LG Innotek LTD-BK1000 User Manual

Lte wcdma wireless modem

Advertisement

Quick Links

User Guide for the LTD-BK1000
Product: LTE_WCDMA Wireless Modem
Model name: LTD-BK1000

Table of Contents

8. Connectors
Copyright ⓒ. 2017. All Rights Reserved.

Advertisement

Table of Contents
loading
Need help?

Need help?

Do you have a question about the LTD-BK1000 and is the answer not in the manual?

Questions and answers

Summary of Contents for LG Innotek LTD-BK1000

  • Page 1: Table Of Contents

    User Guide for the LTD-BK1000 Product: LTE_WCDMA Wireless Modem Model name: LTD-BK1000 Table of Contents 1. Overview 2. Major features 3. Interface 4. Electrical specifications 5. RF specifications 6. Mechanical specifications 7. General specifications 8. Connectors 9. RFx information 10. Approbation FCC...
  • Page 2: Overview

    1. Overview The LTD-BK1000 is a personal mobile communication device that incorporates the latest compact radio technology, including smaller and lighter components and support for WCDMA(850/1900MHz) bands and LTE(700/850/1700/1900 MHz). This device acts as the vehicle’s telematics system and connects to WCDMA (HSPA+) and LTE wireless networks and wireless modules to allow voice and data communication.
  • Page 3: Major Features

    2. Major features 34 x 40 x 3.5 mm (L x W x T) Dimensions (Tolerance – width, length : TBD) Weight TBD g (max) Mechanical Interface USB, general purpose I/O pins Operation: -20 ℃ - +70 ℃ Temperature* Storage: -40 ℃ - +85 ℃ Main chipset MDM9628 Memory...
  • Page 4: Interface

    3. Interface 3.1 LGA Pad Layout (Top View) GND12 GND10 GND6 GND5 GND11 GND4 AA21 AC21 AE21 MAIN_ANT ANT_DIV AB20 AD20 MAIN_ANT_DTC_EN GND DIV_ANT_DTC_EN AA19 AC19 AE19 ADC1 ADC2 AB18 AD18 AA17 AC17 AE17 VPH_PWR AB16 AD16 VPH_PWR AA15 AC15 AE15 VPH_PWR AB14...
  • Page 5 3. Interface 3.2 Pin description PAD. NAME DIRECTION DESCRIPTION Antenna Interface Pads MAIN_ANT Input/Output RF Main Antenna AC21 DIV_ANT Input/Output RF Diversity Antenna User Interface Pads ACC_PWR_ON Input ACC_PWR_ON BOOT_OK Output BOOT_OK Output 96H_END Output 96H_END MAIN_ANT_DTC_EN Output Main ANT Detect Enable DIV_ANT_DTC_EN Output Diversity ANT Detect Enable...
  • Page 6 3. Interface SDC_DATA3 Input/Output Secure digital controller data bit 3 SGMMI Interface Pads AA11 EPHY_RST_N or UIM2_RESET Output Ethernet PHY reset AE11 EPHY_INT_N or UIM2_DETECT Input Ethernet PHY interrupt AB10 SGMII_DATA or UIM2_CLK Input/Output SGMII input Output data AD10 Ground SGMII_RX_P Input SGMII receive - plus...
  • Page 7 3. Interface DSRC_SLP_CLK Output DSRC sleep clock WLAN_3V_EN_DSRC Output Used for WLAN enable DSRC_PPS Input/Output Pulse Per Second MDM2AP_INT_N Output MDM to AP interrupt, PCM_LDO_EN AP2MDM_INT_N Input AP to MDM interrupt Control Pads LGA_PHONE_ON Input ON/OFF Control MDM_RESOUT_N Output Reset Output LGA_RESIN_N Input External Reset Input...
  • Page 8 3. Interface Ground Ground Ground Ground Ground Ground Ground AB20 Ground AD20 Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground AC19 Ground AE19 Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground AB18...
  • Page 9 3. Interface AA17 Ground AC17 Ground AE17 Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground AB16 Ground AD16 Ground Ground Ground Ground Ground Ground Ground AA15 Ground AC15 Ground AE15 Ground Ground Ground Ground Ground Ground AB14 Ground...
  • Page 10 3. Interface Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground...
  • Page 11 3. Interface GND3 Ground GND4 Ground GND5 Ground GND6 Ground GND7 Ground GND8 Ground GND9 Ground GND1 Ground GND11 GND Ground GND1 Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground...
  • Page 12 3. Interface 3.3 USB This device supports universal serial bus (USB) connections for high-speed data communication. The relevant hardware satisfies the USB 2.0 specifications and supports maximum communications speeds of 480 Mbps Pin I/O Pin NO. Signal Name Function Description (Modem host) USB_D+ USB Differential data line (+)
  • Page 13 3. Interface 3.4 Audio This module includes a PCM interface. The pull-up and pull-down resistors attached to these pin must provide more than 50 Kohm of resistance. Pin I/O Pin NO. Signal Name Function Description (Modem host) PCM_SYNC PCM Interface sync PCM_CLK PCM Interface clock PCM_TXD...
  • Page 14: Electrical Specifications

    4. Electrical specifications 4.1 Power supply specifications The host system provides the power supply (V_BATT)DC 4 V, 2.5 A to the device. The internal power supply module manages the power supplied to the integral circuits and maintains constant voltages. This module also controls each power block to minimize power consumption.
  • Page 15 4. Electrical specifications 4.2 Logic level specifications 4.2.1 Digital logic level specifications High Signal Name Type Unit BOOT_OK 0.45 1.35 RESET_IN -0.3 0.63 1.17 0.45 1.35 96H_END 0.45 1.35 ACC_ON_SLEEP 0.63 1.17 Table 6. Digital logic level specifications Copyright ⓒ. 2017. All Rights Reserved.
  • Page 16: Rf Specifications

    5. RF specifications 5.1 WCDMA 5.1.1 Receiver .- Bandwidth : 5MHz .- Frequency : 869MHz – 894MHz (B5), 1930MHz – 1990MHz (B2) .- RF to Baseband Direct conversion (Zero IF) .- Modulation method : QPSK, 16QAM .- Sensitivity : ≤-104dBm (BER = Under 0.1%) 5.1.2 Transmitter .- Frequency: 824MHz –...
  • Page 17 5. RF specifications 5.2.2 Transmitter .- Frequency: B2 (1850 MHz – 1910 MHz), B4 (1710 MHz – 1755 MHz),B5 (824 MHz – 849 MHz), B17 (704 MHz – 716MHz) .- Maximum RF Output : Power class3 , 20.3dBm ~ 25.7dBm .- Modulation method : QPSK and 16QAM .- Baseband to RF Direct conversion (Zero IF) Copyright ⓒ.
  • Page 18: Mechanical Specifications

    6. Mechanical specifications 6.1 Environment specifications .- Storage temp.: -40 ℃ - +85 ℃ .- Operating temp.: -20 ℃ - +70 ℃ (-20 ℃ - +70 ℃ : 3GPP specifications are satisfied -30 ℃ - -20 ℃, +70 ℃ - +80 ℃ : May cause performance degradation) .- Operating humidity: 80% (60℃) relative humidity Copyright ⓒ.
  • Page 19 6. Mechanical specifications 6.1 Mechanical dimensions 34 x 40.0 x 3.5 mm (L x W x T) Dimensions (Tolerance – width, length : TBD) Weight TBD grams(max.) Modem interface connector 12709HS-H40 (Manufacture vendor : YUNHO) KR15005-DD , KR15005-DG Modem antenna Connector (Plug) (Manufacture vendor : KET) Table 7.
  • Page 20: General Specifications

    7. General specifications 7.1 WCDMA B5 electrical specifications CHANNEL Test Freq TEST ITEM Spec. Test Temperature uency 4357 4400 4458 Normal, Temp L, Te Low, Mid, Maximum Output Power 20.3~25.7dBm PASS PASS PASS mp H High Normal, Temp L, Te Low, Mid, Frequency Error -195 ~ +195Hz...
  • Page 21 7. General specifications 7.2 WCDMA B2 electrical specifications CHANNEL Test Freq TEST ITEM Spec. Test Temperature uency 9662 9800 9938 Normal, Temp L, Te Low, Mid, Maximum Output Power 20.3~25.7dBm PASS PASS PASS mp H High Normal, Temp L, Te Low, Mid, Frequency Error -195 ~ +195Hz...
  • Page 22 7. General specifications 7.3 LTE B2 electrical specifications TX Channel 시험 항목 Spec. Test Temperature Frequency 18650 18900 19150 Maximum Output Power(class 3) 20.3~25.7dBm Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS Minimum Output Power -39dBm ↓ Normal, Temp L, Temp H Low, Mid, High PASS...
  • Page 23 7. General specifications 7.4 LTE B4 electrical specifications TX Channel 시험 항목 Spec. Test Temperature Frequency 20000 20175 20350 Maximum Output Power(class 3) 20.3~25.7dBm Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS Minimum Output Power -39dBm ↓ Normal, Temp L, Temp H Low, Mid, High PASS...
  • Page 24 7. General specifications 7.5 LTE B5 electrical specifications TX Channel 시험 항목 Spec. Test Temperature Frequency 20450 20525 20600 Maximum Output Power(class 3) 20.3~25.7dBm Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS Minimum Output Power -39dBm ↓ Normal, Temp L, Temp H Low, Mid, High PASS...
  • Page 25 7. General specifications 7.17 LTE B17 electrical specifications TX Channel 시험 항목 Spec. Test Temperature Frequency 23780 23790 23800 Maximum Output Power(class 3) 20.3~25.7dBm Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS Minimum Output Power -39dBm ↓ Normal, Temp L, Temp H Low, Mid, High PASS...
  • Page 26: Rfx Information

    8. RFx information The strength of the RF field produced by the wireless module or modules embedded in the TCU is well within all international RF exposure limits known at this time. Because the wireless modules embedded in the TCU emit less than the maximum amount of energy permitted in radio frequency safety standards and recommendations, the manufacturer believes these modules are safe for use.
  • Page 27: Approbation Fcc

    9. Approbation FCC This module complies with FCC/IC rules. FCC : Part 22, Part 24, Part 27 : RSS-130, RSS-132, RSS-133, RSS-139 Furthermore, this device complies with FCC/IC radiation exposure limits set forth for uncontrolled environments. This module must be installed and operated with minimum distance of 20 cm between the radiating element and the user.

Table of Contents