Reflow Soldering Curve; Related Model - Ebyte E73-2G4M04S1B User Manual

Chengdu Ebyte Electronic Technology Co., Ltd.
Solder Paste
Preheat Temperature min （Tsmin）
Preheat temperature max (Tsmax)
Preheat Time (Tsmin to Tsmax)(ts)
Average ramp-up rate(Tsmax to Tp)
Liquidous Temperature (TL)
Time（tL）Maintained Above（TL） Time above liquidus
Peak temperature（Tp）
Aveage ramp-down rate（Tp to
Tsmax）
Time 25℃ to peak temperature

6.2 Reflow Soldering Curve

7. Related Model

Model Chip
E73-2G4M08S1C nRF52840
E73-2G4M04S1A nRF52810
Copyright ©2012–2018，Chengdu Ebyte Electronic Technology Co.,Ltd.
Solder paste
Minimum preheating temperature
Maximum preheating temperature
Preheating time
Average rising rate
Liquid phase temperature
Peak temperature
Average descent rate
Time of 25 ° C to peak temperature
Transmit
Frequency
power
Hz
dBm
2.4G 8
2.4G 4
manual
Sn63/Pb37
100℃
150℃
60-120 sec
3℃/second max
183℃
60-90 sec
220-235℃
6℃/second max
6 minutes max
Test
distance Air Data rate
km
0.1 BLE 4.2/5.0
0.1 BLE 4.2
E73-2G4M04S1B User
Sn96.5/Ag3/Cu0.5
150℃
200℃
60-120 sec
3℃/second max
217℃
30-90 sec
230-250℃
6℃/second max
8 minutes max
Anten
Size
Packaging
mm
13.0 * PCB/IP
SMD
18.0
PCB/IPEX 17.5 * PCB/IP
na
Type
X
10