOVIES section. -
Page 19: Connecting The Signal Cables To The Feedtrough Flange
Mount the stainless steel support ring with the 4 threaded bolts to the delay-line anode (see Figure 2.24). You can may use one of these thread bolts to supply the anode holder voltage with an appropriate cable. Mount the support ring with 8 ceramic insulators and 8 nuts on the M3 threaded bolts on the flange. -
Page 20: Figure 2.26: Cf35-12- Pin
For the Hexanode the 12-pin feedthrough is used to connect only the delay-line wires. For the connections to Holder, MCP front, MCP back (and X) other feedthroughs must be used, for example the 4-fold MHV feedthrough on CF35 as supplied (in FT16 packages) or individual coaxial SHV or MHV feedhroughs. RoentDek Pin number Function... -
Page 21: Operation Of The Delay-Line Detector - General Description
(as available from ). The optimal potential of the MCP front side with respect to RoentDek ground depends on the particles to be detected. Ions should be pre-accelerated onto the detector with a potential of -2000V or higher. For most ion species it is suitable to operate the MCP back side on ground potential, thus the front side is in the range of –2kV to –3kV. -
Page 22: The Ft12(16)-Tp
The FT12(16)-TP feedthrough option allows the customer to use his own amplifier and timing discriminator/recording electronics to operate a DLD (or HEX detector, see also FT16-TP). An example for an adequate RoentDek amplifier/CFD is the ATR19 or the FAMP1/8 (amplifier only). -
Page 23: The Atr19 Amplifier & Cfd Module
This is (Version 6.2.90.5) Please look for updates of this manual at http://roentdek.com/mitte/doppel/links/fuer_manu/detect_manuals/det_manuals.htm The readout of the MCP and delay-line anode signals requires amplifying and timing (discrimination) circuits. Since a very high time precision is needed, the “constant-fraction” discrimination (CFD) method is recommended to produce digital signals like NIM or ECL signals for a time measuring device, e.g. -
Page 24: Signal Inputs And Amplification
The recommended readout version of the delay-line detectors involves the FT12(16)-TP plug with internal RoentDek signal transformers for the delay-line signals. When the ATR19 is delivered, channel 1 and 2 are by default prepared for positive input polarity (inverting) and the other channels (used for the delay-line signals) for negative (non-inverting) signal polarity. -
Page 25: Figure 2.31: Top Lid Of Atr19
Ch 6 Ch 4 Ch 5 Ch 3 Figure 2.31: Top lid of ATR19 with holes to reach the gain potentiometers. turn clockwise: amplifier gain is increased, turn counter clockwise: gain is decreased The input to each amplifier is formed by a pair of coaxial LEMO connectors with 50Ω impedance to ground (AC-coupled). It is important to note the actual input settings for each individual channel inside the ATR19, i.e. -
Page 26: Figure 2.32: Atr19
Figure 2.32: ATR19 with input settings for differential input (no input jumpers set) Figure 2.33: ATR19 base board with input jumper settings for signal input through the “+” LEMO input (50Ω impedance to ground, non-inverting, for negative signal input). The level control board was removed here for better view. Page 26 of 80 MCP Delay Line (Version 6.2.90.5) -
Page 27: The Dlatr Board
2.6.2 The DLATR board The ATR19 module contains 3 or 4 identical DLATR boards which can easily be exchanged. To change settings on the boards or exchange the boards please refer to chapter 2.6.5. The amplification gain can be changed without opening the ATR19 unit. -
Page 28: Figure 2.35: Inputs
Figure 2.35: inputs, outputs and controls of the ATR19 for each internal DLATR board The “Mon” output allows a monitoring of the noise level and the signal quality from the delay-line. This output shows the amplified signal according to the input signal and input settings (jumpers JP5, JP6, JP8 and JP9, see chapter 2.6.1). For verifying the signal, the input of the oscilloscope must be 50Ω... -
Page 29: Connecting And Operating The Atr19
Attention: A few of the earliest ATR19, which have been delivered to customers, allow an external DC supply only with ±5.2V (JP7 and JP10 removed). Please contact to insure that your module can also be operated with ±6V and RoentDek JP7 and JP10 set. Figure 2.36: Rear panel of the ATR19... -
Page 30: Opening The Atr19 Module
If you want to change your ATR19 module between ECL and NIM versions please contact RoentDek These are the following options for the signal output levels on the ECL and NIM output connectors: Standard NIM: JP1/JP3 and JP2/JP4 set, JP22/JP23 open (as in Figure 2.33) - Page 31 If JP1/JP3 is left open the CFD output signals will also be present on the upper pin (red dot) of the “ECL” LEMO connector as the positive ECL+ level. Please inquire before you intend to use this option. Standard ECL: JP22/JP23 set, JP1/JP3 and JP2/JP4 open The timing output from the CFD is present on the “ECL”...
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Page 33: Data Acquisition Hard- And Software
Data acquisition Hard- and Software has developed data acquisition concepts for PCs, especially suited for correlated multi-parameter read-out. It RoentDek consists of the software package CoboldPC with plug-ins for certain hardware applications. Currently Windows NT4.0(SP6), Windows 2000 and Windows XP operating systems are supported. Nevertheless CoboldPC should also run with Windows 9x and WindowsMe but is not supported and not recommended due to the fact that these operating systems are less “stable”... -
Page 34: The Tdc8
Figure 3.2: PCI interface card Figure 3.1: HM1-B/T and HM1-B front panel The HM1-B is fully compatible to the HM1 as well as the HM1/T model. Additionally to the HM1 this module has the burst mode ability. Details of the HM1(-B) operation is given in a separate manual. 3.1.2 The TDC8 The TDC8 is based on the LeCroy MTD133B-chip (production discontinued). -
Page 35: For Details Of The Tdc8 Module Versions Please Refer To The Separate Manual
Figure 3.4: TDC8/PCI board Figure 3.5: TDC8PCI2 board For details of the TDC8 module versions please refer to the separate manual. MCP Delay Line (Version 6.2.90.5) Page 35 of 80... -
Page 36: The Ccc1
3.1.3 The CCC1 -CCC1 is a double-width CAMAC Crate Controller. This controller conforms to all applicable CAMAC RoentDek specifications, except that it controls only station number 1-16. The controller comes with an integrated simple Event- Controller and a PC-IO card. -
Page 37: Figure 3.7: Side And Input Panel View Of The Figure 3.8: Side And Input Panel View Of The
• If necessary adjust the I/O address setting on the I/O card to a free I/O address (ISA-I/O card version only). Do not forget to adjust parameter 1 in your .ccf file to this I/O address or set the value of this parameter to 0 to automatically determine the I/O address. -
Page 38: Tdc8
Figure 3.8: Side and input panel view of the HM1 - I/O-board (ISA) For a detailed description please refer to the HM1-B Module manual 3.2.2 TDC8 • Shut down your computer • For your devices safety, turn off the power to your computer and all peripheral devices. •... -
Page 39: Connecting The Atr19 With The Tdc
case the TDC card is detected but no data taking can be initiated. A DAQ Software like CoboldPC will therefore give no warning that the TDC could not be detected but the event rate will always be zero. In this case try to switch the PCI support in BIOS from “Plug and Play” to “None Plug and Play” and try again. For a detailed description please refer to the TDC8 manual Connecting the ATR19 with the TDC Before you finally connect the TDC with the ATR19 you should have verified that the detector and the ATR19 unit are... -
Page 40: Starting The Coboldpc Software
The program will resume and sort the file. Now you can look at the spectra with the “view” command. First you may check with the “show spectra” command which spectra are defined and can be If you should not find the file corresponding to your hardware please contact software.development@roentdek.com. Page 40 of 80... -
Page 41: The "Xxx Standard.ccf
displayed. If you have not yet referred to the CoboldPC manual so far, it is time for that now in order to proceed. Some frequently used standard commands are listed below: calls a command file prepares for starting hardware acquisition new hardware starts the acquisition start... -
Page 42: Daq Parameters (Here For Tdc8Pci2 As An Example)
(Low.Low, Low.high, High.Low, High.high) Parameter 3 System reset time (in seconds) in case of missing signals (do not change without consulting RoentDek Parameter 5 Time scaling (internal parameter) Used to calibrate the time stamp. Parameter 6 DAQ-version number (internal parameter) -
Page 43: Daq Coordinates
1 enable Parameter 49 trigger rising edge 0 disable 1 enable Parameter 50 EmptyCounter, sum (Internally set) Parameter 51 EmptyCounter, since last Event (Internally set) 3.5.2 DAQ coordinates According to the settings of the DAQ parameters the CoboldPC program will retrieve the following coordinates from the hardware and (if selected) will store them event by event to the hard disc. - Page 44 High.high) Parameter TimeScaling (Internally set, tics per s) Parameter DAQ Version # (Internally set) Parameter Start time of list mode file (internally set) Parameter DAQ_ID DAQ_ID_RAW 0x000000 for RAW (no Data) DAQ_ID_TDC8 0x000002 for TDC8/ISA/PCI DAQ_ID_2TDC8 0x000005 for 2 TDC8 (Advanced Burst Mode) Parameter 20 Resolution of TDC in ns (internally set)
- Page 45 Parameter 110 pTPCalX Time to Position calibration factor for x (1/v in mm/ns) ⊥ DLD40: 0.76, DLD80: 1.02, DLD120: 1.26 For Hexanode: … for u (1/v in mm/ns), 1.3565 for HEX80. ⊥ Parameter 111 pTPCalY Time to Position calibration factor for y (1/v in mm/ns) ⊥...
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Page 46: Dan Coordinates, Primary
Parameter 137 pOPw Offset for third anode layer (added to w, only for Hexanode) Parameter 138 pOSum Offset for Sum/Diff calculations This offset value is an additive constant to all time sum/diff coordinates 3.5.3.2 DAN coordinates, primary The DAN coordinates are by definition only the additional coordinates that are computed from the (raw) DAQ coordinates retrieved from the hardware or from a previously accumulated event file. -
Page 47: Dan Coordinates, Secondary, For Dld Detectors
Please RoentDek look for manual updates on our website http://roentdek.com. 3.5.4 Spectra and conditions The final purpose of the data acquisition is to display and manipulate the acquired data. For this purpose it is possible to... - Page 48 acquired or re-sorted from a list-mode file, the value of the coordinate for each event will be attributed to the closest bin’s value and the histogram content in this bin will be incremented by one unit (along the Y-axis of the graph). For example such a histogram (spectrum) could show the distribution of time sum values for a number of acquired events.
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Page 49: The Detector Power Supplies Hv2/4 And Biaset2 With Battery Box Bat2
BAT2 The HV2/4: 2×4kV Power Supply is especially designed for the use of biasing multi-channel- RoentDek plate detectors, featuring low-ripple and regulated current limitation and protection. It has to be powered by a NIM crate , or externally using the 9 pin socket on the rear side panel, supplying the voltages (NIM-crate standard) according to the table on the manual. -
Page 50: The Biaset2
On the rear panel you find a 9-pin socket where the external power cable for the RoentDek amplifier modules of type DLATR6 can be powered. Warning: the HV output of this power supply can be hazardous if not properly operated. -
Page 51: Figure 4.4: Biaset2 Crate With Four
Figure 4.4: BIASET2 Crate with four HV1/4 MCP Delay Line (Version 6.2.90.5) Page 51 of 80... -
Page 52: Ech 114 - K (Biaset2 Crate)
ECH 114 – K (BIASET2 Crate) 4.2.1 ECH 114 – K (BIASET2 Crate) 3U - Crate with Power Supply for HV-PS EHQ 1xxx series The Crate ECH 114 - K carry up to 4 modules of our EHQ 1xxx series. A common PS provides the necessary voltages. -
Page 53: Ehq 104M_Aio (Hv1/4) Operators Manual
EHQ 104M_AIO (HV1/4) Operators Manual 4.2.2 EHQ 104M (HV1/4) _AIO Precision High Voltage Power Supplies in 3U Eurocard Format with analogue I/O Operators Manual Contents: 4.2.2.1 General information 4.2.2.2 Technical data 4.2.2.3 EHQ Description 4.2.2.4 Front panel 4.2.2.5 Handling 4.2.2.6 Analogue I/O 4.2.2.7 Block diagram EHQ... -
Page 54: General Information
4.2.2.1 General information The EHQ´s are two channel high voltage supplies in a 3U Eurocard Chassis, 8TE wide. The units offers manual control and operation via analogue I/O The high voltage supplies special provide high precision output voltage together with very low ripple and noise, even under full load. -
Page 55: Ehq Description
4.2.2.3 EHQ Description The function is described at a block diagram of the EHQ. This can be found in Appendix A. High voltage supply A patented high efficiency resonance converter circuit, which provides a low harmonic sine voltage on the HV-transformer, is used to generate the high voltage. -
Page 56: Front Panel
4.2.2.4 Front panel [1] 4 digit LCD display [2] Error indicator [3] Measuring switch [4] 10-turn potentiometer [5] HV-ON switch [6] CONTROL switch [7] KILL switch [8] INHIBIT input [9] HV-ON indicator [10] HV output [11] Polarity indicator Figure 4.6: Front Panel of the EHQ 104M_ (HV1/4) Module Page 56 of 80 MCP Delay Line (Version 6.2.90.5) -
Page 57: Handling
4.2.2.5 Handling The state of readiness of the unit is produced at the 96-pin connector according to DIN 41612 on the flipside. The Output polarity is selectable with help of a rotary switch on the cover side (see appendix B). The chosen polarity is displayed by a LED on the front panel [11] and a sign on the LCD display [1]. -
Page 58: Analogue I/O
4.2.2.6 Analogue I/O Control with analogue I/O is possible with using analogue set and monitor voltages. These voltages are dependent on the max. output voltage of the unit: 2kV ≤ V ≤ 4kV 0 ≤ V ≤ V / 400 and Omax SET/MON 0 ≤... -
Page 59: Block Diagram Ehq
4.2.2.7 Block diagram EHQ Reference voltage LCD display / driver Microcontroller DAC 1 +/-24V DAC 2 Filter Channel A Hardware voltage ramp Error logic monitoring Precision- Inhibit rectifier Supply voltage AGC amplifier monitoring monitoring Resonance Converter Polarity HV-Filter OUTPUT switch HV-Transformer Figure 4.7: Block diagram EHQ (HV1/4) MCP Delay Line (Version 6.2.90.5) -
Page 60: Ehq Side Cover
4.2.2.8 EHQ side cover Polarity rotary switch (e.g.: polarity negative) Rotary switches for V and I POLARITY Figure 4.8: EHQ (HV1/4) side cover Changing the Polarity To change the polarity of either channel, A or B, locate the “red knobs” on the left side-panel (see Figure 4.8) and place the module flat on a table showing the side-panel. -
Page 61: Bat2 Box
To supply this constant voltage offset between the wires a battery can be used. The BAT2 battery pack RoentDek provides this offset of either 24V or 48V (selectable by a switch). If you want to use the BAT2 for supplying the wire potentials you need to connect the U... -
Page 62: Bat3 Box
To supply this constant voltage offset between the wires a battery can be used. The BAT3 battery pack RoentDek provides this offset of 35-40V. If you want to use the BAT3 for supplying the wire potentials you need to connect the SHV output “HV +36V” to the U input of the FT12-TP plug and the other SHV output “HV”... -
Page 63: Getting Started
Getting started The usual startup procedure of detectors is very important to avoid damage to the MCP stack or the electronic RoentDek circuits. is not responsible for errors due to mechanical damage after unsafe handling of the products or unsafe RoentDek operation. - Page 64 If the problem persists, contact for some advice. RoentDek If you plan to operate the detector in electron detection mode (high potentials on “MCP back” and the anode) you need to verify the high voltage safety of the rear detector parts.
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Page 65: Initial Start-Up Procedure
RoentDek At a certain MCP bias (around 2000V) you should see a few dark counts (usually less than 50/s for the DLD40 and < 200/s for the DLD80). MCP signals from particle counts or dark counts at the An (monitor) outputs are fast negative signals of a few ns rise time. -
Page 66: Final Adjustment
Now the detector is ready for operation with real particles. Reduce the voltage and start a real source of particles. The expected rate should be well below 10 cts/sec at this time. You can now increase the voltage again to 2400V. In order to increase the pulse height you can slowly (100V/10m) increase the voltage further, never exceeding the maximum specified voltage across the MCP stack. - Page 67 Now the thresholds of the channel 1/2 or 3-6 can be reduced, so that even the smallest pulse heights are above the threshold but noise is still discriminated. You may connect the Tn outputs to the TDC now (see chapter 3.3) and start to take data. During data acquisition you should not supply signals to the ECL-TTL converter.
- Page 68 Page 68 of 80 MCP Delay Line (Version 6.2.90.5)
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Page 69: Performance
Images demonstrating the typical detector performance are displayed here. You should be able to achieve similar results with the same hardware. Figure 6.1: Imaging of a shadow mask on DLD40 Detector. The detector was irradiated by α-particles with about 6 MeV kinetic energy Figure 6.2: Time sum peak for one dimension at fixed position... -
Page 70: Figure 6.3: Enlargement From Of A Shadow Mask Image , Obtained By Adld80 Detector That Was Read Out
Figure 6.3: Enlargement from of a shadow mask image, obtained by a DLD80 detector that was read out with HM1. The hexagons are 3 mm wide, the obstacles have 0.2mm width. One channel corresponds to approximately 0.08mm Page 70 of 80 MCP Delay Line (Version 6.2.90.5) -
Page 71: Trouble Shooting/Faq
This chapter is constantly modified and amended. You may find an updated FAQ-list on our web-site http://roentdek.com PROBLEM: “I believe the detector hardware and electronics operate well (all signals have been verified) but... - Page 72 can be reduced by increasing the CFD threshold and/or by reducing the MCP bias. However, this might also reduce the detection efficiency for the real particles. b) more counts that I would expect, but rather diffusely distributed.” Is there any other source of charged particles/UV photons (ion gauge, corona discharge somewhere in the chamber)? c) areas of reduced efficiency.”...
- Page 73 c) only one signal is missing.” verify that all cables are connected by identifying with an Ω meter the four pairs of contacts that connect to the ends of each wire on the connection cable to the feedthrough. Have amplifiers been damaged due to prior incidents of discharge, power failure, etc.? Make sure that all the cables on the DLATR boards inside the (N)DLATR6(8) are connected (you need to power down and open the box for that).
- Page 74 If you have verified that the noise is not due to a problem with the immediate detector setup or the electronic RoentDek modules (see above) you must look for the external sources that produce a too high noise level for detector operation.
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Page 75: Figure 7.1: Input Region Of The Dlatr Board
Remove the DLATR board with the damaged channel from its socket and send it to offers a “repair/exchange service” at reasonable costs. RoentDek RoentDek If the analog output is missing (after a discharge) it is worth to try an easy and often successful repair, because very likely only a pair of SMD double diode (BAV99), and two pairs of SMD resistors (56Ω... - Page 76 First check how many windings have lost tension by inspecting the anode edge-on. As far towards the broken end where the wire is still straight the anode may be saved, usually only the last 1 or 2mm show a bending if the anode was handled carefully after the accident.
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Page 77: Appendix A. (Mcp's)
Appendix A. (MCP’s): STORAGE, HANDLING and OPERATION of MICROCHANNEL PLATES from Galileo Corp. STORAGE Because of their structure and the nature of the materials used in manufacture, care must be taken when handling or operating MCPs. The following precautions are strongly recommended: Containers in which microchannel plates are shipped are not suitable for storage periods exceeding the delivery time. - Page 78 Page 78 of 80 MCP Delay Line (Version 6.2.90.5)
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Page 79: List Of Figures
2.10: A MCP- (DLD40, DLD80 & HEX80)............14 IGURE SSEMBLY OF STACK TAGE 2.11: A MCP- 3-1 (DLD40, DLD80 & HEX80) ............14 IGURE SSEMBLY OF STACK TAGE 2.12: A MCP- 3-2 (DLD40, DLD80 & HEX80) ............14 IGURE SSEMBLY OF... -
Page 80: List Of Tables
(N)DLATR6(8) A ATR19 .......... 66 IGURE YPICAL PULSE SHAPE FROM A N OR MONITOR OUTPUT 6.1: I DLD40 D IGURE MAGING OF A SHADOW MASK ON ETECTOR HE DETECTOR WAS IRRADIATED BY Α PARTICLES WITH ..........................69 ABOUT KINETIC ENERGY 6.2: T...
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