Siemens ASIC SIM 1-2 Function Manual page 43

Manufacturing Notes
Caution 1
The ESD protection measures must always be adhered to for all electronic
components.
Caution 2
The SIM 1-2 is a component at risk of cracking that must be handled as such.
• Before processing the SIM 1-2, it must be subjected to a drying process if the
chip has been stored for more than 168 hours without being dry packed
(according to JEDEC J-STD-020C Moisture Sensitivity Level 3).
• The component must then by dried at 125 °C for 24 hours and processed within
48 hours. This drying may only be performed once due to the solderability of the
component (according to JEDEC J-STD-020C Moisture Sensitivity Level 3).
• The SIM 1-2 is approved for infrared reflow with the lead-free reflow profile
according to JEDEC JSTD-020C.
• The lead-free infrared reflow process must not exceed a maximum temperature
of 260 °C on the surface of the package and may be 260 °C for only three
seconds. Over a period of maximum 150 seconds, the temperature of the
package surface may exceed 217 °C (according JEDEC J-STD-020C).
• Lead finish: Sn
SIM 1-2
C79000-G8976-C215-01
Technical Specifications
43