Sony MEX-GS610BE Service Manual page 29

THIS NOTE IS COMMON FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is printed in each block.)
For Printed Wiring Boards.
Note:
• X : Parts extracted from the component side.
• Y : Parts extracted from the conductor side.
• : Internal component.
f
• : Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
Caution:
Pattern face side: Parts on the pattern face side seen
(Conductor Side) from the pattern face are indicated.
Parts face side: Parts on the parts face side seen from
(Component Side) the parts face are indicated.
Caution:
Pattern face side: Parts on the pattern face side seen
(SIDE B) from the pattern face are indicated.
Parts face side: Parts on the parts face side seen from
(SIDE A) the parts face are indicated.
• Indication of transistor.
C
Q
These are omitted.
B E
Note: When the complete MAIN board is replaced, it is nec-
essary to replace knob (VOL) (SV) assy simultane-
ously. Also, the destination setting, Bluetooth operation
check and Bluetooth information writing is necessary.
Refer to "DESTINATION SETTING METHOD" on
page 4, "BLUETOOTH FUNCTION CHECKING
METHOD USING A CELLULAR PHONE" on page
7 and "BLUETOOTH INFORMATION WRITING
METHOD" on page 8.
MEX-GS610BE/GS610BT/N6050BT
For Schematic Diagrams.
Note:
• All capacitors are in μF unless otherwise noted. (p: pF) 50
WV or less are not indicated except for electrolytics and
tantalums.
• All resistors are in Ω and 1/4 W or less unless otherwise
specifi ed.
• : Internal component.
f
• C : Panel designation.
Note: Note:
The components identi- Les composants identifi és
fi ed by mark 0 or dotted par une marque 0 sont
line with mark 0 are criti- critiques pour la sécurité.
cal for safety. Ne les remplacer que par
Replace only with part une pièce portant le nu-
number specifi ed. méro spécifi é.
• A : B+ Line.
• Power voltages is dc 14.4V and fed with regulated dc
power supply from ACC and BATT cords.
• Voltages and waveforms are dc with respect to ground
under no-signal (detuned) conditions.
no mark : TUNER (FM)
( ) : CD PLAY
• Voltages are taken with VOM (Input impedance 10 M).
Voltage variations may be noted due to normal production
tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal production
tolerances.
• Circled numbers refer to waveforms.
• Signal path.
: AUDIO
F
f : TUNER
h : SIRIUS/XM
: CD PLAY
J
d : USB
E : AUX
: Bluetooth
a
N : MIC
Note: When the complete MAIN board is replaced, it is nec-
essary to replace knob (VOL) (SV) assy simultane-
ously. Also, the destination setting, Bluetooth operation
check and Bluetooth information writing is necessary.
Refer to "DESTINATION SETTING METHOD" on
page 4, "BLUETOOTH FUNCTION CHECKING
METHOD USING A CELLULAR PHONE" on page
7 and "BLUETOOTH INFORMATION WRITING
METHOD" on page 8.
• Waveforms
– MAIN Board –
IC705 rk (LRCK_OUT)
1
3.4 Vp-p
22.7 s
1 V/DIV, 10 s/DIV
IC705 rl (BCK_OUT)
2
3.4 Vp-p
352 ns
1 V/DIV, 200 ns/DIV
3 IC705 yj (XO)
3.9 Vp-p
59.2 ns
1 V/DIV, 20 ns/DIV
4 IC1301 qa (X2)
1.3 Vp-p
33.4 ns
500 mV/DIV, 20 ns/DIV
IC1300 1 (BST)
5
15.6 Vp-p
2.6 s
5 V/DIV, 2 s/DIV
IC503 yk (RTC_X2)
6
1 Vp-p
30.4 s
500 mV/DIV, 20 s/DIV
29 29
MEX-GS610BE/GS610BT/N6050BT
IC503 ua (XTAL)
7
3.4 Vp-p
74.8 ns
1 V/DIV, 20 ns/DIV
IC503 <zv/ (USB_X2)
8
0.7 Vp-p
21.2 ns
200 mV/DIV, 10 ns/DIV