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TABLE OF CONTENTS
1.
2.
................................................................... 6
3.
3-1. Disassembly Flow ........................................................... 7
3-2. Cabinet (Upper) Assy, Cabinet (Lower) .......................... 7
3-4. SWITCH Board ............................................................... 8
4.
5.
5-1. Printed Wiring Board - EGL Board - ............................ 12
5-3. Printed Wiring Board
- JACK Board (Component Side) - ................................ 14
5-4. Printed Wiring Board
- JACK Board (Conductor Side) - .................................. 15
5-5. Schematic Diagram - JACK Board - ............................. 16
5-6. Printed Wiring Board - SWITCH Board - .................... 17
5-7. Schematic Diagram - SWITCH Board - ....................... 18
6.
6-1. Cabinet (Upper) Section .................................................. 27
6-2. Cabinet (Upper) Assy Section ......................................... 28
6-3. Cabinet (Lower) Section .................................................. 29
6-4. Optical Pick-up Section (CDM-3325ERV) ..................... 30
7.
................................................ 4
............................. 9
........................... 13
.................................. 31
n
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 ˚C
during repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.
XP-ZR850
3
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