Related Manuals for GOSUNCN WeLink ME3616
Summary of Contents for GOSUNCN WeLink ME3616
- Page 1 ME3616 ARDWARE EVELOPMENT UIDE Version: V1.2 Date: 2018-05-29 NB-IoT Module Website: www.gosuncnwelink.com E-mail: welink@gosuncn.com...
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Page 2: Revision History
Table below is a list of abbreviations involved in this document, as well as the English full names. Abbreviations Full Name 3GPP Third Generation Partnership Project Another name of DTE CHAP Challenge Handshake Authentication Protocol European Conformity CMOS Complementary Metal Oxide Semiconductor Data Communication Equipment Downlink All Rights reserved, No Spreading without GOSUNCN Permission... - Page 3 USIM Universal Subscriber Identity Module Unsolicited result code Logic High level of input voltage Logic Low level of input voltage Logic High level of output voltage Logic Low level of output voltage All Rights reserved, No Spreading without GOSUNCN Permission...
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Page 4: Safety Information
If not so, GOSUNCN does not take on any liability for customer failure to comply with these precautions. Full attention must be given to driving at all times in order to reduce the risk of an accident. Using a mobile while driving (even with a hands free kit) cause distraction and can lead to an accident. -
Page 5: Table Of Contents
TATUS NDICATOR 2.13. ADC I ....................................35 NTERFACE 2.14. GPIO I ....................................35 NTERFACE 2.15. WAKEUP_IN S ..................................36 IGNAL 2.16. WAKEUP_OUT S ................................... 37 IGNAL 2.17. USB I ....................................38 NTERFACE All Rights reserved, No Spreading without GOSUNCN Permission... - Page 6 7.3.6. Maintenance of defects ................................ 53 7.4. M ’ ..............................54 ODULE AKING EQUIREMENTS 7.4.1. Module’s Baking Environment ............................54 7.4.2. Baking device and operation procedure ........................54 7.4.3. Module Baking Conditions ..............................54 All Rights reserved, No Spreading without GOSUNCN Permission...
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Page 7: Tables
Table 4-3 RF Output power ......................42 Table 4-4 RF Receiving Sensitivity ....................43 Table 4-5 ESD characteristic ......................43 Table 6-1 Testing Standard ......................47 Table 6-2 Testing Environment ....................48 All Rights reserved, No Spreading without GOSUNCN Permission... - Page 8 Hardware Development Guide Table 6-3 Testing Instrument & Device..................48 Table 6-4 Reliability Features ....................... 48 Table 7-1 Baking parameters ....................... 50 Table 7-2 LCC module PAD’s steel mesh opening ................51 All Rights reserved, No Spreading without GOSUNCN Permission...
- Page 9 Figure 2-26 Connections of the SYS_STATE pin ................35 Figure 2-27 WAKEUP_IN input sequence ..................36 Figure 2-28 Connections of the WAKEUP_IN pin ................. 37 Figure 2-29 WAKEUP_OUT output sequence ................37 VIII All Rights reserved, No Spreading without GOSUNCN Permission...
- Page 10 Figure 7–1 Module Board’s Steel Mesh Diagram ................. 51 Figure 7–2 Material Module Pallet ....................52 Figure 7–3 Tape Reel Dimension ....................52 Figure 7–4 Module Furnace Temperature Curve Reference Diagram .......... 53 All Rights reserved, No Spreading without GOSUNCN Permission...
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Page 11: Product Overview
4- lines on main UART interface, Support RTS and CTS hardware flow control. Used for AT command, data transmission Debug UART interface: 2- lines on debug UART interface, can be used for software debug, firmware upgrade Antenna Interface Include main antenna AT Command GOSUNCN extended AT commands All Rights reserved, No Spreading without GOSUNCN Permission... -
Page 12: Function Diagram
--USIM card interface --SPI interface(master mode) --I2C interface --ADC interface --Status interface (LED) --GPIO USIM Power Flash& UART Management PSRAM Baseband GPIO Transceiver SYS_STATE MAIN_ANT Duplexer RF PA Switch Figure 1-1 System Connection Structure All Rights reserved, No Spreading without GOSUNCN Permission... -
Page 13: Application Interface
The following figure shows the pin assignment of the ME3616 module. PIN1 Figure 2-1 Pin Assignment Note： Keep all NC pins unconnected. 2.3. P ESCRIPTION The following table shows the IO Parameters Definition. All Rights reserved, No Spreading without GOSUNCN Permission... -
Page 14: Table 2-1 Io Parameters Definition
22,23,25,26,28,29,30 Ground POWRER_ON/OFF POWER_ON VBAT Power Turn on/off module Active low domain RESET VBAT Power Reset module Active low domain Status Indication SYS_STATE Indicate the module 1.8V Power There are 4 status: All Rights reserved, No Spreading without GOSUNCN Permission... - Page 15 NC I2C_SDA I2C serial data 1.8V Pull-up to 1.8V through external 2.2K resistance. If not used, NC SPI Interface（only support master mode） SPI_MISO SPI main input slave 1.8V If not used, NC All Rights reserved, No Spreading without GOSUNCN Permission...
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Page 16: Orking Mode
The UE will exit the PSM mode only when the TAU period request timer (T3412) times out or the UE has MO service to process The mode switch is shown in the figure below: All Rights reserved, No Spreading without GOSUNCN Permission... -
Page 17: Power Supply
100μF). Filter capacitors(10µF, 0.1µF, 33pF) need to be added to reduce interference. The capacitors should be placed close to the ME3616’s V_BAT pins. The following figure shows structure of the power supply. All Rights reserved, No Spreading without GOSUNCN Permission... -
Page 18: Reference Circuit Of Power Supply
REFERENCE DESIGN Table 2-5 VCC1V8_OUT pin deification Pin Name Pin NO. Description DC Characteristics Comment VCC1V8_OUT Provide 1.8V for 1.8V only used for level external circuit match ,left unconnected when not used All Rights reserved, No Spreading without GOSUNCN Permission... -
Page 19: Power On Scenario
The resistors in Figures below are only the recommended value and they need to adjust according to the actual situation. Power-on by dynatron, the circuit ① connect ON/OFF to high level to power-on the module, the circuit ② can connect ON/OFF to low level to power-on the module All Rights reserved, No Spreading without GOSUNCN Permission... - Page 20 ME3616 Hardware Development Guide All Rights reserved, No Spreading without GOSUNCN Permission...
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Page 21: Table 2-7 Power-On Time
When the module is in PSM mode, if you want to wake up module by yourself, you can only control it by POWER_ON&WAKEUP_IN pin, so we recommended connecting this pin to GPIO of MCU instead of connecting to ground. Table 2-7 Power-on Time Parameter Description Typical Unit The duration of the power on signal Second All Rights reserved, No Spreading without GOSUNCN Permission... -
Page 22: Turn Off Scenarios
There are two way to reset the module you can choose: Through AT command of “AT+ZRST” Reset the module through RESET pin When the software stops response, you can pulled down RESET pin(pin17) for 400ms to reset the module's All Rights reserved, No Spreading without GOSUNCN Permission... -
Page 23: Table 2-9 Definition Of Reset
Figure 2-10 reference circuit to reset module The RESET timing are shown in the table and figure below Table 2-10 Resetting timing Parameter Description Typical Unit Second the RESET process until the AT port can communicate spend All Rights reserved, No Spreading without GOSUNCN Permission... -
Page 24: Usim Interface
Power supply for USIM card USIM_DATA Data signal of USIM card USIM_CLK Clock signal of USIM card USIM_RST Reset signal of USIM card The following figure shows the reference design of USIM card. All Rights reserved, No Spreading without GOSUNCN Permission... -
Page 25: Design Considerations For Usim Card Holder
The pull-up resistor on USIM_DATA line can improve anti-jamming capability when long layout trace and sensitive occasion is applied. 2.10.2. D USIM C ESIGN ONSIDERATIONS FOR OLDER For 8-pin USIM card holder, it is recommended to use Molex 91228. Please visit http://www.molex.com for more information. All Rights reserved, No Spreading without GOSUNCN Permission... -
Page 26: Table 2-11 Pin Description Of Molex Usim Card Holder
USIM card power supply DETECT USIM card Detection Not defined, Connect to Ground For 6-pin USIM card holder, it is recommended to use Amphenol C707 10M006 512 2. Please visit http://www.amphenol.com for more information. All Rights reserved, No Spreading without GOSUNCN Permission... -
Page 27: Table 2-12 Pin Description Of Amphenol Usim Card Holder
Table 2-12 Pin Description of Amphenol USIM Card Holder Pin Name Pin NO. Function Ground Not connected DATA I/O USIM card data USIM card clock USIM card reset USIM card power supply All Rights reserved, No Spreading without GOSUNCN Permission... -
Page 28: Uart Interface
Receive data 2.11.1. UART CONNECTION Two normal connections for UART are shown in the figures below: 3-wire UART connection: (DCE) (DTE) Serial Port Serial Port UART_TXD UART_RXD UART_RTS UART_CTS UART_DTR UART_DCD RING UART_RI All Rights reserved, No Spreading without GOSUNCN Permission... -
Page 29: 2.11.2. Uart Level Match
We recommend to use Triode or IC for UART level match circuit. The pictures below are the recommended level switch circuit for TXD, RXD, CTS, RTS. Each pin recommends two kinds of circuit, and you can select any one if necessarily. All Rights reserved, No Spreading without GOSUNCN Permission... -
Page 30: Figure 2-18 Recommended Txd Circuit
ME3616 Hardware Development Guide Figure 2-18 Recommended TXD circuit All Rights reserved, No Spreading without GOSUNCN Permission... -
Page 31: Figure 2-19 Recommended Rxd Circuit
ME3616 Hardware Development Guide Figure 2-19 Recommended RXD circuit All Rights reserved, No Spreading without GOSUNCN Permission... -
Page 32: Figure 2-20 Recommended Rts Circuit
ME3616 Hardware Development Guide Figure 2-20 Recommended RTS circuit All Rights reserved, No Spreading without GOSUNCN Permission... -
Page 33: Use Ic For Level Switch
ME3616 Hardware Development Guide Figure 2-21 Recommended CTS circuit 2.11.3. U SE IC FOR LEVEL SWITCH All Rights reserved, No Spreading without GOSUNCN Permission... -
Page 34: Figure 2-22 Recommended 4-Wires Uart Level Switch Circuit
Debug UART interface Figure 2-24 Debug UART interface definication Comment Pin Name Pin NO. Description UART_DEBUG_TXD Data send,1.8V Required, please Reserve test point UART_DEBUG_RXD data receive,1.8V Required, please Reserve test point All Rights reserved, No Spreading without GOSUNCN Permission... -
Page 35: Network Status Indicator
The resistors R11, R12 and R7 in Figures below are only the recommended value and they need to adjust according to the actual situation. Consider the sensitive power consumption, we recommend that there is no need to connect this LED pin or control the LED status by command “AT+ZCONTLED” All Rights reserved, No Spreading without GOSUNCN Permission... -
Page 36: Adc Interface
2.14. GPIO I NTERFACE ME3616 Module provides 2 GPIO pins. Table 2-17 Pin Definition of GPIO Pin Name Pin NO. Description Comment GPIO1 1.8V power domain， General input/output GPIO2 1.8V power domain General input/output All Rights reserved, No Spreading without GOSUNCN Permission... -
Page 37: Ignal
Module status status Figure 2-27 WAKEUP_IN input sequence The resistors R44, R46 and R48 in Figure below are only the recommended value and they need to adjust according to the actual situation. All Rights reserved, No Spreading without GOSUNCN Permission... -
Page 38: Ignal
Figure 2-29 WAKEUP_OUT output sequence The resistors R45, R47 and R59 in Figure below are only the recommended value and they need to adjust according to the actual situation. Figure 2-30 Connections of the WAKEUP_OUT pin All Rights reserved, No Spreading without GOSUNCN Permission... -
Page 39: Usb Interface
GND via test points or to the standard pin header. We recommended to let the USB interface not connected(NC). Figure 2-31 USB interface connection All Rights reserved, No Spreading without GOSUNCN Permission... -
Page 40: Antenna Interface
It is wise to surround the PCB transmission line with ground, avoid having other signal tracks facing directly the antenna line track. Keep at least one layer of the PCB used only for the ground plane; and use this layer as reference ground plane for the All Rights reserved, No Spreading without GOSUNCN Permission... -
Page 41: Suggestions For Emc & Esd Design
Windows based PC running test software and RF test instruments with automatic test program. The main RF instruments are integrated RF test equipment, Spectrum Analyzer, Network Analyzer. The radio equipments, Relay Switch Unit and PC with automatic test software are communicated via GPIB interface. All Rights reserved, No Spreading without GOSUNCN Permission... -
Page 42: Figure 3-2 The Ota Test System Of Ctia
ME3616 Hardware Development Guide Figure 3-2 The OTA test system of CTIA All Rights reserved, No Spreading without GOSUNCN Permission... -
Page 43: Electrical, Reliability And Radio Characteristics
LTE FDD Band 3 23 ±2.7dBm 23.5 LTE FDD Band 5 23 ±2.7dBm 22.8 LTE FDD Band 8 23 ±2.7dBm 23.3 LTE FDD Band 20 23 ±2.7dBm 23.3 LTE FDD Band 28 23 ±2.7dBm 23.3 All Rights reserved, No Spreading without GOSUNCN Permission... -
Page 44: Rf Receiving Ensitivity
The following table shows the module electrostatics discharge characteristics. Table 4-5 ESD characteristic Tested Points Contact discharge Air Discharge Unit All antenna ±2 ±4 interfaces Other interfaces ±2 ±4 All Rights reserved, No Spreading without GOSUNCN Permission... -
Page 45: Mechanical Dimensions
Hardware Development Guide 5. M ECHANICAL IMENSIONS This chapter describes the mechanical dimensions of the module. All dimensions are measured in mm. 5.1. M ECHANICAL IMENSIONS OF THE ODULE Figure 5-1 ME3616 Top Dimensions（tolerance：±0.1mm） All Rights reserved, No Spreading without GOSUNCN Permission... -
Page 46: Figure 5-2 Me3616 Bottom Dimensions (Perspective View)
ME3616 Hardware Development Guide Figure 5-2 ME3616 Bottom Dimensions (perspective view) All Rights reserved, No Spreading without GOSUNCN Permission... -
Page 47: Recommended Package Size
Hardware Development Guide 5.2. R ECOMMENDED ACKAGE Figure 5-3 Recommended Package Size（Unit：mm） Note: In order to maintain the module, keep about 3mm between the module and other components in the host PCB. All Rights reserved, No Spreading without GOSUNCN Permission... -
Page 48: Related Test & Test Standard
WARNING: Table 6-2 lists the extreme working conditions for the Module. Using the Module beyond these conditions may result in permanent damage to the module. All Rights reserved, No Spreading without GOSUNCN Permission... -
Page 49: Reliability Testing Environment
High temperature & high humidity Temperature: +60°C GOSUNCN standard Humidity: 95% Duration: 48 hours High temperature storage Temperature: 85°C IEC 68-2-1 Ab Duration: 24 hours Low temperature storage Temperature: -40°C Duration: 24 hours IEC 68-2-2 Bb All Rights reserved, No Spreading without GOSUNCN Permission... - Page 50 ME3616 Hardware Development Guide All Rights reserved, No Spreading without GOSUNCN Permission...
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Page 51: Smt Process And Baking Guide
The thickness of steel mesh is 0.15mm or 0.18mm, but the thickness at the position of module pad can be increased to 0.18~0.20mm or the thickness of steel mesh is directly 0.18mm~0.20mm on main board. All Rights reserved, No Spreading without GOSUNCN Permission... -
Page 52: Module Board's Smt Process
1） SMT Tape Reel: The tape reels, which are suitable for SMT, have been made for most GOSUNCN modules. If the module has provided the tape reel itself and meets the SMT requirements, customers can directly use it for module SMT. -
Page 53: Figure 7-2 Material Module Pallet
Customers can select proper pressure based on their own situations to suppress the module paste as little as possible, in order to avoid the surface tension of the solder paste melts too much to drag the module during reflow. All Rights reserved, No Spreading without GOSUNCN Permission... -
Page 54: Module Soldering Reflow Curve
PCB during the reflow process. 7.3.6. M AINTENANCE OF DEFECTS If poor welding occurs to the module board and main board, e.g., pseudo soldering of the module board and main board, the All Rights reserved, No Spreading without GOSUNCN Permission... -
Page 55: Module ' S Baking Requirements
During the baking process, do not overlay the modules directly because it might cause damage to the module’s chipset. 7.4.3. M ODULE AKING ONDITIONS See the baking parameters in Table 7-1. All Rights reserved, No Spreading without GOSUNCN Permission...
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