Production Guidance; Reflow Soldering Temperature - Ebyte E78 Series User Manual

Chengdu Ebyte Electronic Technology Co., Ltd
The base plate supplies power to the module through the serial port on the left in the picture above. Connect ST-LINK's
NRST pin and SWIM pin to the base plate to download the program. As shown below

4. Production guidance

4.1 Reflow soldering temperature

Profile Feature
Solder Paste
Preheat Temperature min （Tsmin）
Preheat temperature max (Tsmax)
Preheat Time (Tsmin to Tsmax)(ts)
Average ramp-up rate(Tsmax to Tp)
Liquidous Temperature (TL)
Time（tL）Maintained Above（TL）
Peak temperature（Tp）
Aveage ramp-down rate（Tp to Tsmax）
Time 25℃ to peak temperature
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Curve characteristics
Solder paste
Min preheating temp.
Max preheating temp.
Preheating time
Average ramp-up rate
Liquid phase temp.
Time below liquid
phase line
Peak temp
Average ramp-down
rate
Time to peak
temperature for 25℃
E78-400M22S1A User Manual
Sn-Pb Assembly Pb-Free Assembly
Sn63/Pb37 Sn96.5/Ag3/Cu0.5
100℃
150℃
60-120 sec
3℃/second max 3℃/second max
183℃
60-90 sec
220-235℃
6℃/second max 6℃/second max
6 minutes max 8 minutes max
150℃
200℃
60-120 sec
217℃
30-90 sec
230-250℃
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