Reflow Soldering Curve; E72 Series - Ebyte E72-2G4M02S2B User Manual

Cc2640 2.4ghz ble4.1 smd wireless module
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Liquidous Temperature (TL)
Time(tL)Maintained Above(TL)
Peak temperature(Tp)
Aveage ramp-down rate(Tp to Tsmax)
Time 25℃ to peak temperature

9.2 Reflow soldering curve

10 E72 series

Model
IC
E72-2G4M23S1
CC2630
A
E72-2G4M05S1
CC2630
A
E72-2G4M02S2
CC2640
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Liquid phase temp
Time below liquid phase
Peak temp
Average ramp-down rate
Time to peak
temperature for 25℃
Frequency
Tx power
Hz
dBm
2.4G
23
2.4G
5
2.4G
2
60-90 sec
line
220-235℃
6℃/second max
6 minutes max
Air data
Distance
rate
km
bps
1.5
-
0.5
-
0.3
BLE 4.1
E72-2G4M02S2B User Manual
183℃
30-90 sec
230-250℃
6℃/second max
8 minutes max
Package
Size
form
mm
SMD
17.5 * 33.5
SMD
17.5 * 28.7
SMD
14 * 23
217℃
Antenna
PCB/IPEX
PCB/IPEX
PCB/IPEX
18

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