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Item Description
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Screw driver
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1.
Unscrew the screws on part 1 ,and then remove part 1;
2.
Unscrew the screws on guiding set 2 ,and then remove guiding set 2;
3.
Unscrew the screws on heat sink 3,and then remove heat sink 3;
4.
Remove the heatsink 4 from pcb 5;
5.
Unscrew the screws on pcb 5 ,and then remove pcb 5;
6.
Remove film 6 from panel 8;
7.
Remove shielding finger 7 from panel 8.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
MF877-00
Template Revision A
Notes
Figure Treatments to the product
HPE instructions for this template are available at
Tool Size (if
applicable)
MF877-01
Quantity
of items
included
in product
2#
Page 2
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